• 한국안전학회지
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• 제28권3호
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• pp.63-68
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• 2013

This paper is aimed to make an analysis on characteristics of the parallel arc waveform and RMS of current at the electrical tracking state by conductive powder. In order to achieve the goal in this paper, field state investigation at metal processing companies in Chung-Nam province area was conducted. With the field state investigation, conductive powder were collected from metal processing companies. By experiment on electrical connector(breaker, connector) over which the conductive powder were scattered, arc waveform and RMS of current were measured. The measured waveform and RMS(root-mean-square) of current were analyzed to describe characteristics and patterns of electrical arc by the conductive powder. It was proved that conductive powder on electrical connector can flow electrical current enough to make electrical fire with high thermal energy. Also the change of sine waveform and RMS of current can be used to find out relationship between electrical fire and fault signal by conductive powder. The results obtained in this paper will be very helpful for the prevention of electrical fires occurred at the metal processing companies.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.371-374
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• 2007

A method for metal nano powder imprinting is proposed as a patterning process for conductive tracks that is inexpensive and scalable down to the nanoscale. Conductive tracks with line widths of $0.5{\sim}20{\mu}m$ were fabricated using this method. The processing conditions were optimized to avoid various types of defects, and to increase the degree of sintering and electric conductivity of the imprinted conductive tracks. The mean electric resistivity of the conductive tracks imprinted under optimum conditions was $8.95{\mu}{\Omega}{\cdot}cm$, which is in the range required for practical applications.

• 한국분말재료학회지
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• 제25권4호
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• pp.291-295
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• 2018

A conductive additive is prepared by dispersing multi-walled carbon nanotubes (MWCNTs) on Cu powder by mechanical milling and is distributed in epoxy to enhance its electrical conductivity. During milling, the MWCNTs are dispersed and partially embedded on the surface of the Cu powder to provide electrically conductive pathways within the epoxy-based composite. The degree of dispersion of the MWCNTs is controlled by varying the milling medium and the milling time. The MWCNTs are found to be more homogeneously dispersed when solvents (particularly, non-polar solvent, i.e., NMP) are used. MWCNTs gradually disperse on the surface of Cu powder because of the plastic deformation of the ductile Cu powder. However, long-time milling is found to destroy the molecular structure of MWCNTs, instead of effectively dispersing the MWCNTs more uniformly. Thus, the epoxy composite film fabricated in this study exhibits a higher electrical conductivity than 1.1 S/cm.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1076-1077
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• 2006

Conductive pastes consist of conductive fillers( Au, Ag, Ni, Cu etc.), organic binders, solvents and additives. Meanwhile, there are some metal powders such as copper, nickel etc that are used for pastes which have serious surface corrosion problems. This problem leads to change of the color and decrease in conductivity and affect storage stability of conductive pastes. By using silane coupling agent and dispersion agent, we can ensure both the corrosion stability and long term storage stability, and enhance the high performance electrical and mechanical properties of EMI shielding silicone sealant.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2004년도 춘계학술발표대회 논문집
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• pp.147-150
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• 2004

Graphite reinforced conductive polymer composites were fabricated by the compression molding technique. Graphite powder (conductive filler) was mixed with an epoxy resin to impart electrical property in composites. The ratio of graphite powder was varied to investigate electrical property of cured conductive composites. In this study, graphite filled conductive polymer composites with high filler loadings$(>60wt.\%)$ were manufactured to accomplish high electrical conductivity(> 100S/cm). Graphite powder increase electrical conductivity of composites by direct physical contact between particles. While high filler loadings are needed to attain good electrical property, the composites becomes brittle. So the ratio of filler to epoxy was varied to optimize of cured composites. The optimum molding pressure according to filler was proposed experimentally.

• ETRI Journal
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• 제32권3호
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• pp.414-421
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• 2010

The interconnection mechanisms of a smart anisotropic conductive adhesive (ACA) during processing have been characterized. For an understanding of chemorheological mechanisms between the fluxing polymer and solder powder, a thermal analysis as well as solder wetting and coalescence experiments were conducted. The compatibility between the viscosity of the fluxing polymer and melting temperature of solder was characterized to optimize the processing cycle. A fluxing agent was also used to remove the oxide layer performed on the surface of the solder. Based on these chemorheological phenomena of the fluxing polymer and solder, an optimum polymer system and its processing cycle were designed for high performance and reliability in an electrical interconnection system. In the present research, a bonding mechanism of the smart ACA with a polymer spacer ball to control the gap between both substrates is newly proposed and investigated. The solder powder was used as a conductive material instead of polymer-based spherical conductive particles in a conventional anisotropic conductive film.

• International Journal of Precision Engineering and Manufacturing
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• 제9권3호
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• pp.22-26
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• 2008

The use of electrical discharge machining (EDM) for micro-machining applications requires particular attention to the machined surface roughness and discharge gap distance, as these factors affect the geometrical accuracy of micro-parts. Previous studies of conventional EDM have shown that selected types of semi-conductive and non-conductive powder suspended in the dielectric reduced the surface roughness while ensuring a limited increase in the gap distance. Based on this, an extension of the technique to micro-EDM was studied Such work is necessary since the introduction of nanopowders suspended in the dielectric is not well understood. The experimental results showed that a statistically significant reduction in the surface roughness value was achieved at particular concentrations of the powder additives, depending on the powder material and the machining input energy setting. The average reduction in surface roughness using a powder suspended dielectric was between 14-24% of the average surface roughness generated using a pure dielectric. Furthermore, when these additive concentrations were used for machining, no adverse increase in the gap distance was observed.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2003년도 춘계학술발표대회 논문집
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• pp.27-30
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• 2003

In order to apply fracture detection we fabricated the CP-FRP using carbon-powder and analyzed conductive mechanism of it. The composites showed lower initial resistance as the carbon powder and amount of glass fiber(TEX) was used much more. When those are compared with each other that before and after bending test, the more cracks observed in matrix after bending test. We become to know that the conductivity of the composites depends on percolation structure of carbon powder.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.721-722
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• 2008

• 한국분말재료학회지
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• 제23권5호
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• pp.358-363
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• 2016

Noncontact direct-printed conductive silver patterns with an enhanced electrical resistivity are fabricated using a silver ink with a mixture of silver nanoparticles and nanoplates. The microstructure and electrical resistivity of the silver pattern are systematically investigated as a function of the mixing ratio of the nanoparticles and nanoplates. The pattern, which is fabricated using a mixture with a mixing ratio of 3(nanoparticles):7(nanoplates) and sintered at $200^{\circ}C$ shows a highly dense and well-sintered microstructure and has a resistivity of $7.60{\mu}{\Omega}{\cdot}cm$. This originates a mutual synergistic effect through a combination of the sinterability of the nanoparticles and the packing ability of the nanoplates. This is a conductive material that can be used to fabricate noncontact direct-printed conductive patterns with excellent electrical conductivity for various flexible electronics applications, including solar cells, displays, RFIDs, and sensors.