• 제목/요약/키워드: Conductive material

검색결과 749건 처리시간 0.039초

양친매성 다중층막의 전기적 도전성 및 전기적 특성 (The Electrical Conductivity and Electrochemical Characteristics of Amphiphilic Milecules Multilayer Film confined with Hetero Type)

  • 최인희;박수길;임기조;이주성
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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    • pp.269-272
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    • 1996
  • The electrochemical behavior of Ru complex and PD complex monolayer, deposited on conductive substrate by the Langmuir-Blodgett(LB) technique as monolayer and multilayer, has been studied by cyclic voltammetry. Monolayer films show stable reversible state. Atomic resolution imaging of LB highly-conductive, environmently stable organic films has been obtained by atomic force microscopy (AFM) showing their closely packed structure,

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YSZ/Ni-Cr 저항 발열 복합용사피막의 특성 (Characteristics of plasma sprayed composite YSZ/Ni-Cr resistant heating coatings)

  • 김병수;박경채;김태형;양병모
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2003년도 춘계학술발표대회 개요집
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    • pp.111-113
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    • 2003
  • The existing heating unit is indirect-heating method that make use or the nichrome wire or halogen lamp. The indirect-heating method has the demerits of long warming time, high power consumption and many organization parts. In this study, the heating unit of direct-heating method manufactured as being the thermal spray coating of conductive heating material on the surface of heating unit in order to improve the demerits of indirect-heating method. And YSZ added Ni-20Cr that had moderate electrical resistivity was chosen of the conductive heating material.

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스마트 윈도우용 리들 전도성 전해질 개발 (Development of Lithium Conductive Polymer Electrolyte for Smart Windows)

  • 박태성;백희원;진교원;김영호;조봉희
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1997년도 추계학술대회 논문집
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    • pp.262-265
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    • 1997
  • Various polymeric electrolytes were prepared from PEG, PEO and PMMA with LiClO$_4$ to develop lithium conductive electrolytes for smart windows. The complementary electrochromic devices were fabricated with these electrolytes involving cathodically coloring WO$_3$ and anodically coloring V$_2$O$\sub$5/ thin films. The performance of electrochromic device with PMMA/LiCLO$_4$ electrolyte was found to be excellent

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LCD Driver IC Assembly Technologies & Status

  • Shen, Geng-shin
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 International Symposium
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    • pp.21-30
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    • 2002
  • According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

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Yttrium-doped and Conductive Polymer-Coated High Nickel Layered Cathode Material with Enhanced Structural Stability

  • Shin, Ji-Woong;Lee, Seon-Jin;Nam, Yun-Chae;Son, Jong-Tae
    • Journal of Electrochemical Science and Technology
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    • 제12권2호
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    • pp.272-278
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    • 2021
  • In this study, high nickel layered LiNi0.8Co0.1Mn0.1O2 cathode materials for lithium-ion batteries were modified by yttrium doping and poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS) coating. The effects of yttrium doping and PEDOT:PSS coating on the structural and electrochemical properties of the LiNi0.8Co0.1Mn0.1O2 cathode material were investigated and compared. The substitution of nickel with an electrochemically inert yttrium was confirmed to be successful in stabilizing the layered structure framework. Moreover, coating the surfaces of the LiNi0.8Co0.1Mn0.1O2 particles with a conductive polymer, PEDOT:PSS, improved the capacity retention, thermal stability, and impedance of the cathode material by increasing its ionic and electric conductivities.

J 적분을 이용한 압전세라믹의 절연파괴 해석 (Breakdown Analysis of Piezoelectric Ceramics Using J Integral)

  • ;김유환;범현규
    • 한국정밀공학회지
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    • 제26권1호
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    • pp.105-111
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    • 2009
  • Dielectric breakdown in piezoelectric ceramics is analyzed by using the three dimensional J integral. The J integral is shown to be a path-independent surface integral for a conductive tubular channel in a piezoelectric material. J integrals are also numerically calculated for conductive defects and tubular channels in piezoelectric ceramics through finite element analysis.

DNA를 형틀로 이용한 전도성 Polypyrrole Nanowire의 제작 연구 (Studies on Conductive Polypyrrole Nanowires Fabricated with DNA templates)

  • 문학기;노용한
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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    • pp.178-179
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    • 2006
  • 나노 크기를 가지는 DNA 분자를 template로 사용하여 전도성 고분자의 일종인 polypyrrole nanowire를 합성하였다. 본 논문에서 합성된 polypyrrole nanowire는 단량체인 pyrrole과 산화제와의 화학적인 반응에 의해 만들어졌다. 먼저 DNA 분자를 APTES(3-aminopropyltriethoxysilane) modified Si surface 위에 정렬한다. 그리고 이 기판을 농도를 달리한 pyrrole solution에서 incubationn한다. 마지막으로 APS (ammonium persulfate)와 반응시켜 conductive nanowire를 합성하였다. SEM을 이용하여 silicon 기판위에 1차원적으로 정렬된 나노 크기를 가지는 polypyrrole nanowire를 관찰할수 있었다. 그리고 pyrrole의 농도에 따라 nanowire의 uniformity를 조절할 수 있었다.

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카본 도포에 따른 Cu-Epoxy 접촉면에서 발생하는 크랙방지에 관한 연구 (A Study on the Prevention of Crack Generated in Interface Cu and Epoxy with Painting of Carbon)

  • 송재주;김성훈;황종선;박종광;한병성
    • 한국전기전자재료학회논문지
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    • 제14권7호
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    • pp.578-583
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    • 2001
  • The bushing for high voltage and large and power should endure weight of itself and force of pushing from contact with circuit breaker. Like this, epoxy mold bushing has to be strong without fault. However, the external circumstances and internal factors was caused by partial discharge, flashover and dielectric breakdown. Therefore, to remove external factor of defect and to prevent the internal cracks and cavity generated from the contraction on interface of Cu-Epoxy, we should form semi-conductive layer on Cu bar by carbon. Then, the PD properties and the insulation qualities of epoxy mold type bushing was able to improved by roles of cushions for the direction of diameter and by effects fo natural sliding like as separated from conductor for the direction of length. So, in this work, we could prove the method of semi-conductive layer in making the long conductor.

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