• Elastomers and Composites
• /
• v.30 no.1
• /
• pp.9-19
• /
• 1995

To make filler loaded conducting rubber which has the excellent electronical and physical properties, CR and NBR were mixed with magnetite$(Fe_3O_4)$. From the result of the study, vulcanization characteristics shows the upgrading curve as increase in filler concentration and CR has more torque than NBR. When elongation be higher, modulus comes to decreases. Tear strength gradually decrease after showing of the maximum point when is in the 100phr in all. Resilience is not good to cause the increase in filler concentration. In the electrical properties, conductivity becomes smaller when filler concentration is increased. The increase of voltage makes an conductivity grown, but the changed rate is weak. The influence of temperature hardly changes on increasing temperature. The morphology and the distribution for a conductivity filler through SEM were better, the more filler concentration increase, the shorter the particle interval is.

• Elastomers and Composites
• /
• v.30 no.3
• /
• pp.218-228
• /
• 1995

To make filler loaded conducting rubber which has excellent electronical and physical properties, CR and NBR were mixed with barium ferrite(BaO.6Fe2O3). From the result of this study, vulcanization characteristics shows that curve is upgraded as the filler concentration increases and CR has higher torque than NBR. In physical properties, elongation being higher, modulus comes to decrease. Tear strength gradually decrease after showing the maximum point when is in the 100phr in CR. Resilience is not good to cause the increase in filler concentration. In electrical properties, conductivity becomes low when filler concentration increase. The increase of voltage makes a conductivity grown, but the rate change is weak. The influence of temperature hardly changes on increasing temperature. The morphology and the dispersion of a conductivity filler in vulcanizates through SEM were good. The more filler concentration increases, the shorter the particle interval is.

• Korean Journal of Materials Research
• /
• v.10 no.3
• /
• pp.184-190
• /
• 2000

We investigated the effect of filler content on the thermo-mechanical properties of modified ACA composite materials by incorporation of non-conducting fillers and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACA s composites with different content of non-conducting fillers, differential scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechnical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.04a
• /
• pp.9-15
• /
• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
• /
• v.7 no.1
• /
• pp.41-49
• /
• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• 한국신재생에너지학회:학술대회논문집
• /
• 2009.11a
• /
• pp.172-175
• /
• 2009

A bipolar plate is an important component in a fuel cell in the sense of cost and weight. This study aimed at developing highly conductive, lightweight, and low cost bipolar plates. Hybrid carbons filled poly(phenylene sulfide)(PPS) composite bipolar plates were prepared by using the compression molding technique. Various types and amounts of conducting carbon fillers such as graphite, carbon black, carbon fibers, and carbon nanotubes (CNTs) were adopted for the composites. Electrical conductivity and mechanical properties of the composites were measured in order to investigate effects of each components of fillers. When the graphite is only used as a conducting filler, the electrical conductivity of the composites increases with increasing the content, but the flexural strength decreases dramatically. However, for CNTs and carbon fibers, the flexural strength initially increases and then decreases with increasing the amount of the conducting fillers. The amount of graphite corresponding to the peak of flexural strength was moved to lower content with increasing the amount of CNTs or carbon fiber. When hybrid conducting fillers such as fibrous and particulate fillers were used, the synergy effect in mechanical and electrical properties was observed.

• 한국신재생에너지학회:학술대회논문집
• /
• 2009.11a
• /
• pp.180-183
• /
• 2009

Composite bipolar plates offer several advantages of low cost, light weight, and ease of manufacturing compared to traditional graphite plate. However, it is difficult to achieve both high electrical conductivity and high flexural strength. In this study, the hybrid carbons filled epoxy composite bipolar plates were fabricated to test electrical conductivity and flexural properties. Graphite powders were used as the main conducting filler and continuous carbon fiber fabrics were inserted to improve the mechanical properties of the composite. This hybrid composite showed improved in-plane electrical conductivity and flexural property. The moldability of the hybrid composite was also improved comparing to the continuous prepreg composite. This study suggested that the continuous carbon fiber inserted graphite/epoxy composites can be a potential candidate material to overcome the disadvantages of conventional graphite composite or continuous prepreg composite bipolar plates.

• Bulletin of the Korean Chemical Society
• /
• v.33 no.2
• /
• pp.483-488
• /
• 2012

We successfully decorated multi-wall carbon nanotubes (MWNTs) with silver by reacting Ag-NPs with thiolfunctionalized MWNT-SH. Ag alkylcarbamate complex was used as an Ag precursor. Uniform Ag-NPs (5-10 nm) were effectively prepared by microwaving within 60 s using 1-amino-4-methylpiperazine (AMP), which acts as a reaction medium, reducing agent, and stabilizer. The MWNTs were functionalized with 2-aminoethanethiol. Exploiting the chemical affinity between thiol and Ag-NPs, Ag-MWNT nanohybrids were obtained by spontaneous chemical adsorption of MWNT-SH to Ag through Ag-S bonds. The Ag-S-MWNTs were characterized by TGA, XRD, and TEM to confirm that Ag-NPs were uniformly decorated onto the MWNTs. The Ag-S-MWNTs were then employed as conducting filler in epoxy resin to fabricate electrically conducting polymer composites. The electrical properties of the composites were measured and compared with that containing MWNT-SH. The electrical conductivity of composites containing 0.4 wt % Ag-S-MWNT was four orders of magnitude higher than those containing same content of MWNT-SH, confirming Ag-S-MWNT as an effective conducting filler.

• Composites Research
• /
• v.19 no.2
• /
• pp.7-12
• /
• 2006

Graphite particle/carbon fiber hybrid conductive polymer composites were fabricated by the compression molding technique. Graphite particles were mixed with an epoxy resin to impart the electrical conductivity in the composite materials. In this study, graphite reinforced conductive polymer composites with high filler loadings were manufactured to accomplish high electrical conductivity above 100S/cm. Graphite particles were the main filler to increase the electrical conductivity of composites by direct contact between graphite particles. While high filler loadings are needed to attain good electrical conductivity, the composites becomes brittle. So carbon fiber was added to compensate weakened mechanical property. With increasing the carbon fiber loading ratio, the electrical conductivity gradually decreased because non-conducting regions were generated in the carbon fiber cluster among carbon fibers, while the flexural strength increased. In the case of carbon fiber 20wt.% of the total system, the electrical conductivity decreased 27%, whereas the flexural strength increased 12%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.28 no.7
• /
• pp.462-466
• /
• 2015

In this paper, we investigated the relations between dispersion of CNTs (carbon nanotubes) and electrical conductivity in the CNT/PVDF (polyvinylidene fluoride) composite film. By adding hydrophobic CNTs as filler into the PVDF matrix, we fabricated hydrophobic and electrically conducting polymer coating film. Dispersion of CNTs in the CNT/PVDF composite film plays a significant role in terms of electrical conductivity and wetting property. Spray coating method was used to form the CNT/PVDF composite films by injecting the dispersed CNTs in the PVDF solution with different weight ratios from 0.7 wt% to 7 wt%. We investigated the electrical properties and contact angles of the CNT/PVDF composite films with the CNT concentration. Finally we discussed the conducting mechanism and feasibility of the CNT/PVDF composite film for the conducting polymer films.