• Journal of Korean Society of Forest Science
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• v.83 no.3
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• pp.322-330
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• 1994

The Universal Soil Loss Equation (USLE) has been widely used to predict long-term soil loss by incorporating several erosion factors, such as rainfall, soil, topography, and vegetation. This study is aimed to introduce the LISLE within geographic information system(GIS) environment. The Kwangneung Experimental Forest located in Kyongki Province was selected for the study area. Initially, twelve years of hourly rainfall records that were collected from 1982 to 1993 were processed to obtain the rainfall factor(R) value for the LISLE calculation. Soil survey map and topographic map of the study area were digitized and subsequent input values(K, L, S factors) were derived. The cover type and management factor (C) values were obtained from the classification of Landsat Thematic Mapper(CM) satellite imagery. All these input values were geographically registered over a common map coordinate with $25{\times}25m^2$ ground resolution. The USLE was calculated for every grid location by selecting necessary input values from the digital base maps. Once the LISLE was calculated, the resultant soil loss values(A) were represented by both numerical values and map format. Using GIS to run the LISLE, it is possible to pent out the exact locations where soil loss potential is high. In addition, this approach can be a very effective tool to monitor possible soil loss hazard under the situations of forest changes, such as conversion of forest lands to other uses, forest road construction, timber harvesting, and forest damages caused by fire, insect, and diseases.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.25 no.2
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• pp.202-210
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• 2015

Objectives: The purpose of this study was to examine clean room(C/R) structure, air conditioning and contamination control systems and to provide basic information for identifying a correlation between the semiconductor work environment and workers' disease. Methods: This study was conducted at 200 mm and 300 mm semiconductor wafer fabrication facilities. The C/R structure and air conditioning method were investigated using basic engineering data from documentation for C/R construction. Furthermore, contamination parameters such as airborne particles, temperature, humidity, acids, ammonia, organic compounds, and vibration in the C/R were based on the International Technology Roadmap for Semiconductors(ITRS). The properties of contamination control systems and the current status of monitoring of various contaminants in the C/R were investigated. Results: 200 mm and 300 mm wafer fabrication facilities were divided into fab(C/R) and sub fab(Plenum), and fab, clean sub fab and facility sub fab, respectively. Fresh air(FA) is supplied in the plenum or clean sub fab by the outdoor air handling unit system which purifies outdoor air. FA supply or contaminated indoor air ventilation rates in the 200 mm and 300 mm wafer fabrication facilities are approximately 10-25%. Furthermore, semiconductor clean rooms strictly controlled airborne particles(${\leq}1,000{\sharp}/ft^3$), temperature($23{\pm}0.5^{\circ}C$), humidity($45{\pm}5%$), air velocity(0.4 m/s), air change(60-80 cycles/hr), vibration(${\leq}1cm/s^2$), and differential pressure(atmospheric pressure$+1.0-2.5mmH_2O$) through air handling and contamination control systems. In addition, acids, alkali and ozone are managed at less than internal criteria by chemical filters. Conclusions: Semiconductor clean rooms can be a pleasant environment for workers as well as semiconductor devices. However, based on the precautionary principle, it may be necessary to continuously improve semiconductor processes and the work environment.