• Elastomers and Composites
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• 제30권1호
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• pp.9-19
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• 1995

To make filler loaded conducting rubber which has the excellent electronical and physical properties, CR and NBR were mixed with magnetite$(Fe_3O_4)$. From the result of the study, vulcanization characteristics shows the upgrading curve as increase in filler concentration and CR has more torque than NBR. When elongation be higher, modulus comes to decreases. Tear strength gradually decrease after showing of the maximum point when is in the 100phr in all. Resilience is not good to cause the increase in filler concentration. In the electrical properties, conductivity becomes smaller when filler concentration is increased. The increase of voltage makes an conductivity grown, but the changed rate is weak. The influence of temperature hardly changes on increasing temperature. The morphology and the distribution for a conductivity filler through SEM were better, the more filler concentration increase, the shorter the particle interval is.

• Elastomers and Composites
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• 제30권3호
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• pp.218-228
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• 1995

To make filler loaded conducting rubber which has excellent electronical and physical properties, CR and NBR were mixed with barium ferrite(BaO.6Fe2O3). From the result of this study, vulcanization characteristics shows that curve is upgraded as the filler concentration increases and CR has higher torque than NBR. In physical properties, elongation being higher, modulus comes to decrease. Tear strength gradually decrease after showing the maximum point when is in the 100phr in CR. Resilience is not good to cause the increase in filler concentration. In electrical properties, conductivity becomes low when filler concentration increase. The increase of voltage makes a conductivity grown, but the rate change is weak. The influence of temperature hardly changes on increasing temperature. The morphology and the dispersion of a conductivity filler in vulcanizates through SEM were good. The more filler concentration increases, the shorter the particle interval is.

• 한국재료학회지
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• 제10권3호
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• pp.184-190
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• 2000

비전도성 충진재를 포함한 개선된 이방성 전도 접착제의 열적/기계적 특성과 이를 이용한 유기 기판용 플립 칩의 신뢰성에 미치는 충진재 양의 영향을 고찰하였다. 비전도성 충진재 양이 다른 개선된 이방성 접착제의 특성을 살펴보기 위해 differential scanning calorimeter (DSC), thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), thermo-mechanical analyzer (TMA)을 사용하였다. 비전도성 충진재의 양이 증가함에 따라 열팽창계수는 감소하였고, 상온에서의 storage modulus는 증가하였다. 추가로, 충진재의 양이 증가하면 DSC에 의한 유리전이온도와 TMA에 의한 유리전이온도도 증가하였다. 그러나 TGA 거동은 거의 변화가 없었다. 이방성 전도 접착제를 사용한 유기 기판 플립 칩의 신뢰성 테스트를 위해 열주기 시험, 고온고습 시험, 고온건조 시험을 수행하였는데, 주로 열주기 시험에서 이방서 전도 접착제의 열팽창계수의 영향이 컸다. 비전도성 충진재를 포함해서 낮은 열팽창계수와 높은 storage modulus를 갖는 이방성 전도 접착제에 의해 부착된 플립 칩의 신뢰성이 비전도성 충진재를 포함하지 않은 이방성 전도 접착제에 의한 플립 칩의 신뢰성보다 더 좋게 나타났다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 추계학술대회 논문집
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• pp.172-175
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• 2009

A bipolar plate is an important component in a fuel cell in the sense of cost and weight. This study aimed at developing highly conductive, lightweight, and low cost bipolar plates. Hybrid carbons filled poly(phenylene sulfide)(PPS) composite bipolar plates were prepared by using the compression molding technique. Various types and amounts of conducting carbon fillers such as graphite, carbon black, carbon fibers, and carbon nanotubes (CNTs) were adopted for the composites. Electrical conductivity and mechanical properties of the composites were measured in order to investigate effects of each components of fillers. When the graphite is only used as a conducting filler, the electrical conductivity of the composites increases with increasing the content, but the flexural strength decreases dramatically. However, for CNTs and carbon fibers, the flexural strength initially increases and then decreases with increasing the amount of the conducting fillers. The amount of graphite corresponding to the peak of flexural strength was moved to lower content with increasing the amount of CNTs or carbon fiber. When hybrid conducting fillers such as fibrous and particulate fillers were used, the synergy effect in mechanical and electrical properties was observed.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 추계학술대회 논문집
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• pp.180-183
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• 2009

Composite bipolar plates offer several advantages of low cost, light weight, and ease of manufacturing compared to traditional graphite plate. However, it is difficult to achieve both high electrical conductivity and high flexural strength. In this study, the hybrid carbons filled epoxy composite bipolar plates were fabricated to test electrical conductivity and flexural properties. Graphite powders were used as the main conducting filler and continuous carbon fiber fabrics were inserted to improve the mechanical properties of the composite. This hybrid composite showed improved in-plane electrical conductivity and flexural property. The moldability of the hybrid composite was also improved comparing to the continuous prepreg composite. This study suggested that the continuous carbon fiber inserted graphite/epoxy composites can be a potential candidate material to overcome the disadvantages of conventional graphite composite or continuous prepreg composite bipolar plates.

• Bulletin of the Korean Chemical Society
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• 제33권2호
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• pp.483-488
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• 2012

We successfully decorated multi-wall carbon nanotubes (MWNTs) with silver by reacting Ag-NPs with thiolfunctionalized MWNT-SH. Ag alkylcarbamate complex was used as an Ag precursor. Uniform Ag-NPs (5-10 nm) were effectively prepared by microwaving within 60 s using 1-amino-4-methylpiperazine (AMP), which acts as a reaction medium, reducing agent, and stabilizer. The MWNTs were functionalized with 2-aminoethanethiol. Exploiting the chemical affinity between thiol and Ag-NPs, Ag-MWNT nanohybrids were obtained by spontaneous chemical adsorption of MWNT-SH to Ag through Ag-S bonds. The Ag-S-MWNTs were characterized by TGA, XRD, and TEM to confirm that Ag-NPs were uniformly decorated onto the MWNTs. The Ag-S-MWNTs were then employed as conducting filler in epoxy resin to fabricate electrically conducting polymer composites. The electrical properties of the composites were measured and compared with that containing MWNT-SH. The electrical conductivity of composites containing 0.4 wt % Ag-S-MWNT was four orders of magnitude higher than those containing same content of MWNT-SH, confirming Ag-S-MWNT as an effective conducting filler.

• Composites Research
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• 제19권2호
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• pp.7-12
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• 2006

본 연구에서는 탄소섬유의 첨가가 흑연 보강 전도성 고분자 복합재료의 전기적, 기계적 특성에 미치는 영향을 고찰하였다. 압축성형법을 이용하여 흑연입자/탄소섬유 혼합 보강 전도성 고분자 복합재료를 제조하였으며 흑연입자의 고비율 충진은 복합재료 내에서 입자 사이의 직접 접촉을 통해 높은 전기 전도도(>100S/cm)를 얻는 것을 가능하게 하였다. 하지만 흑연입자의 비율이 높아짐에 따라 소재의 강도가 점차 떨어지게 되므로 이를 보완하기 위해 탄소섬유를 첨가하여 그에 따른 소재의 전기적, 기계적 특성 변화를 연구하였다. 탄소섬유의 충진 비율이 증가함에 따라 소재의 굽힘 강도는 증가하였으나 탄소섬유의 클러스터 형성으로 인해 탄소섬유 사이에 비전도성 영역이 발생하여 복합재료의 전기 전도도는 감소함을 확인하였다. 탄소섬유의 충진 비율이 전체 시스템의 20wt.%인 경우에는 굽힘 강도는 12% 증가한 반면 전기 전도도가 27% 감소하였다.

• 한국전기전자재료학회논문지
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• 제28권7호
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• pp.462-466
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• 2015

In this paper, we investigated the relations between dispersion of CNTs (carbon nanotubes) and electrical conductivity in the CNT/PVDF (polyvinylidene fluoride) composite film. By adding hydrophobic CNTs as filler into the PVDF matrix, we fabricated hydrophobic and electrically conducting polymer coating film. Dispersion of CNTs in the CNT/PVDF composite film plays a significant role in terms of electrical conductivity and wetting property. Spray coating method was used to form the CNT/PVDF composite films by injecting the dispersed CNTs in the PVDF solution with different weight ratios from 0.7 wt% to 7 wt%. We investigated the electrical properties and contact angles of the CNT/PVDF composite films with the CNT concentration. Finally we discussed the conducting mechanism and feasibility of the CNT/PVDF composite film for the conducting polymer films.