• Title/Summary/Keyword: Conductive Properties

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Effect of $K_2$CO$_3$ on Dangerous Gas Sensing Characteristics of ${\gamma}$-Fe$_2$O$_3$ Sensor. (${\gamma}$-Fe$_2$O$_3$센서의 위험성 가스 감지 특성에 $K_2$CO$_3$가 미치는 영향)

  • 임병오;박영구
    • Journal of the Korean Society of Safety
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    • v.5 no.2
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    • pp.32-39
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    • 1990
  • The ${\gamma}$-Fe$_2$O$_3$ compounds were oxidized in the furance after gas detecting sensor made molding as the Fe$_3$O$_4$ the synthesized Fe$_3$O$_4$, by ferrous sulfate and sodium hydroxide. Their sensities on carbon monoxide, ethyl alcohol and L. P. G. were measured at various temperatures, respectively. And then their electrical resistivities, thermal properties (D.T.A. & T.G.A.), were examined about their having an effet on the gas-sensing in company with the effect of pure ${\gamma}$-Fe$_2$O$_3$ and the detecting sensor ${\gamma}$-Fe$_2$O$_3$, which reacts with $K_2$CO$_3$ in the hydrothermal coundition, and the electrical conductive mechanism was reflected simultaneously. It was observed that the electrical conductivities and response ratios showed highest value at the endothermic temperature part, 300~35$0^{\circ}C$ of D.T.A.―curve. Consequently, the response ratios and response times of the hydrothermal detecting sensor were higher than that of pure detecting sensor, the specific surface areas were the highest at the endothermic range of D.T.A.-curve. These response ratios of detecting sensor for $K_2$CO$_3$, process at hydrothermal condition on carbon monoxide appeared higher than that on ethyl alcohol and in case of L.P.G. last.

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Direct Transfer Printing of Nanomaterials for Future Flexible Electronics

  • Lee, Tae-Yun
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.05a
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    • pp.3.1-3.1
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    • 2011
  • Over the past decade, the major efforts for lowering the cost of electronics has been devoted to increasing the packaging efficiency of the integrated circuits (ICs), which is defined by the ratio of all devices on system-level board compared to the area of the board, and to working on a larger but cheaper substrates. Especially, in flexible electronics, the latter has been the favorable way along with using novel nanomaterials that have excellent mechanical flexibility and electrical properties as active channel materials and conductive films. Here, the tool for achieving large area patterning is by printing methods. Although diverse printing methods have been investigated to produce highly-aligned structures of the nanomaterials with desired patterns, many require laborious processes that need to be further optimized for practical applications, showing a clear limit to the design of the nanomaterial patterns in a large scale assembly. Here, we demonstrate the alignment of highly ordered and dense silicon (Si) NW arrays to anisotropically etched micro-engraved structures using a simple evaporation process. During evaporation, entropic attraction combined with the internal flow of the NW solution induced the alignment of NWs at the corners of pre-defined structures. The assembly characteristics of the NWs were highly dependent on the polarity of the NW solutions. After complete evaporation, the aligned NW arrays were subsequently transferred onto a flexible substrate with 95% selectivity using a direct gravure printing technique. As proof-of-concept, flexible back-gated NW field effect transistors (FETs) were fabricated. The fabricated FETs had an effective hole mobility of 0.17 $cm2/V{\cdot}s$ and an on/off ratio of ${\sim}1.4{\times}104$. These results demonstrate that our NW gravure printing technique is a simple and effective method that can be used to fabricate high-performance flexible electronics based on inorganic materials.

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The effects of annealing of the ATO films prepared by RF magnetron sputtering (RF 마그네트론 스퍼터를 이용한 ATO 박막의 열처리 효과)

  • Park, Sei-Yong;Lee, Sung-Uk;Park, Mi-Ju;Kim, Young-Ryeol;Hong, Byung-You
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.270-271
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    • 2008
  • Antimony (6 wt%) doped tin oxide (ATO) films to improve conductivity were deposited on 7059 coming glass by RF magnetron sputtering method for application to transparent electrodes. The ATO film was deposited at a working pressure of 5 mTorr and RF power of 175 W. We investigated the effects of the post-annealing temperature on structural, electrical and optical properties of the ATO films. The films were annealed at temperatures ranging from $300^{\circ}C$ to $600^{\circ}C$ in step of $100^{\circ}C$ using RTA equipment in vacuum ambient. X-ray diffraction (XRD) measurements showed the ATO films to be crystallized with a strong (101) preferred orientation as the annealing temperature increased. Electrical resistivity decreased significantly with annealing temperatures up to $600^{\circ}C$. ATO film annealed at temperature of $600^{\circ}C$ showed the lowest resistivity of $5.6\times10^{-3}\Omega$-cm. Optical transmittance increased significantly with annealing temperatures up to $600^{\circ}C$. The highest transmittance was 90.8 % in the visible range from 400 to 800 nm.

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Characterization of Milled Carbon Fibers-filled Pitch-based Carbon Paper for Gas Diffusion Layer (미분쇄 탄소섬유가 첨가된 피치계 탄소섬유기반 기체확산층용 탄소종이 특성)

  • Ham, Eun-Kwang;Yoon, Dong-Ho;Kim, Byoung-Suhk;Seo, Min-Kang
    • Composites Research
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    • v.29 no.5
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    • pp.262-268
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    • 2016
  • In this work, the pitch-based carbon paper (P-CP) was prepared by re-impregnating of binder pitches and PAN-based milled carbon fibers (MCF) at low temperature carbonization process. The influence of MCF content on physicochemical properties of MCF/P-CP was investigated. As a result, the tensile strength of MCF/P-CP was increased sharply from 10 wt.% to 20 wt.% of MCF. Also, the increase of MCF content led to the decrease of interfacial contact resistivity and the improvement of electrical and thermal conductivity of MCF/P-CP. These results were probably due to the increase of density of MCF/P-CP, resulting in the formation of electrically and thermally conductive paths of the carbon paper.

Study on the Epoxy/BaTiO$_3$Embedded Capacitor Films for PWB Applications (인쇄회로기판 용 Epoxy/BaTiO$_3$내장형 커패시터 필름에 관한 연구)

  • 조성동;이주연;백경욱
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.4
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    • pp.59-65
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    • 2001
  • Epoxy/$BaTiO_3$composite capacitor films with excellent stability at room temperature, uniform thickness, and electrical properties over a large area ware successfully fabricated. The composite capacitor films with good film formation capability and easy process ability were made from epoxy resin developed for ACF as a matrix and two kinds of $BaTiO_3$powders as fillers to increase the dielectric constant of the composite film. The crystal structure of the powders and its effects on dielectric constant of the films were investigated by X-ray diffraction (XRD). And the optimum amount of dispersant, phosphate ester, was determined by viscosity measurement of suspension. DSC and dielectric property tests were conducted to decide the right curing temperature and the optimum amount of the curing agent. As a result, the capacitors of 7 $\mu \textrm{m}$ thick film with 10 nF/$\textrm{cm}^2$ and low leakage current were successfully demonstrated.

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A Study on the Characterization of Electroless and Electro Plated Nickel Bumps Fabricated for ACF Application (무전해 및 전해 도금법으로 제작된 ACF 접합용 니켈 범프 특성에 관한 연구)

  • Jin, Kyoung-Sun;Lee, Won-Jong
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.3
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    • pp.21-27
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    • 2007
  • Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.

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Thermal and structural analysis of a cryogenic conduction cooling system for a HTS NMR magnet

  • In, Sehwan;Hong, Yong-Ju;Yeom, Hankil;Ko, Junseok;Kim, Hyobong;Park, Seong-Je
    • Progress in Superconductivity and Cryogenics
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    • v.18 no.1
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    • pp.59-63
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    • 2016
  • The superconducting NMR magnets have used cryogen such as liquid helium for their cooling. The conduction cooling method using cryocoolers, however, makes the cryogenic cooling system for NMR magnets more compact and user-friendly than the cryogen cooling method. This paper describes the thermal and structural analysis of a cryogenic conduction cooling system for a 400 MHz HTS NMR magnet, focusing on the magnet assembly. The highly thermo-conductive cooling plates between HTS double pancake coils are used to transfer the heat generated in coils, namely Joule heating at lap splice joints, to thermal link blocks and finally the cryocooler. The conduction cooling structure of the HTS magnet assembly preliminarily designed is verified by thermal and structural analysis. The orthotropic thermal properties of the HTS coil, thermal contact resistance and radiation heat load are considered in the thermal analysis. The thermal analysis confirms the uniform temperature distribution for the present thermal design of the NMR magnet within 0.2 K. The mechanical stress and the displacement by the electromagnetic force and the thermal contraction are checked to verify structural stability. The structural analysis indicates that the mechanical stress on each component of the magnet is less than its material yield strength and the displacement is acceptable in comparison with the magnet dimension.

Preparation of Amine-functionalized Graphene Fiber and Its Application (아민 분자로 개질된 그래핀 섬유의 제조 및 응용)

  • Lee, Wonoh;Yoon, Sang Su;Um, Moon-Kwang;Lee, Jea Uk
    • Composites Research
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    • v.28 no.5
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    • pp.265-269
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    • 2015
  • Development of simple and efficient method for large-scale production of mechanically strong and electrically conductive graphene fiber is highly desirable for practical applications, such as fiber-reinforced composites, wearable electronics, and electromagnetic irradiation shielding. Here, we present a facile approach for the preparation of amine-functionalized graphene fibers by simple wet-spinning of diamine-functionalized graphene oxide (GO-$NH_2$), which is used because of its synthetic convenience, good dispersity, and scalable production with low cost. The amine-functionalized graphene fiber shows high electrical and mechanical properties compared to pristine graphene oxide fiber due to the electrostatic interaction between amine groups and electronegative functional groups of graphene oxide.

Synthesis of Solution-based Sb-doped SnO2 Thin Films

  • Koo, Bon-Ryul;An, Geon-Hyoung;Lee, Yu-jin;Ahn, Hyo-Jin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.367-367
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    • 2014
  • Transparent conductive oxides (TCOs) 박막은 가시광선영역에서의 높은 투과율과 낮은 저항 특성을 동시에 갖고 있어 최근 smart windows, solar cells, liquid crystal displays (LCD), organic light emitting devices (OLED)등과 같은 최첨단 기기에 필수적인 구성요소로 활발히 사용되고 있다. 따라서, 현재까지 FTO ($SnO_2:F$), ITO ($In_2O_3:Sn$), ATO ($SnO_2:Sb$)등과 같은 다양한 TCO들이 많은 연구자들에 의해 연구되고 있다. 그 중 ITO는 우수한 전기적(${\sim}10^{-4}{\Omega}cm$) 및 광학적(~85%) 특성 때문에 현재 상업적으로 활발히 응용되고 있는 대표적인 물질이다. 하지만 ITO의 주된 구성요소인 indium은 제한적인 매장량과 과도한 소비량 때문에 원가가 비싸다는 문제점이 있다. 반면에, ATO는 우수한 전기적(${\sim}10^{-3}{\Omega}cm$) 및 광학적(~80%) 특성뿐만 아니라 구성물질들의 매장량이 풍부하여 ATO의 원가가 저렴하다는 장점을 가지고 있어 현재 ITO을 대체 할 수 물질로 관심 받고 있다 [1]. 지금까지 우수한 특성을 갖는 ATO박막을 합성하는 방법으로 sol-gel spin coating, sputtering, spray pyrolysis, chemical vapor deposition (CVD)등이 알려져 있다. 이 중에서도, sol-gel spin coating과 spray pyrolysis은 solution기반의 합성법으로 분류되며 합성과정이 간단하고 비용이 저렴하다는 장점이 있고 현재까지 많은 연구가 보고되었다. 그러나, 진공기반이 아닌 우수한 특성을 갖는 solution기반의 ATO박막을 합성하기 위해서는 새로운 합성법의 개발이 학문적으로나 산업적으로도 매우 중요한 이슈이다. 따라서, 본 연구에서는 electrospray을 활용하여 solution기반의 ATO박막을 처음으로 합성하였다. 게다가 ATO박막에 열처리온도에 따른 구조, 화학, 전기, 광학적 특성을 확인하기 위하여 X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), Scanning Electron Microscopy (SEM), transmission electron microscopy (TEM), Hall Effect Measurement System, UV spectrophotometer를 사용하였다. 이러한 실험 결과들을 바탕으로 electrospray을 통해 합성된 solution기반의 ATO박막에 자세한 특성을 본 학회에서 다루도록 하겠다.

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What Is the Key Vacuum Technology for OLED Manufacturing Process?

  • Baek, Chung-Ryeol
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.95-95
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    • 2014
  • An OLED(Organic Light-Emitting Diode) device based on the emissive electroluminescent layer a film of organic materials. OLED is used for many electronic devices such as TV, mobile phones, handheld games consoles. ULVAC's mass production systems are indispensable to the manufacturing of OLED device. ULVAC is a manufacturer and worldwide supplier of equipment and vacuum systems for the OLED, LCD, Semiconductor, Electronics, Optical device and related high technology industries. The SMD Series are single-substrate sputtering systems for deposition of films such as metal films and TCO (Transparent Conductive Oxide) films. ULVAC has delivered a large number of these systems not only Organic Evaporating systems but also LTPS CVD systems. The most important technology of thin-film encapsulation (TFE) is preventing moisture($H_2O$) and oxygen permeation into flexible OLED devices. As a polymer substrate does not offer the same barrier performance as glass substrate, the TFE should be developed on both the bottom and top side of the device layers for sufficient lifetimes. This report provides a review of promising thin-film barrier technologies as well as the WVTR(Water Vapor Transmission Rate) properties. Multilayer thin-film deposition technology of organic and inorganic layer is very effective method for increasing barrier performance of OLED device. Gases and water in the organic evaporating system is having a strong influence as impurities to OLED device. CRYO pump is one of the very useful vacuum components to reduce above impurities. There for CRYO pump is faster than conventional TMP exhaust velocity of gases and water. So, we suggest new method to make a good vacuum condition which is CRYO Trap addition on OLED evaporator. Alignment accuracy is one of the key technologies to perform high resolution OLED device. In order to reduce vibration characteristic of CRYO pump, ULVAC has developed low vibration CRYO pumps to achieve high resolution alignment performance between Metal mask and substrate. This report also includes ULVAC's approach for these issues.

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