• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
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• pp.225-229
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• 2009

The front metal contact is one of the most important element influences in efficiency in the silicon solar cell. First of all selective of the material and formation method is important in metal contacts. Commercial solar cells with screen-printed contacts formed by using Ag paste process is simple relatively and mass production is easy. But it suffer from a low fill factor and a high shading loss because of high contact resistance. Besides Ag paste too expensive. because of depends income. This paper applied for Ni/Cu metallization replace for paste of screen printing front metal contact. Low cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the screen-printed Ag contacts. Ni has been proposed as a suitable silicide for the salicidation process and is expected to replace conventional silicides. Copper is a promising material for the electrical contacts in solar cells in terms of conductivity and cost. In experiments Ni/Cu metal contact applied same grid formation of screen-printed solar cell. And it has variation of different grid spacing. It was verified that the wide spacing of grid finger could increase the series resistance also the narrow spacing of grid finger also implies a grid with a higher density of grid fingers. Through different grid spacing found alteration of efficiency.

• 한국표면공학회지
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• 제49권1호
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• pp.54-61
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• 2016

Screen printing of commercially available Ag paste is the most widely used method for the front side metallization of Si solar cells. However, the metallization using Ag paste is expensive and needs high temperature annealing for reliable contact. Among many metallization schemes, Ni/Cu/Sn plating is one of the most promising methods due to low contact resistance and mass production, resulting in high efficiency and low production cost. Ni layer serves as a barrier which would prevent copper atoms from diffusion into the silicon substrate. However, Ni based schemes by electroless deposition usually have low thermal stability, and require high annealing process due to phosphorus content in the Ni based films. These problems can be resolved by adding W element in Ni-based film. In this study, Ni-W-P alloys were formed by electroless plating and properties of it such as sheet resistance, resistivity, specific contact resistivity, crystallinity, and morphology were investigated before and after annealing process by means of transmission line method (TLM), 4-point probe, X-ray diffraction (XRD), and Scanning Electron Microscopy (SEM).

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.82-82
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• 2015

Industrial crystalline silicon (c-Si) solar cells with using a screen printing technology share the global market over 90% and they will continue to be the same for at least the next decade. It seems that the $2^{nd}$ generation and the $3^{rd}$ generation technologies have not yet demonstrated competitiveness in terms of performance and cost. In 2014, new world record efficiency 25.6% (Area-$143.7cm^2$, Voc-0.740V, $Jsc-41.8mA/cm^2$, FF-0.827) was announced from Panasonic and its cell structure is Back Contact $HIT^*$ c-Si solar cell. Here, amorphous silicon passivated contacts were newly applied to back contact solar cell. On the other hand, 24.9% $TOPCon^{**}$ cell was announced from Fraunhofer ISE and its key technology is an excellent passivation quality applying tunnel oxide (<2 nm) between metal and silicon or emitter and base. As a result, to realize high efficiency, high functional technologies are quite required to overcome a theoretical limitation of c-Si solar cell efficiency. In this presentation, Si solar cell technology summarized in the International Technology Roadmap for Photovoltaics ($^{***}ITRPV$ 2014) is introduced, and the present status of R&D associated with various c-Si solar cell technologies will be reviewed. In addition, national R&D projects of c-Si solar cells to be performed by Korea University are shown briefly.

• 로봇학회논문지
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• 제15권2호
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• pp.107-114
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• 2020

In robotic harvesting, a gripper to manipulate the fruits needs to be attached to the robot system. We proposed a flexible robot gripper that can actively respond to the shape of an object such as fruits in the previous work. However, we found that there is a possibility of not being reliably gripped when the object slides during contact with a finger. In this paper, the improved gripper design is proposed to fundamentally solve the problems of the previous gripper. The position of the finger and the maximum closed position are changed, and the design improvement is performed to increase the grip stability by changing the installation angle of the link portion of the finger. Based on the improved design, a modified gripper is fabricated by 3-D printing, and then gripping experiments are performed on spherical object and fruit model object. It is shown that the gripper can stably grip the objects without excessive bending of the finger link of the gripper. The contact pressure between the finger and the surface of the object is measured, and it is verified that it is a sufficiently small pressure that does not cause damage to the fruit. Therefore, the proposed gripper is expected to be successfully applied in harvesting.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2009년도 춘계학술대회 논문집
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• pp.100-100
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• 2009

$TiO_2$ is widely being used as a semiconductor electrode for DSSC. Anti-recombination property and surface area of $TiO_2$ give an important influence to the DSSC efficiency. In this study, $TiO_2$ electrode was fabricated on FTO using screen printing method. Various overlayers were coated on them by dip coating in solution of saturated $Ba(NO_3)_2$, $Mg(NO_3)_2$ and $N_{2}O_{6}Sr$. They reduced the recombination of electrons from photo excited state of Ru dye. The atmospheric plasma treatment was applied to both the $TiO_2$ and each overlayer coated $TiO_2$ surfaces to improve contact ability with dye. We prepared four samples, one sample has bare $TiO_2$ surfaces to improve contact ability with dye. We prepared four samples, one sample has bare $TiO_2$ electrode and the other samples consist of each overlayer coated $TiO_2$ electrodes. We used XRD, FE-SEM, J-V, IPCE and EIS in order to investigate characteristic.

• 통합자연과학논문집
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• 제4권4호
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• pp.311-314
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• 2011

Application of self-assembled monolayers (SAMs) to the fabrication of organic thin film transistor has been recently reported very often since it can help to provide ohmic contact between films as well as to form simple and effective electrode pattern. Accordingly, quality of these ultra-thin films is becoming more imperative. In this study, in order to manufacture a high quality SAM pattern, a hydrophobic alkylsilane monolayer and a hydrophilic aminosilane monolayer were selectively coated on $SiO_2$ surface through the consecutive procedures of a micro-contact printing (${\mu}CP$) and dip-coating methods under extremely dry condition. On a SAM pattern cleaned with SC1 solution immediately after ${\mu}CP$, poly(3,4-ethylenedioxythiophene) (PEDOT) source and drain electrode array were very selectively and nicely vapour phase polymerized. On the other side, on a SC1-untreated SAM pattern, PEDOT array was very poorly polymerized. It strongly suggests that the SC1 cleaning process effectively removes unwanted contaminants on SAM pattern, thereby resulting in very selective growth of PEDOT electrode pattern.

• Macromolecular Research
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• 제17권8호
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• pp.568-574
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• 2009

We investigated the sintering and consolidation phenomena of silver nanoparticles under various thermal treatment conditions when they were patterned by a contact printing technique on polyimide substrate films. The sintering of metastable silver nanoparticles commenced at 180 $^{\circ}C$, where the point necks were formed at the contact points of the nanoparticles to reduce the overall surface area and the overall surface energy. As the temperature was increased up to 250 $^{\circ}C$, silver atoms diffused from the grain boundaries at the intersections and continued to deposit on the interior surface of the pores, thereby filling up the remaining space. When the consolidation temperature exceeded 270 $^{\circ}C$, the capillary force between the spherical silver particles and polyimide flat surface induced the permanent deformation of the polyimide films, leaving crater-shaped indentation marks. The bonding force between the patterned silver metal and polyimide substrate was greatly increased by the heat treatment temperature and the mechanical interlocking by the metal particle indentation.

• 한국전자통신학회논문지
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• 제8권12호
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• pp.1875-1882
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• 2013

마이크로 어레이 기술은 유전자 네트워크의 순서 와 게놈의 통합과 같은 많은 업적을 기여하고 있으며, 이러한 기술은 유전자 발현의 패턴을 조사하기 위한 수단 등으로 잘 확립 되어있다. DNA 마이크로배열은 Affymetric 칩을 이용하여 대량의 DNA 서열을 합성 할 수 있는데 기존의 DNA 어레이 스포팅에는 일반적으로 접촉방식과 압전전자 방법등 두가지 유형이 있다. 접촉방법은 유리 슬라이드 표면과 접촉하도록 스포팅핀을 사용하는데 이 방법은 표면 매트릭스의 손상이나 상처가 발생할 수 있어 단백질이 오염 되거나 특정 결합을 방해할 위험이 있다. 반면에 압전전자 방법은 대량 생산이 가능함에도 불구하고 결과를 인쇄할 분석기가 필요하므로 현재 실험실 내에서만 수행 가능한 실정이다. 본 논문에서 유리 슬라이드 표면에 닿지 않고 지속적으로 일관성 있게 스포팅이 가능하도록 하는 진보된 방법을 제시한다.

• 한국재료학회지
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• 제19권8호
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• pp.437-442
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• 2009

This paper describes an improved strategy for controlling the adhesion force using both the antiadhesion and adhesion layers for a successful large-area transfer process. An MPTMS (3-mercaptopropyltrimethoxysilane) monolayer as an adhesion layer for Au/Pd thin films was deposited on Si substrates by vapor self assembly monolayer (VSAM) method. Contact angle, surface energy, film thickness, friction force, and roughness were considered for finding the optimized conditions. The sputtered Au/Pd ($\sim$17 nm) layer on the PDMS stamp without the anti-adhesion layer showed poor transfer results due to the high adhesion between sputtered Au/Pd and PDMS. In order to reduce the adhesion between Au/Pd and PDMS, an anti-adhesion monolayer was coated on the PDMS stamp using FOTS (perfluorooctyltrichlorosilane) after $O_2$ plasma treatment. The transfer process with the anti-adhesion layer gave good transfer results over a large area (20 mm $\times$ 20 mm) without pattern loss or distortion. To investigate the applied pressure effect, the PDMS stamp was sandwiched after 90$^{\circ}$ rotation on the MPTMS-coated patterned Si substrate with 1-${\mu}m$ depth. The sputtered Au/Pd was transferred onto the contact area, making square metal patterns on the top of the patterned Si structures. Applying low pressure helped to remove voids and to make conformal contact; however, high pressure yielded irregular transfer results due to PDMS stamp deformation. One of key parameters to success of this transfer process is the controllability of the adhesion force between the stamp and the target substrate. This technique offers high reliability during the transfer process, which suggests a potential building method for future functional structures.

• 한국결정성장학회지
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• 제6권1호
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• pp.88-97
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• 1996

태양전지의 전극형성은 전지의 가격과 성능 그리고 시스댐의 신뢰성을 결정하는데 매우 중요한 변수이다. 기폰의 스크련 프린팅 기술은 전면전극에 냐쁜 영향을 미치는 여러가지 제약들을 가지고 었다. 전극함몰형 태양전지는 기존의 전극에서 발생하는 문제점을 극복하고 저가격 대량생산을 위해서 고안된 것이다. 본 논문에서는 무전해 도금방법을 사용하여 함몰형 전지의 전극을 형성하는 공정을 최적화함으로써 값싸고 재현성있게 전지를 제조할 수 있었다. 무전해 도금용액으로는 상엽적으로 사용되는 니켈, 구리, 은 용액을 사용하었으며, 전지의 효울 을 최고 18.8 %까지 얻었다. 이때 전지의 개방전압은 651 mV, 단락전류밀도는 37.1 mA/$\textrm{cm}^2$, 충실도는 77.8 % 었으며 배치에서 90 % 이상의 전지가 18 % 이상의 효율을 나타내었다.