• 한국전기전자재료학회논문지
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• 제29권1호
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• pp.50-57
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• 2016

Transmission equipment is mainly used for the XLPE (cross-linked polyethylene) insulation cable for ultra high voltage power to minimize power loss. The experiment examined the partial discharge characteristics according to the insertion of the bar electrode and needle electrode into the XLPE specimen and the air voids. XLPE insulation cable manufactured by T. company and tungsten electrode material by K. company were used for specimens, by adhering conductive tape on the semi-conductive material of the lower electrode of XLPE specimen with the dimension of $16{\times}40{\times}30$ [mm] was used as negative electrode. In order to investigate the PD with ${\phi}$-q-n of XLPE specimen according to the electrode shape and the size of air voids. we examined the PD by varying the voltage after applying voltage of 3~20 kV on the electrode. Therefore, it was confirmed from the result of PD characteristics of specimen that the larger the air void than the gap between electrode (+) and electrode(-), the larger effect on the discharge when the bar electrode and needle electrode inserted into XLPE, and the closer the distance between the insulation and the needle electrode, the faster insulation breakdown.

• Advances in aircraft and spacecraft science
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• 제4권6호
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• pp.711-727
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• 2017

This article is concerned with a two-dimensional problem of micropolar generalized thermoelasticity for a half-space whose surface is traction-free and the conductive temperature at the surface of the half-space is known. Theory of two-temperature generalized thermoelasticity with phase lags using the normal mode analysis is used to solve the present problem. The formulas of conductive and mechanical temperatures, displacement, micro-rotation, stresses and couple stresses are obtained. The considered quantities are illustrated graphically and their behaviors are discussed with suitable comparisons. The present results are compared with those obtained according to one temperature theory. It is concluded that both conductive heat wave and thermodynamical heat wave should be separated. The two-temperature theory describes the behavior of particles of elastic body more real than one-temperature theory.

• 한국정밀공학회지
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• 제17권2호
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• pp.130-136
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• 2000

Generally, the build-up printed circuit board manufactured by the sequential process with etching, plating, drilling etc. requires many types of equipments and lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing prototype in the developing stage. In this study, we introduce a screen printing technology to prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as the formation of liquid resin thin layer, the solidification by UV/IR light, and via filling with conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with to the conventional process.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.474-475
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• 2009

As a substitute of ITO material, carbon nanotube (CNT) is widely studied for transparent conductive film (TCF). Current sheet resistance of CNT-TCF is about 100 ${\Omega}$/sq at 80% transmittance. But CNT-TCF performance in manufacturable level is about 500 ${\Omega}$/sq at 83% based on the Topnanosys Co's result. Therefore, critical issue in CNT-TCF research is to reduce the sheet resistance with manufacturing reliability. In this report, recent developments using CNT-TCF are introduced. Touch panel, transparent LED signboard, transparent speaker and transparent heater are representative examples. Also I describe the future issues and prospect of CNT-TCF for the flexible display.

• 한국건축시공학회지
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• 제16권1호
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• pp.25-34
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• 2016

부도체로 알려져 있는 기존의 콘크리트에 전기 전도성 재료를 혼입하여 발열 콘크리트로서 개발하려는 연구가 90년대 이후 진행되어 왔다. 하지만 콘크리트 시험체의 발열 재현성 확보가 어려워 활발한 연구가 이루어지지 못했다. 이에 따라 본 연구에서는 융설용 재료로써 활용 가능한 발열 콘크리트 개발을 목적으로, 흑연, 금속분말, 혼화제를 혼입한 시멘트 페이스트 및 모르타르를 제작하여 $-2^{\circ}C$의 저온환경에서의 발열특성과 재현성을 평가하였다. 또한 미세화학분석을 통해 발현 재현성의 원인을 규명하고자 하였다. 실험 결과, 흑연과 고성능 AE감수제를 혼입한 시험체가 가장 우수한 발열 성능 및 재현 가능성을 보였다. 이에 따른 미세화학분석 결과, 고성능 AE 감수제 내의 폴리머 혹은 메타크릴산 성분이 흑연과 전기화학적 반응을 일으켜 발열 재현성능을 부여한 것으로 판단된다.

• 한국전기전자재료학회논문지
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• 제28권8호
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• pp.544-549
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• 2015

Since LEDs (light emitting diodes) have many advantages as a light source in vehicle headlamp, such as good reliability, energy and space saving, and flexible headlamp design. On the other hand, the dependence of its performance and life on temperature have great influence on its practical use. In this study, design and fabrication of heat sink for vehicle LED headlamp were performed using thermally-conductive plastics. This study focused on the effective heat sink structure with limited space in the vehicle LED headlamp. We designed two different prototype of heat sink by thermal simulation using SolidWorks program, which had excellent temperature characteristics. The two different prototype of heat sink were fabricated by injection molding with thermally-conductive plastics. The results showed that LED $T_j$ (junction temperature) of sample B (model 1) and sample C (model 1, 2) was below then $165^{\circ}C$ when applying the thermally-conductive plastics in heat sink of vehicle LED headlamp.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.154-154
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• 2008

Although the screen printing technology using photosensitive carbon nanotube (CNT) paste has many advantages such as low cost, simple process, uniform emission, and capability of mass production, the CNT paste needs to be improved further in CNT dispersion, printability, adhesion, electrical conductivity, population of CNT emitters, etc. Ball milling has been frequently employed to prepare the CNT paste as ball milling can mix its ingredients very well and easily cut the long, entangled CNTs. This study carried out a parametric approach to fabricating the CNT paste in terms of low-energy ball milling and a paste composition. Field emission properties of the CNT paste was characterized with CNT dispersion and electrical conductivity which were measured by a UV-Vis spectrophotometer and a 4-point probe method, respectively. Main variables in formulating the CNT paste include a length of milling time, and amounts of CNTs and conductive inorganic fillers. In particular, we varied not only the contents of conductive fillers but also used two different sizes of filler particles of ${\mu}m$ and nm ranges. Among many variations of conductive fillers, the best field emission characteristics occurred at the 5 wt% fillers with the mixing ratio of 3:1 for ${\mu}m$-and nm-sizes. The amount and size of fillers has a great effect on the morphology, processing stability, and field emission characteristics of CNT emitter dots. The addition a small amount of nm-size fillers considerably improved the field emission characteristics of the photosensitive CNT paste.

• 마이크로전자및패키징학회지
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• 제6권2호
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.106-106
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• 2009

Al-doped ZnO (AZO) thin films were grown on glass substrates by co-sputtering at room temperature. We made ZnO and Al target and ZnO:Al film is deposited with sputter which has two RF gun source. The Al content was controlled by varying Al RF power and effect of Al contents on the properties of ZnO:Al film was investigated. Crystallinity and orientation of the ZnO:Al films were investigated by X-ray diffraction (XRD), surface morphology of the ZnO:Al films was observed by atomic force microscope. Electrical properties of the ZnO:Al films were measured at room temperature by van der Pauw method and hall measurement. Optrical properties of ZnO:Al films were measured by UV-vis-NIR spectrometer.

• 한국전기전자재료학회논문지
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• 제27권9호
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• pp.576-581
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• 2014

This study used the heat conductive silicone rubber sample of 0.95 mm thickness to research the properties of current by changing voltage. When the 1, 10, 30, 60, and 90 minute have passed, the running current has been measured through the applied voltage range of 200 V~800 V on setting temperature of $110^{\circ}C{\sim}170^{\circ}C$. As the temperature increased in applied voltage of 800 V, so did the current value according to time in proportion to the increasing temperature. In an analysis of FT-IR (fourier transform infrared) spectrum, the hydroxyl radicals group(O-H) was created by effects of the hydrogen that methyl group is eliminated by addition of the cross-linking agent peroxide.