• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2007-2010
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• 2008

Vanadium pentoxide ($V_2O_5$) powder was prepared and mixed with Molybdenum Oxides ($MoM_3$) to form Mo-doped and -undoped $VO_2$ films by a sol-gel method on graphite conductive substrates. X-Ray diffraction (XRD) and scanning electron microscopy (SEM) was used to investigate the chemical compositions and microstructures of the Mo-doped and -undoped $VO_2$ films. The variation of electrical resistance was measured as a function of temperature and stoichiometric composition between vanadium and molybdenum. In this study, it was found that Mo-doped and -undoped $VO_2$ shows the typical negative temperature coefficient (NTC) behavior. As the amount of the molybdenum increases, the electrical resistance of Modoped $VO_2$ film gets reduced under the transition temperature and a linear decrease in the transition temperature is observed. From these experimental results, we can conclude that the electrical resistance behavior with temperature change of $VO_2$ films can be utilized as a self-heating source with the electrical current flowing through the graphite substrate.

• 한국전기전자재료학회논문지
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• 제24권6호
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• pp.468-472
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• 2011

Conductive $SrMoO_3$ thin films were fabricated by RF magnetron sputtering with the powder-type sputtering target, and annealed for crystallization. When RTP (rapid thermal processing) in vacuum was applied, the fabricated thin films showed the mixed phases of $SrMoO_3$ and $SrMoO_4$, but $SrMoO_3$ phase could be promoted by the lowering of the working pressure during deposition. In order to eliminate $O_2$ gas during deposition and annealing, further lowering of the working pressure and furnace annealing in hydrogen atmosphere were tried. With the optimization of the deposition and annealing conditions, the thin film with nearly single-phase of $SrMoO_3$ was obtained, and it showed good electrical conduction properties with a low resistivity of $2.5{\times}10^{-3}{\Omega}{\cdot}cm$ at room temperature.

• 대한금속재료학회지
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• 제46권8호
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• pp.516-523
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• 2008

The effect of glass-frit size on microstructural evolution and electrical resistance of conductive silver paste was investigated. Silver paste was prepared by mixing 70 wt% commercial silver powder with $1.6{\mu}m$, 3 wt% Bi based glass-frit and 27 wt% organic vehicle. Two different sizes of glass-frit were obtained by ball-milling of commercial glass-frit ($3{\mu}m$) for 3 and 5 days, which had an average particle size of 1.0 and $0.5{\mu}m$. The smaller glass-frit was melt at low sintered temperature and rapidly spread between the silver particles, which is induced the dense networking among silver particles and strong adhesiveness to $Al_2O_3$ substrate. The silver film with smaller glass-frit sintered at $500^{\circ}C$ showed the small pore size and low porosity resulting in low electrical resistivity of $4{\mu}{\Omega}cm$.

• 한국분말재료학회지
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• 제24권5호
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• pp.395-399
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• 2017

Solder paste is widely used as a conductive adhesive in the electronics industry. In this paper, nano and microsized mixed lead-free solder powder (Sn-Ag-Cu) is used to manufacture solder paste. The purpose of this paper is to improve the storage stability using different types of solvents that are used in fabricating the solder paste. If a solvent of sole acetate is used, the nano sized solder powder and organic acid react and form a Sn-Ag-Cu malonate. These formed malonates create fatty acid soaps. The fatty acid soaps absorb the solvents and while the viscosity of the solder paste rises, the storage stability and reliability decrease. When ethylene glycol, a dihydric alcohol, is used the fatty acid soaps and ethylene glycol react, preventing the further creation of the fatty acid soaps. The prevention of gelation results in an improvement in the solder paste storage ability.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 춘계학술발표대회 논문집
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• pp.105-108
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• 2002

Materials, matrices mixed with various kinds of conductive or magnetic powder, such as ferrite, have been used as the electromagnetic wave absorbing ones, so called RAM(radar absorbing material). The structure that does not only have electromagnetic waves absorbing property like RAM but also supports loads is called RAS(radar absorbing structure). One of the existing manufacturing process of RAS is to compound with conductive powders the glass fiber-reinforced composite with good permeability and the ability to support loads. The process, however, causes a number of problems, such as the degradation in the mechanical properties of the composite, especially, interlamina shear strength. In this study, mechanical properties of glass fabric/epoxy composite containing 7wt% carbon black powders were measured and compared with pure glass fabric/epoxy composites.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1989년도 하계종합학술대회 논문집
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• pp.349-352
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• 1989

Poling piezoelectric ceramic-polymer composites with 0-3connectivity is difficult because of the high dielectric constant of most of the ferroelectric filler materials, and the high resistivity of the polymer matrix. To aid in poling this type of composite, conductivity of the polymer phase can be controlled by adding small amount of a semiconductor phase such as germanium, carbon or silicon. In this study, flexible piezoelectric composites of $PbTiO_3$ powder and Eccogel polymer were developed using small amounts of a semiconducting phase. These composites were poled rapidly at low voltages, resulting in properties superior to composites prepared without a conductive phase. The effect of addition of various conductive phase with different volume percentage on the dielectric and piezoelectric properties of the composite are discussed here.

• 전기화학회지
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• 제10권2호
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• pp.88-93
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• 2007

Nano-sized Sn particles were coated with Ni-P layer using an electroless deposition method and their anodic performance was tested for lithium secondary batteries. Uniform coating layers were obtained, of which the thickness was controlled by varying the $Ni^{2+}$ concentration in the plating bath. It was found that the Ni-P layer plays two important roles in improving the anodic performance of Sn powder electrode. First, it prevents the inter-particle aggregation between Sn particles during the charge/discharge process. Second, it provides an electrical conduction pathway to the Sn particles, which allows an electrode fabrication without an addition of conductive carbon. A pseudo-optimized sample showed a good cyclability and high capacity ($>400mAh\;g^{-1}$) even without conductive carbon loading.

• 한국세라믹학회지
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• 제47권4호
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• pp.319-324
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• 2010

Screen printable $MoSi_2$ paste and its ceramic sheet heater were investigated. $MoSi_2$ powder without $Mo_5Si_3$ second phase, which causes so-called pest phenomena, was synthesized by SHS technique. Over glaze was also developed for preventing pest phenomenon. The maximum temperature of $MoSi_2$ ceramic heater was over $500^{\circ}C$. After several heat up and cooling cycle, the $MoSi_2$ heater reveals pest phenomenon. Conductive $MoSi_2$ paste could be used in electronic ceramics, i.e., MLCC, LTCC, HTCC, and etc.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2023년도 가을학술발표대회논문집
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• pp.35-36
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• 2023

In this study, the hydration characteristics of conductive grout materials for each binder were investigated using XRD, and as a result of the experiment, the specimen with UFFA consumed more Ca(OH)₂ than the specimen with other binders, which is judged to have activated the pozzolanic reaction of UFFA, a high powder.

• Korean Chemical Engineering Research
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• 제54권1호
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• pp.44-51
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• 2016

전도성 물질인 철 입자(iron particles)를 절연체로 코팅하여 제작한 압분자심(powder core)은 비저항이 작기 때문에 고주파 영역에서 와전류 손실이 크다. 이 결함을 해결하기 위해서는 압분자심의 비저항을 증가시킬 필요가 있다. 이 연구에서는 압분자심의 비저항을 증가시키기 위하여 유성볼밀을 사용하여 전기전도성 철 입자에 산화제2구리를 코팅하였다. 반응표면분석법을 사용하여 코팅변수를 최적화하였다. 최적화 시 인자는 CuO 질량분율, 밀 회전 수, 코팅시간, 볼 크기, 볼 질량, 시료 질량이며, 반응변수는 비저항이었다. 6인자-일부요인배치법에 의하면 주된 인자는 CuO 질량분율, 밀 회전 수, 코팅시간이었다. 3-인자 완전요인배치법과 최대경사법을 사용하여 3개 인자의 수준을 선정하였다. 최대경사법을 사용하여 최고의 비저항을 갖는 영역에 접근하였다. 최종적으로 Box-Behnken법을 사용하여 스크린한 인자들의 반응표면을 분석하였다. Box-Behnken법 결과에 의하면 CuO 질량분율과 밀 회전 수가 코팅공정 효율에 영향을 주는 주요 인자이었다. CuO 질량분율이 증가함에 따라 비저항은 증가하였다. 그에 반해서 밀 회전 수가 감소함에 따라 비저항은 증가하였다. 코팅공정을 최적화한 모델로부터 계산한 예측값과 실험값과는 통계적으로 유의하게 일치하였다($Adj-R^2=0.944$). 비저항의 최고값을 갖는 코팅조건은 CuO 질량분율은 0.4, 밀 회전 수는 200 rpm, 코팅시간은 15분이었다. 이 조건에서 코팅한 정제의 비저항 측정값은 $530k{\Omega}{\cdot}cm$이었다.