• Carbon letters
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• 제15권2호
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• pp.117-124
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• 2014

Conductive polymer composites (CPCs) consist of a polymeric matrix and a conductive filler, for example, carbon black, carbon fibers, graphite or carbon nanotubes (CNTs). The critical amount of the electrically conductive filler necessary to build up a continuous conductive network, and accordingly, to make the material conductive; is referred to as the percolation threshold. From technical and economical viewpoints, it is desirable to decrease the conductive-filler percolation-threshold as much as possible. In this study, we investigated the effect of polymer/conductive-filler interactions, as well as the processing and morphological development of low-percolation-threshold (${\Phi}c$) conductive-polymer composites. The aim of the study was to produce conductive composites containing less multi-walled CNTs (MWCNTs) than required for pure polypropylene (PP) through two approaches: one using various mixing methods and the other using immiscible polymer blends. Variants of the conductive PP composite filled with MWCNT was prepared by dry mixing, melt mixing, mechanofusion, and compression molding. The percolation threshold (${\Phi}c$) of the MWCNT-PP composites was most successfully lowered using the mechanofusion process than with any other mixing method (2-5 wt%). The mechanofusion process was found to enhance formation of a percolation network structure, and to ensure a more uniform state of dispersion in the CPCs. The immiscible-polymer blends were prepared by melt mixing (internal mixer) poly(vinylidene fluoride) (PVDF, PP/PVDF, volume ratio 1:1) filled with MWCNT.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2004년도 춘계학술발표대회 논문집
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• pp.147-150
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• 2004

Graphite reinforced conductive polymer composites were fabricated by the compression molding technique. Graphite powder (conductive filler) was mixed with an epoxy resin to impart electrical property in composites. The ratio of graphite powder was varied to investigate electrical property of cured conductive composites. In this study, graphite filled conductive polymer composites with high filler loadings$(>60wt.\%)$ were manufactured to accomplish high electrical conductivity(> 100S/cm). Graphite powder increase electrical conductivity of composites by direct physical contact between particles. While high filler loadings are needed to attain good electrical property, the composites becomes brittle. So the ratio of filler to epoxy was varied to optimize of cured composites. The optimum molding pressure according to filler was proposed experimentally.

• 한국안전학회지
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• 제19권4호
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• pp.80-85
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• 2004

Electromagnetic interference(EMI) shielding characteristics of composite filled with Cu flake and carbon brush powder as hybrid conductive filler and EAF slag have been studied. The coaxial transmission line method of ASTM D4935-99 was used to measure the EMI Shielding effectiveness of composites as formulation in frequency rage $100\~1,000MHz$ The SE also increases with the increase in flier loading. The hybrid filler filled composites show higher SE compared to that of only Cu flake. The correlation between SE and conductivity of the various composites is also discussed. The results indicate that the composites having higher filler loading$({\geq}40wt.\%)$ can be used for the purpose of safety materials to protect hazardous electromagnetic interference.

• 전자공학회논문지 IE
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• 제43권4호
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• pp.122-127
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• 2006

무전해 도금법을 이용하여 고분자섬유의 형태를 가진 전도성 필러를 제조하였다. 나일론 6과 레이온 섬유 분체에 니켈과 구리를 도금한 복합 전도성 필러를 제조하였다. 입도 분석기를 이용하여 필러의 입자크기분포를 측정하였으며, 전도성 필러의 전도성을 측정하기 위해 전도성 분석기를 이용하였으며, 본 연구의 전도성 필러와 유사한 용도로 사용되는 탄소섬유의 전도성을 측정하여 전도성의 차이점을 비교하였다. ABS 수지에 제조된 전도성 필러를 주입하여 필름을 만들어서 1MHz$\sim$1GHz 주파수 대역에서 전자파 차폐 특성을 측정하였다. 제조된 전도성 필러가 첨가된 필름의 전자기파 차폐 특성을 측정하기 위하여 ASTM(D4935-89) 규격의 플랜지형 동축전송선 측정기구를 사용하였다. 제조된 전도성 필러는 기존의 탄소계 필러에 비해 전도성이 커서 전자파 차폐용 재료로 적합하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.217-220
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• 2009

Conductive adhesives have been investigated for use in microelectronics packaging as a lead-free solder substitute due to their advantages, such as low bonding temperature. However, high resistivity and poor mechanical behavior may be the limiting factors for the development of conductive adhesives. The metal fillers and the polymer resins provide electrical and mechanical interconnections between surface mount device components and a substrate. As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders and silver has poor electro-migration performance. So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, electrically conductive adhesives (ECAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. Especially the effect of silver coating on the electrical resistance just after curing and after aging was investigated. As a result, it was found that the electrical resistance of ECA with silver-coated copper filler was clearly lower and more stable than that of ECA with pure copper filler after curing process. And, during high temperature storage test, the degradation rate of electrical resistance for ECA with silver coated copper filler was quite slower than that for ECA with pure copper filler.

• 한국전기전자재료학회논문지
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• 제36권6호
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• pp.603-608
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• 2023

Carbon black with high purity and excellent conductivity is used as a conductive filler in the semiconductive compound for EHV (Extra High Voltage) power cables of 345 kV or higher. When carbon black and CNT (carbon nanotube) are applied together as a conductive filler of a semiconductive compound, stable electrical properties of the semiconductive compound can be maintained even though the amount of conductive filler is significantly reduced. In EHV power cables, since the semi-conductive layer is close to the conductor, stable electrical characteristics are required even under high-temperature conditions caused by heat generated from the conductor. In this study, the theoretical principle that a semiconductive compound applied with carbon black and CNT can maintain excellent electrical properties even under high-temperature conditions was studied. Basically, the conductive fillers dispersed in the matrix form an electrical network. The base polymer and the matrix of the composite, expands by heat under high temperature conditions. Because of this, the electrical network connected by the conductive fillers is weakened. In particular, since the conductive filler has high thermal conductivity, the semiconductive compound causes more thermal expansion. Therefore, the effect of CNT as a conductive filler on the thermal conductivity, thermal expansion coefficient, and volume resistivity of the semiconductive compound was studied. From this result, thermal expansion and composition of the electrical network under high temperature conditions are explained.

• Composites Research
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• 제34권5호
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• pp.290-295
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• 2021

지구 온난화 억제를 위한 전 세계적인 연비규제에 발맞춘 해결책으로 자동차에 경량구조복합재료를 적용하는 것이 메가트렌드로 인식되고 있다. 본 연구에서는 수리, 폐기 및 재활용 측면에서 유리한 열가소성 탄소섬유강화플라스틱의 적용을 극대화하기 위해 전도특성이 요구되는 부품 대체 이슈에 대응할 수 있는 기술적 접근을 제공하는 것을 목표로 수행되었다. 저점도 중합 가능한 기지재의 특성을 활용하여 전도성 필러를 파우더 믹싱 방법으로 균일하게 혼입하면서도 우수한 함침 특성을 나타내는 열가소성 탄소섬유강화플라스틱 제조방법에 기초하여 카본블랙, 탄소나노튜브, 그래핀 나노플레이틀렛, 흑연, 피치계 탄소섬유 등 다양한 탄소기반 전도성 필러를 최대 함량까지 혼입하여 전기저항 및 열전도도를 비교하여 고찰하였다. 전도성 탄소 필러의 종류나 형태보다는 최대 혼입량이 시편의 전도 특성을 제어하기 위해 가장 중요한 인자임을 확인하였고, 전기전도 특성을 향상시키기 위해서는 1차원 형태의 전도성 탄소필러를 적용하는 것이 유리할 수 있는 반면 열전도 특성을 향상시키기 위해서는 2차원 형태의 전도성 탄소필러를 적용하는 것이 유리 할 수 있다는 실험 결과를 확인하였다. 본 연구의 결과들은 열가소성 탄소섬유강화플라스틱의 전도 특성을 제어하기 위한 최적 구조 설계에 잠재적인 통찰력을 제공할 수 있다.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2000년도 가을 학술발표회 논문집(II)
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• pp.933-938
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• 2000

Concrete has been used for many years as a composite material that has excellent mechanical properties and durability for construction. However, concrete is a poor electrical conductor, especially under dry conditions. Concrete that is excellent in both mechanical and electrical conductivity properties may have important applications in the electrical, electronic, military and construction industry(e.g. for de-icing road from snow). The purpose of this investigation is to improve the electrical conductive of cement mortar preparared with coke dust, graphite, carbon black and carbon fiber as filler. From the test result, as the content of electrically conductive material increased, fluidity and strength decreased but resistivity decreased. The resistivity of electrical conductive cement mortar is effect by water/cement, and aggregate. Cement mortar containing carbon fiber has the best electrical properties considering strength. From this study, it is enough to assure the use of carbon fiber, carbon black and graphite as a conductive filler for electrical conductive cement mortar.

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

• 한국응용과학기술학회지
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• 제30권3호
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• pp.472-479
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• 2013

The conductive polymer composites recently became increasingly to many fields of industry due to their electrical properties. To understand these properties of composites, electrical properties were measured and were studied relatively. Electrical conductivity measurements showed percolation phenomena. Percolation theories are frequently applied to describe the insulator-to-conductor transitions in composites made of a conductive filler and an insulating matrix. It has been showed both experimentally and theoretically that the percolation threshold strongly depends on the aspect ratio of filler particles. The critical concentration of percolation formed is defined as the percolation threshold. This paper was to study epoxy resin filled with copper. The experiment was made with vehicle such as epoxy resin replenished with copper powder and the study about their practical use was performed in order to apply to electric and electronic industry as well as general field. The volume specific resistance of epoxy resin composites was 3.065~13.325 in using copper powder. The weight loss of conductive composites happened from $350^{\circ}C{\sim}470^{\circ}C$.