• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.25-29
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• 2009

High temperature high humidity and thermal shock reliability tests were performed for the board level COB(chip-on-board) flip chip packages using self-formulated and commercial NCPs(non-conductive pastes) to ensure the performance of NCP flip chip packages. It was considered that the more smaller fused silica filler in prototype NCPs is more favorable for high temperature high humidity reliability. The failure of NCP interconnection was affected by the expansion of epoxy due to moisture absorption rather than the fatigue due to thermal stress. It was considered that the NCP having more higher adhesive strength seems to be more favorable to increase the thermal shock reliability.

• Composites Research
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• v.35 no.3
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• pp.175-181
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• 2022

Due to the increasing number of wireless communication devices in mmWave frequency bands, there is a high demand for electromagnetic interference (EMI) shielding and heat dissipating materials to avoid device malfunctions. This paper proposes an EMI shielding composite film with a high heat dissipation characteristic. To achieve this, a conductive grid is integrated with a polymer-based composite layer including magnetic and heat dissipating filler materials. A high shielding effectiveness (>40 dB), low reflection shielding effectiveness (<3 dB), high thermal conductivity (>10 W/m·K), thin thickness (<500 ㎛) are simultaneously achieved with a tailored design of composite layer compositions and grid geometries in 5G communication band of 26.5 GHz.

• Applied Chemistry for Engineering
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• v.33 no.4
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• pp.381-385
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• 2022

It is very important to secure the adhesion durability between the base film and the conductive paste for the development of a sensor for detecting hazardous chemicals. In this study, an ester binder was used to improve the adhesive properties which can be a problem when applying the sensor to the cross cut 0B or 1B grade. This problem was found while evaluating the adhesive properties by coating the polyaniline/graphene nano plate (GNP) paste on the polyethylene terephthalate (PET) film. When 10 wt% or more of the ester-based binder was added, the cross cut grade to which the sensor can be applied was 3B or higher. It was confirmed that the excessive addition of the binder may affect the electrical properties of the conductive paste and actually decrease the reactivity to sulfuric acid. To improve the electrical property, a carbon black (CB) content was varied resulting in the optimum electrical property observed at 2 wt% of CB.

• Advances in materials Research
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• v.13 no.3
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• pp.221-232
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• 2024

Waste tire management and recycling have grown to be significant issues because they bring up a global environmental concern. Thus, turning recycled waste tires into useful products may help tackle the environmental issue. This research aims to study and compare the effect of recycled carbon black (rCB) and commercial carbon black (CB) at certain 15 vol. % of filler loading on the mechanical, thermal, morphology and electrical properties of epoxy/CB composites. For this project, epoxy resin, diethyltoluenediamine (DETDA), recovered carbon black (rCB) and commercial carbon black (CB) graded N330, N550, N660 and N774 were mixed and compared accordingly to the formulation determined. The CB content was dispersed in the epoxy matrix using the mechanical mixing technique. The distribution and dispersion of CB in the epoxy matrix affect the characteristics of the conductive composites. rCB content at 15 vol% was selected at fixed content for comparison purposes due to the optimum value in electrical conductivity results. The flexural strength results followed the sequence of rCB>N774>N660>N550>N330. As for electrical conductivity results, epoxy/N330 exhibited the highest conductivity value, while the others achieved a magnitude of X10^-3 due to the highest external surface area of N330. In terms of thermal stability, epoxy/N330 and epoxy/N774 were slightly more stable than epoxy/rCB.

• The Korean Journal of Ceramics
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• v.6 no.2
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• pp.168-171
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• 2000

VO$_2$ceramics exhibiting a negative temperature coefficient (NTC) of resistivity have been widely used as temperature dependence resistors. The NTC effect similar to $VO_2$ceramics was observed when a low-thermal-expansion ceramic matrix was loaded near the percolation threshold with conductive metal particles. The resistivity in a composite made from silica glass and 20 vol% Ag filler suddenly decreased from $10^{-7}$ to $10^3\;\Omega$cm at about $300^{\circ}C$.

• Carbon letters
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• v.13 no.1
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• pp.51-55
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• 2012

In this work, expanded graphite (EG)-reinforced poly(ethylene terephthalate) (PET) nanocomposites were prepared by the melt mixing method and the content of the EG was fixed as 2 wt%. The effect of multi-walled carbon nanotubes (MWCNTs) as a co-carbon filler on the electrical and mechanical properties of the EG/PET was investigated. The results showed that the electrical and mechanical properties of the EG/PET were significantly increased with the addition of MWCNTs, showing an improvement over those of PET prepared with EG alone. This was most likely caused by the interconnections in the MWCNTs between the EG layers in the PET matrix. It was found that the addition of the MWCNTs into EG/PET led to dense conductive networks for easy electron transfers, indicating a bridge effect of the MWCNTs.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.93-98
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• 2017

2-Ethylhexyl acrylate, butyl acrylate, methyl methacrylate, and 2-hydroxyethyl methacrylate were polymerized to synthesize acrylic pressure sensitive adhesive (PSA). Alumina and graphite as a filler were added to acrylic PSA to give thermal conductivity. In case of addition of both graphite and alumina, the thermal conductivity of PSA was increased compared with alumina alone due to enhancement of contact between two fillers followed by increasing thermal path in PSA matrix.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.33-38
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• 2007

We studied a bonding at low temperature using polymer bump and Non-Conductive Adhesive (NCA), and studied the reliability of the polymer bump/Al pad joints. The polymer bumps were formed on oxidized Si substrates by photolithography process, and the thin film metals were formed on the polymer bumps using DC magnetron sputtering. The substrate used was AL metallized glass. The polymer bump and Al metallized glass substrates were joined together at $80^{\circ}C$ under various pressure. Two NCAs were applied during joining. Thermal cycling test ($0^{\circ}C-55^{\circ}C$, cycle/30 min) was carried out up to 2000 cycles to evaluate the reliability of the joints. The bondability was evaluated by measuring the contact resistance of the joints through the four point probe method, and the joints were observed by Scanning Electron Microscope (SEM). The contact resistance of the joints was $70-90m{\Omega}$ before the reliability test. The joints of the polymer bump/Al pad were damaged by NCA filler particles under pressure above 200 MPa. After reliability test, some joints were electrically failed since thinner metal layers deposited at the edge of bumps were disconnected.

• Journal of the Korea institute for structural maintenance and inspection
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• v.27 no.4
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• pp.62-69
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• 2023

This study investigated the electromechanical properties of cement based smart repair materials (SRMs) according to the different amounts of fine steel slag aggregates (FSSAs). SRMs can self-diagnose the quality of repairing and self-sense the damage of repaired zone. The replacement ratios of FSSAs to sand for SRMs were 0% (FSSA00), 25% (FSSA25), and 50% (FSSA50) by sand weight. The electrical resistivity of SRMs generally decreased as the compressive stress of SRMs increased: the electrical resistivity of FSSA25 at the age of 7 hours decreased from 78.16 to 63.68 kΩ-cm as the compressive stress increased from 0 to 22.37 MPa. As the replacement ratio of FSSAs by weight of sand increased from 0% to 25%, the stress sensitivity coefficient (SSC) of SRM at the age of 7 h increased from 0.471 to 0.828 %/MPa owing to the increased number of partially conductive paths in the SRMs. However, as the replacement ratio of FSSAs further increased up to 50%, the SSC decreased from 0.828 to 0.649 %/MPa because some of the partially conductive paths changed to continued conductive ones. SRMs are expected to self-sense the quality and future damage of repaired zone only by measuring the electrical resistivity of the repaired zone in addition to fast recovery in the mechanical resistance of structures.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.57-63
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• 2015

In order to prepare a low-cost conductive filler material possessing improved anti-oxidation property, Ag-coated Cu flakes were fabricated and the effects of an applying method of ammonium-based pretreatment solution on the Cu flakes were analyzed. The pretreatment solution was used to remove the surface oxide layer on Cu flake. During a single-stage pretreatment process, hole-shaped defects were formed on the flake surface during the pretreatment after 2 min, and the number and size increased in proportion to the pretreatment time. In the case that Ag plating solution was injected in the pretreatment solution after the pretreatment for 2 min, the defects were also formed during Ag plating. In contrast, the defects tremendous decreased in the case that the pretreatment solution was removed after the first pretreatment for 2 min and the Ag plating proceeded after the second pretratment using a low concentration pretreatment solution. As the final result, the 15 wt% Ag-coated Cu flake sample which was fabricated using the single-stage pretreatment oxidized at $166^{\circ}C$, but the sample fabricated by the double-stage pretreatment oxidized at $224^{\circ}C$, indicating definitely improved anti-oxidation property.