• 제목/요약/키워드: Conductive adhesive

검색결과 117건 처리시간 0.022초

EDLC용 고용량, 고밀도 Carbon-PTFE 전극의 전기화학적 특성 (Electrochemical Performance of Carbon-PTFE Electrode with High Capacitance and Density for EDLC)

  • 김익준;전민제;양선혜;문성인;김현수
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.541-542
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    • 2006
  • This work describes the effect of the number of roll pressing and the composition of carbon black on the electric and mechanical properties of carbon-PTFE electrode, in which composition is MSP 20 : carbon black : PTFE = 95-X : X : 5 wt.%. It was found that the best electric and mechanical properties were obtained for sheet electrode roll pressed about 15 times and for sheet electrode, in which composition is MSP 20 : carbon black : PTFE = 80 : 15 : 5 wt.%. These behaviors could be explained by the network structure of PTFE fibrils and conducting paths linked with carbon blacks, respectively. On the other hand, cell capacitor using the sheet electrode with 15 wt.% of carbon black attached on aluminum current collector with the electric conductive adhesive, in composition is carbon black : CMC = 70 : 30 wt.%, has exhibited the best rate capability between $0.5mA/cm^2{\sim}100mA/cm^2$ current density and the lowest ESR.

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가로세로 폭의 제어가 가능한 슁글드 디자인 태양광 모듈 제조 (Fabrication of Shingled Design Solar Module with Controllable Horizontal and Vertical Width)

  • 박민준;김민섭;이은비;김유진;정채환
    • Current Photovoltaic Research
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    • 제11권3호
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    • pp.75-78
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    • 2023
  • Recently, the installation of photovoltaic modules in urban areas has been increasing. In particular, the demand for solar modules installed in a limited space is increasing. However, since the crystalline silicon solar module's size is proportional to the solar cell's size, it is difficult to manufacture a module that can be installed in a limited area. In this study, we fabricated a solar module with a shingled design that can control horizontal and vertical width using a bi-directional laser scribing method. We fabricated a string cell with a width of 1/5 compared to the existing shingled design string cells using a bi-directional laser scribing method, and we fabricated a solar module by connecting three strings in parallel. Finally, we achieved a conversion power of 5.521 W at a 103 mm × 320 mm area.

슁글드 디자인 고출력 양면수광형 단결정 실리콘 태양광 모듈 제작 (Fabrication of Shingled Design Bifacial c-Si Photovoltaic Modules)

  • 박민준;김민섭;신진호;변수빈;정채환
    • Current Photovoltaic Research
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    • 제10권1호
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    • pp.1-5
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    • 2022
  • Bifacial photovoltaic (PV) technology has received considerable attention in recent years due to the potential to achieve a higher annual energy yield compared to its monofacial PV systems. In this study, we fabricated the bifacial c-Si PV module with a shingled design using the conventional patterned bifacial solar cells. The shingled design PV module has recently attracted attention as a high-power module. Compared to the conventional module, it can have a much more active area due to the busbar-free structure. We employed the transparent backsheet for a light reception at the rear side of the PV module. Finally, we achieved a conversion power of 453.9 W for a 1300 mm × 2000 mm area. Moreover, we perform reliability tests to verify the durability of our Shingled Design Bifacial c-Si Photovoltaic module.

질화알루미늄 나노분말의 부착과 이를 활용한 초소수성 표면 제작 (Deposition of aluminum nitride nanopowders and fabrication of superhydrophobic surfaces )

  • 이광석;최헌주;조한동
    • 한국표면공학회지
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    • 제57권1호
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    • pp.49-56
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    • 2024
  • Superhydrophobic surfaces have been expected to be able to provide considerable performance improvements and introduce innovative functions across diverse industries. However, representative methods for fabricating superhydrophobic surfaces include etching the substrate or attaching nanosized particles, but they have been limited by problems such as applicability to only a few materials or low adhesion between particles and substrates, resulting in a short lifetime of superhydrophobic properties. In this work, we report a novel coating technique that can achieve superhydrophobicity by electrophoretic deposition of aluminum nitride (AlN) nanopowders and their self-bonding to form a surface structure without the use of binder resins through a hydrolysis reaction. Furthermore, by using a water-soluble adhesive as a temporary shield for the electrophoretic deposited AlN powders, hierarchical aluminum hydroxide structures can be strongly adhered to a variety of electrically conductive substrates. This binder-free technique for creating hierarchical structures that exhibit strong adhesion to a variety of substrates significantly expands the practical applicability of superhydrophobic surfaces.

Metal PCB에 있어서 양극산화법으로 제작한 Al2O3절연막의 방열특성 (Heat dissipation of Al2O3 Insulation layer Prepared by Anodizing Process for Metal PCB)

  • 조재승;김정호;고상원;임실묵
    • 한국표면공학회지
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    • 제48권2호
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    • pp.33-37
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    • 2015
  • High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.

CNT-Ag 복합패드가 Cu/Au 범프의 플립칩 접속저항에 미치는 영향 (Effect of CNT-Ag Composite Pad on the Contact Resistance of Flip-Chip Joints Processed with Cu/Au Bumps)

  • 최정열;오태성
    • 마이크로전자및패키징학회지
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    • 제22권3호
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    • pp.39-44
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    • 2015
  • 이방성 전도접착제를 이용하여 Cu/Au 칩 범프를 Cu 기판 배선에 플립칩 실장한 접속부에 대해 CNT-Ag 복합패드가 접속저항에 미치는 영향을 연구하였다. CNT-Ag 복합패드가 내재된 플립칩 접속부가 CNT-Ag 복합패드가 없는 접속부에 비해 더 낮은 접속저항을 나타내었다. 각기 25 MPa, 50 MPa 및 100 MPa의 본딩압력에서 CNT-Ag 복합패드가 내재된 접속부는 $164m{\Omega}$, $141m{\Omega}$$132m{\Omega}$의 평균 접속저항을 나타내었으며, CNT-Ag 복합패드를 형성하지 않은 접속부는 $200m{\Omega}$, $150m{\Omega}$$140m{\Omega}$의 평균 접속저항을 나타내었다.

Analysis of Cell to Module Loss Factor for Shingled PV Module

  • Chowdhury, Sanchari;Cho, Eun-Chel;Cho, Younghyun;Kim, Youngkuk;Yi, Junsin
    • 신재생에너지
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    • 제16권3호
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    • pp.1-12
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    • 2020
  • Shingled technology is the latest cell interconnection technology developed in the photovoltaic (PV) industry due to its reduced resistance loss, low-cost, and innovative electrically conductive adhesive (ECA). There are several advantages associated with shingled technology to develop cell to module (CTM) such as the module area enlargement, low processing temperature, and interconnection; these advantages further improves the energy yield capacity. This review paper provides valuable insight into CTM loss when cells are interconnected by shingled technology to form modules. The fill factor (FF) had improved, further reducing electrical power loss compared to the conventional module interconnection technology. The commercial PV module technology was mainly focused on different performance parameters; the module maximum power point (Pmpp), and module efficiency. The module was then subjected to anti-reflection (AR) coating and encapsulant material to absorb infrared (IR) and ultraviolet (UV) light, which can increase the overall efficiency of the shingled module by up to 24.4%. Module fabrication by shingled interconnection technology uses EGaIn paste; this enables further increases in output power under standard test conditions. Previous research has demonstrated that a total module output power of approximately 400 Wp may be achieved using shingled technology and CTM loss may be reduced to 0.03%, alongside the low cost of fabrication.

고효율 및 고출력 태양광 모듈을 위한 셀 스트링 연구 (A Study on the Cell String for High Efficiency and High Power Photovoltaic Modules)

  • 박지수;황수현;오원제;이수호;정채환;이재형
    • 한국전기전자재료학회논문지
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    • 제31권5호
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    • pp.295-299
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    • 2018
  • In this work, we conducted a study on cell strings of high efficiency and high power solar cell modules via simulation. In contrast to the conventional module manufacturing method, the simulation was performed by connecting cutting cells divided into four parts from 6-in size using the electrically conductive adhesive (ECA). The resistance of the ECA added in series connection was extracted using an experimental method. This resistance was found to be $3m{\Omega}$. Based on this simulation, we verified the change in efficiency of the string as a function of the number of cutting cell connections. Consequently, the cutting cell efficiency of the first 20.08% was significantly increased to 20.63% until the fifth connection; however, for further connections, it was confirmed that the efficiency was saturated to 20.8%. Connecting cutting cells using ECA improves the efficiency of the string; therefore, it is expected that it will be possible to fabricate modules with high efficiency and high power.

MREIT of Postmortem Swine Legs using Carbon-hydrogel Electrodes

  • Minhas, Atul S.;Jeong, Woo-Chul;Kim, Young-Tae;Kim, Hyung-Joong;Lee, Tae-Hwi;Woo, Eung-Je
    • 대한의용생체공학회:의공학회지
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    • 제29권6호
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    • pp.436-442
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    • 2008
  • Magnetic resonance electrical impedance tomography(MREIT) has been suggested to produce cross-sectional conductivity images of an electrically conducting object such as the human body. In most previous studies, recessed electrodes have been used to inject imaging currents into the object. An MRI scanner was used to capture induced magnetic flux density data inside the object and a conductivity image reconstruction algorithm was applied to the data. This paper reports the performance of a thin and flexible carbon-hydrogel electrode that replaces the bulky and rigid recessed electrode in previous studies. The new carbon-hydrogel electrode produces a negligible amount of artifacts in MR and conductivity images and significantly simplifies the experimental procedure. We can fabricate the electrode in different shapes and sizes. Adding a layer of conductive adhesive, we can easily attach the electrode on an irregular surface with an excellent contact. Using a pair of carbon-hydrogel electrodes with a large contact area, we may inject an imaging current with increased amplitude primarily due to a reduced average current density underneath the electrodes. Before we apply the new electrode to a human subject, we evaluated its performance by conducting MREIT imaging experiments of five swine legs. Reconstructed conductivity images of the swine legs show a good contrast among different muscles and bones. We suggest a future study of human experiments using the carbon-hydrogel electrode following the guideline proposed in this paper.

신축성 전자패키징을 위한 CNT-Ag 복합패드에서의 플립칩 공정 (Flip Chip Process on CNT-Ag Composite Pads for Stretchable Electronic Packaging)

  • 최정열;오태성
    • 마이크로전자및패키징학회지
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    • 제20권4호
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    • pp.17-23
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    • 2013
  • 신축성 전자패키징 기술개발을 위한 기초연구로서 Cu/Sn 범프에 CNT-Ag 복합패드를 형성한 칩을 이방성 전도접착제를 사용하여 플립칩 본딩한 후, CNT-Ag 복합패드의 유무 및 본딩압력에 따른 플립칩 접속부의 접속저항을 측정하였다. CNT-Ag 복합패드가 형성된 Cu/Sn 칩 범프를 25MPa과 50MPa의 본딩압력으로 플립칩 본딩한 시편들은 접속저항이 너무 높아 측정이 안되었으며, 100MPa의 본딩압력으로 플립칩 본딩한 시편은 $213m{\Omega}$의 평균 접속저항을 나타내었다. 이에 비해 CNT-Ag 복합패드가 없는 Cu/Sn 칩 범프를 사용하여 25MPa, 50 MPa 및 100 MPa의 본딩압력으로 플립칩 본딩한 시편은 각기 $1370m{\Omega}$, $372m{\Omega}$$112m{\Omega}$의 평균 접속저항을 나타내었다.