• Title/Summary/Keyword: Condenser Design

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A Study on Minimizing of Condenser Pressure Loss according to the Temperature Rise of the Seawater for Korean Standard Coal-fired Power Plants (표준석탄화력 발전소 해수온도 상승에 따른 복수기 압력 손실 최소화 방안)

  • An, Hyo-Yoel;Moon, Seung-Jae
    • Plant Journal
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    • v.11 no.2
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    • pp.45-51
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    • 2015
  • In this paper, studied condenser operating management which is affecting power plants efficiency considering the cost of poor quality. Sea water temperature and condenser pressure have clear correlation in S power plants. As the sea water temperature changes, condenser pressure changed -1.7~+20 mmHg from design condenser pressure(38.1 mmHg). Use the heat rate correction curve from manufactory company, realized that efficiency and cost of poor quality changed 0.0201%, 12,830 won/h at Unit #1,2 but 0.0155%, 9,832 won/h when condenser pressure 1 mmHg rise. Also, checked that it is changed depend on seasonal corresponding operation, plant ageing and the point of preventive maintenance like overhaul maintenance. This study said if we considered complying with management range and planning overhaul maintenance, then it could help reducing operating maintenance losses minimum 2.5 billion won per 1 year (case : Unit #1, forty days maintenance).

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Design Study of a Brazed Plate Heat Exchanger Condenser Through Two-Phase Flow Analysis (이상유동 해석을 통한 브레이징 판형 응축기 설계 연구)

  • Hwang, Dae-jung;Oh, Cheol;Park, Sang-kyun;Jee, Jae-hoon;Bang, Eun-shin;Lee, Byeong-gil
    • New & Renewable Energy
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    • v.18 no.2
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    • pp.73-81
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    • 2022
  • This study was aimed at designing a condenser, as a component of the organic Rankine cycle system for ships. The condenser was manufactured through press molding to achieve a bent shape to enhance the heat transfer performance, considering the shape of the heat transfer plate used in a brazing plate heat exchanger. The heat transfer plate was made of copper-nickel alloy. The required heat transfer rate for the condenser was 110 kW, and the maximum number of layers was set as 25, considering the characteristics of high-temperature brazing. Computational fluid dynamics techniques were used to perform the thermal fluid analysis, based on the ANSYS CFX (v.18.1) commercial program. The heat transfer rate of the condenser was 4.96 kW for one layer (width and length of 0.224 and 0.7 m, respectively) of the heat transfer exchanger. The fin efficiency pertaining to the heat transfer plate was approximately 20%. The heat flow analysis for one layer of the heat exchanger plate indicated that the condenser with 25 layers of heat transfer plates could achieve a heat transfer rate of 110 kW.

Die stress and Process of Analysis for Condenser Tube Extrusion by using a Porthole Die (포트홀 다이를 이용한 컨덴서 튜브 직접압출 공정해석 및 금형강도 해석)

  • Lee, J. M.;lee, S. K.;Kim, B. M.;Jo, H. H.;Jo, H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.05a
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    • pp.1030-1033
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    • 2002
  • In this study, it is important that we have an understanding of the metal flow for manufacturing condenser tube in porthole die extrusion, because this need to provide for household appliances market that is expected to grow into the major market of the cooling system hereafter. Condenser tube is mainly manufactured by conform exclusion. However, this method was not satisfied a series of the needs for manufacturing condenser tube as compared with porthole die extrusion. The deforming skill recently is required high-productivity, high-accuracy and reducing lead-time, thus it is essential to substitute conform exclusion by porthole die exclusion. Porthole die extrusion has many advantages such as improvement of productivity, reduction of production cost etc. In general, the porthole die extrusion process consists of three stages(dividing, welding and forming stages). In order to obtain the detailed mechanics, to assist in the design of proper die shapes and sizes, and to improve the quality of products, porthole die extrusion should be analyzed in as non-steady state as possible during the entire process to evaluate detailed metal flow, temperature distribution, welding pressure and extrusion lead, and therm stress analysis was practiced to obtain effective stress and elastic deformation value. A analytical results provide useful information the optimal design of the porthole die for condenser tube.

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A Study on the Cascade Hybrid Cooling/Refrigeration Cycle Equipped With Intercooler and Air-Cooled Condenser in Series (인터쿨러와 공랭식 응축기를 동시에 사용하는 냉방-냉동 겸용 캐스케이드 사이클에 대한 연구)

  • Kim, Nae-Hyun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.20 no.7
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    • pp.353-362
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    • 2019
  • Thermodynamic analysis of cascade refrigeration systems has attracted considerable research attention. On the other hand, a system evaluation based on thermodynamic analyses of the individual parts, including the evaporator, condenser, intercooler, expansion valve, etc., has received less attention. In this study, performance analysis was conducted on a cascade refrigeration system, which has an individual cooling and refrigeration evaporator, and equips the intercooler and air-cooled condenser in a series in a lower cycle. The thermo-fluid design was then performed on the major components of the system - upper condenser, lower condenser, cooling evaporator, refrigeration evaporator, intercooler, compressor, electronic expansion valve - of 15 kW refrigeration, and 8 kW cooling capacity using R-410A. A series of simulations were conducted on the designed system. The change in outdoor temperature from 26 C to 38 C resulted in the cooling capacity of the lower evaporator remaining approximately the same, whereas it decreased by 9% at the upper evaporator and by 63% at the intercooler. The COP decreased with increasing outdoor temperature. In addition, the COP of the cycle with the intercooler operation was higher that of the cycle without the intercooler operation. Furthermore, the increase in the upper condenser size by two fold increased the upper evaporator by 4%. On the other hand, the lower evaporator capacity remained the same. The COP of the upper cycle increased with increasing upper condenser size, whereas that of the lower cycle remained almost the same. When the size of the lower condenser was increased 2.8 fold, the intercooler capacity increased by 8%, whereas those of upper and the lower evaporator remained approximately the same. Furthermore, the COP of the lower cycle increased with an increase in the lower condenser. On the other hand, the change of the upper condenser was minimal.

A study on the dynamic characteristics of the secondary loop in nuclear power plant

  • Zhang, J.;Yin, S.S.;Chen, L.;Ma, Y.C.;Wang, M.J.;Fu, H.;Wu, Y.W.;Tian, W.X.;Qiu, S.Z.;Su, G.H.
    • Nuclear Engineering and Technology
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    • v.53 no.5
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    • pp.1436-1445
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    • 2021
  • To obtain the dynamic characteristics of reactor secondary circuit under transient conditions, the system analysis program was developed in this study, where dynamic models of secondary circuit were established. The heat transfer process and the mechanical energy transfer process are modularized. Models of main equipment were built, including main turbine, condenser, steam pipe and feedwater system. The established models were verified by design value. The simulation of the secondary circuit system was conducted based on the verified models. The system response and characteristics were investigated based on the parameter transients under emergency shutdown and overload. Various operating conditions like turbine emergency shutdown and overspeed, condenser high water level, ejector failures were studied. The secondary circuit system ensures sufficient design margin to withstand the pressure and flow fluctuations. The adjustment of exhaust valve group could maintain the system pressure within a safe range, at the expense of steam quality. The condenser could rapidly take out most heat to avoid overpressure.

The Design cnd Manufacture on the Trial Manufacture of an Automatic Escalator System for the Maintenance Conservative Technology Advancement of the Solar Cell and Street Light (태양집광판과 가로등의 유지보순 기술 향상을 위한 자동 승하강장치 시작품 설계 제작)

  • Lee, Jae-Yong;Byun, Chang-Soo;Song, Hyun-Jig
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.22 no.6
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    • pp.61-69
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    • 2008
  • In this paper, an automatic escalator system is manufactured for concentrate lighting efficiency and maintenance improvement technology of street light used a solar condenser. It can be linked with street light used a solar condenser, improved concentrate lighting efficiency by regulating concentrate light angle of a solar condenser. It can be remove and attach to solar condenser and street light. By developing street light used a solar condenser with an automatic escalator system, the lighting efficiency of street light and the concentrate lighting efficiency of solar condenser are High. The maintenance fee of street light significantly reduce and traffic congestion during working hours of street light is prevent.

Non-imaging Optical Design of a Measurement Probe for LCD Display Used in a Color Analyzer (LCD 디스플레이용 색채계 렌즈에 관한 비결상 광학설계)

  • Rim, Cheon-Seog
    • Korean Journal of Optics and Photonics
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    • v.22 no.5
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    • pp.239-244
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    • 2011
  • We introduce Gaussian (or paraxial) optics that can be successfully applied to design, for use in a color analyzer, a non-imaging optical system on a measurement probe for LCD display. The color analyzer is used to decompose colored lights leaving from some measurement area on the LCD display to red, green, and blue. The color analyzer must include a condenser lens whose purpose is to gather colored lights to illuminate a small area on the sensor. In order to satisfy a reduction ratio between the measurement area and the sensing area with a non-imaging condition, a condenser lens is analytically treated by means of Gaussian optics so that good understanding of the non-imaging condenser lens is achieved as a good design is derived. As a result, the technique shows the necessity of analytical treatment in contrast to the design approach using only commercial software such as CODE-V, Light-Tools, and others. Of course, CODE V and Light-Tools are also utilized in this paper to confirm and complete the Gaussian optical design.

Design and fabrication of condenser microphone with rigid backplate and vertical acoustic holes using DRIE and wafer bonding technology (기판접합기술을 이용한 두꺼운 백플레이트와 수직음향구멍을 갖는 정전용량형 마이크로폰의 설계와 제작)

  • Kwon, Hyu-Sang;Lee, Kwang-Cheol
    • Journal of Sensor Science and Technology
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    • v.16 no.1
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    • pp.62-67
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    • 2007
  • This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin (Au/Sn) eutectic solder bonding. The membrane chip has 2.5 mm${\times}$2.5 mm, $0.5{\mu}m$ thick low stress silicon nitride membrane, 2 mm${\times}$2 mm Au/Ni/Cr membrane electrode, and $3{\mu}m$ thick Au/Sn layer. The backplate chip has 2 mm${\times}$2 mm, $150{\mu}m$ thick single crystal silicon rigid backplate, 1.8 mm${\times}$1.8 mm backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50-60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is $39.8{\mu}V/Pa$ (-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

Design and Fabrication of MEMS Condenser Microphone Using Wafer Bonding Technology (기판접합기술을 이용한 MEMS 컨덴서 마이크로폰의 설계와 제작)

  • Kwon, Hyu-Sang;Lee, Kwang-Cheol
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.16 no.12 s.117
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    • pp.1272-1278
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    • 2006
  • This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin(Au/Sn) eutectic solder bonding. The membrane chip has $2.5mm{\times}2.5mm$, 0.5${\mu}m$ thick low stress silicon nitride membrane, $2mm{\times}2mm$ Au/Ni/Cr membrane electrode, and 3${\mu}m$ thick Au/Sn layer. The backplate chip has $2mm{\times}2mm$, 150${\mu}m$ thick single crystal silicon rigid backplate, $1.8mm{\times}1.8mm$ backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50{\sim}60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is 39.8 ${\mu}V/Pa$(-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

Development of Direct Extrusion Process on Al 1050 Condenser Tube by using Porthole Die (포트홀 다이를 이용한 Al1050 컨덴서 튜브의 직접압출공정 기술 개발)

  • 이정민;김병민;강충길;조형호
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.7
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    • pp.53-61
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    • 2004
  • Condenser tube which is used for a cooling system of automobiles is mainly manufactured by conform extrusion. However, direct extrusion using porthole die in comparison with conform extrusion has many advantages such as improvement of productivity, reduction of production cost etc. In general, the porthole die extrusion process is useful for manufacturing long tubes with hollow sections and consists of three stages(dividing, welding and forming stages). Especially, Porthole die for producing condenser tube is very complex. Thus, in order to obtain the detailed mechanics, to assist in the design of proper die shapes and sizes, and to improve the quality of products, porthole die extrusion should be analyzed in as non-steady state as possible. This paper describes FE analysis of non-steady state porthole die extrusion for producing condenser tube with multi-hole through 3D simulation in the non-steady state during the entire process to evaluate detailed metal flow, temperature distribution, welding pressure and extrusion load. Also to validate FE simulation of porthole die extrusion, a comparison of simulation and experiment results was presented in this paper.