• Fire Science and Engineering
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• v.18 no.3
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• pp.103-107
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• 2004

Recently. the spark and the overheat due to in the conductor breaks have been the major causes of electrical fire in low voltage wiring. Also, because in these cases the current is a surge one, the losses and faults of a communication, a home appliances, a computer and a measuring instrument may occur. Especially, in such cases, we are very difficult to detect the condition of the conductor breaks. In this paper, we have developed an auxiliary control device, the electrical fire prevention control device (EFPCD), of an earth leakage breaker (ELB). And we can prevent the electrical fire caused by the spark and the overheat occurring in the conductor breaks with the EFPCD.

• Proceedings of the Korea Institute of Fire Science and Engineering Conference
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• 2004.11a
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• pp.275-279
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• 2004

• Journal of the Korea Safety Management & Science
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• v.12 no.4
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• pp.53-60
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• 2010

When a fire breaks out, it is difficult to find out the causes of the fire, because combustible things around fire scene are usually burnt away. Among many causes of fires are electronic wires, this thesis deal with the destroyed sheath of electronic wires caused by fire. It was studied with the use of measurement devices focusing on the distinctions of wires and conductors. This study especially emphasized the process of deterioration, burning pattern, and composition of electronic wire conductor. It also has a phenomenological approach to the distinctive cause of fire by some partial force. The fire prevention methods have been suggested through the analysing results of fire patterns. This study is expected to be a useful material for analyzing various electrical fires.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.738-742
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• 2005

Rapid Prototype has been used to design and Production of part in a variety of fields ; Car, Electronic products, Aviation, Heavy industry etc. Moreover development of hardware gave rise to use the method of Rapid Prototype more and more at high precision and complicated shapes. Expecially, to be using process of products that shapes of Micro-hole ; Cellular phones, Antennas, Jewels, Semi conductor cases. In case of Micro-shape, precision of the shape turns on various condition ; Laser size, Laminate height, scanning speed, overcure, viscosity of resin, etc. Sometimes breaks out the case that interner hole of shape is blocked by viscosity of resin. The phenomenon has solved easily to reduce viscosity of resin. But, in case of the method brings about the problem that strength goes down in actuality products hardening. This study on verify to change of shape of Micro-hole and makes the semiconductor case which has shape of Micro-hole by using resin of higher viscosity, scanning speed and overcure