• Title/Summary/Keyword: Computational heat transfer analysis

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Analysis of Thermal Loading of a Large LPG Engine Piston Using the Inverse Heat Conduction Method (열전도의 역문제 방법을 이용한 대형 LPG 엔진 피스톤의 열부하 해석)

  • Park Chul-Woo;Lee Boo-Youn
    • Proceedings of the Computational Structural Engineering Institute Conference
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    • 2006.04a
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    • pp.820-827
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    • 2006
  • The convection heat transfer coefficients on the top surface of a large liquid petroleum liquid injection(LPLi) engine piston are analyzed by solving an inverse thermal conduction problem. The heat transfer coefficients are numerically found so that the difference between analyzed temperatures from the finite element method and measured temperatures is minimized. Using the resulting heat transfer coefficients as the boundary condition, temperature of a large LPLi engine piston is analyzed.

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THERMAL-FLUID PERFORMANCE ANALYSIS OF COMPACT HEAT EXCHANGERS HAVING A PERIODIC CHANNEL CONFIGURATION (주기적인 채널형상을 갖는 고밀도 열교환기의 열유동 성능해석)

  • Kim, M.H.;Lee, W.J.
    • Journal of computational fluids engineering
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    • v.12 no.3
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    • pp.47-54
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    • 2007
  • A periodic CFD approach for the performance analysis of compact high temperature heat exchangers is introduced and applied to selected benchmark problems, which are a fully developed 2D laminar heat transfer, a conjugate heat transfer between parallel plates which have exact solutions, and a heat transfer in a real high temperature heat exchanger module. The results for the 2D laminar heat transfer and the 2D conjugate heat transfer showed a very good agreement with the exact solutions. For the high temperature heat exchanger module, the pressure drops were predicted well but some difference was observed in the temperature parameters when compared to the full channel CFD analysis due to assumptions introduced into the periodic approach. Considering its assumptions and simplicities, however, the results showed that the periodic approach provides physically reasonable results and it is sufficient to predict the performance of a heat exchanger within an engineering margin and with much less CPU time than the case of a full channel analysis.

A Study on Radiation Heat Transfer of Wafer Transfer Module Using Computational Flow Visualization (전산유동가시화를 활용한 웨이퍼 이송장치의 복사열전달에 관한 연구)

  • Min Gi, Chu;Ji Hong, Chung;Dong Kee, Sohn;Han Seo, Ko
    • Journal of the Korean Society of Visualization
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    • v.20 no.3
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    • pp.58-66
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    • 2022
  • The high heat emitted from the process module and heat jacket may cause errors in semiconductor process equipment. Barriers were designed to reduce the temperature of surface on transfer module. A designed barrier was compared and analyzed by numerical analysis using ANSYS Fluent. The average temperature of barrier and effect of radiation heat transfer were also compared through absorbed radiative heat flux of the barrier. The adoption of the barrier had an effect on the radiative heat transfer reduction of the transfer module rod. The effect of the angles of barrier from 50° to 90° on the heat transfer was investigated using the absorbed radiative heat flux with the average temperature. The angle of barrier of 50° reduced the temperature up to 9.6 %.

CFD ANALYSIS ON HEAT TRANSFER PERFORMANCE OF A REFRIGERATOR CONDENSER (냉장고 응축기의 전열성능에 대한 CFD 해석)

  • Yoo, S.S.;Hwang, D.Y.;Lee, M.S.;Han, B.Y.;Park, H.K.
    • Journal of computational fluids engineering
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    • v.14 no.3
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    • pp.56-62
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    • 2009
  • In this study, the heat transfer and flow field of a condenser used for a Kim-chi refrigerator is analysed with numerical method. Main objective is to present the basic data for designing a new condenser model with improvement of heat transfer performance. For CFD analysis, a commercial code, STAR CCM+ was used. The water was used for the inner working fluid and the air was used for the outer fluid. The condenser type used in this study is a flat plate fin-and-tube heat exchanger. As analysis parameters, the effect of condenser geometry and air velocity was investigated. For validation of the numerical calculations, the results were compared with the experimental ones. The heat transfer rates for both results were consistent with each other by maximum 5 % error. Based on this comparison, the numerical analysis was done with some modifications. As a result, it has been observed that there is a suitable fin pitch with which heat transfer performance of condenser is maximized.

HEAT TRANSFER ANALYSIS ON THE PREFORM HEATING AND THE GLASS FIBER DRAWING IN A GRAPHITE FURNACE FOR OPTICAL FIBER MANUFACTURING PROCESS (광섬유 생산공정용 퍼니스 내의 모재 가열 및 유리섬유 인출에 대한 열전달 해석)

  • Kim, K.;Kim, D.;Kwak, H.S.
    • 한국전산유체공학회:학술대회논문집
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    • 2011.05a
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    • pp.88-91
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    • 2011
  • Glass fiber drawing from a silica preform is one of the most important processes in optical fiber manufacturing. High purify silica preform of cylindrical shape is fed into the graphite furnace, and then a very thin glass fiber of 125 micron diameter is drawn from the softened and heated preform. A computational analysis is performed to investigate the heat transfer characteristics of preform heating and the glass fiber drawing in the furnace. In addition to the dominant radiative heating of preform by the heating element in the furnace, present analysis also includes the convective heat transport by the gas flowing around the preform that experiences neck-dawn profile and the freshly drawn glass fiber at high fiber drawing speed. The computational results present the effects of gas flow on the temperature of preform and glass fiber as well as the neck-down profile of preform.

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ANALYSIS OF HEAT TRANSFER OF INCLINED IMPINGING JETS ON A CONCAVE SURFACE (엇갈리게 기울어진 충돌제트들에 의한 오목면 상의 열전달 성능해석)

  • Heo, M.W.;Lee, K.D.;Kim, K.Y.
    • Journal of computational fluids engineering
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    • v.16 no.2
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    • pp.11-16
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    • 2011
  • Numerical analyses have been carried out to analyze the three-dimensional turbulent heat transfer by impingement jet on a concave surface with variation of geometric configurations. Three-dimensional Reynolds averaged Navier-stokes equations have been calculated using the shear stress transport turbulent model. The numerical results for heat transfer rate were validated in comparison with the experimental data. The distance between jet nozzles and angle of inclined jet nozzle were selected as the geometric variables. Area-averaged Nusselt numbers on concave surface are evaluated to find the characteristics of heat transfer with the two geometric variables. The heat transfer increases as the distance between jet nozzles increases, and the inclined impinging jets show much better heat transfer performance than the vertical impinging jet.

NUMERICAL ANALYSIS ON THE HEAT TRANSFER AND FLOW IN THE SHELL AND TUBE HEAT EXCHANGER (Shell & Tube 열교환기 Shell 측 열전달 및 유동에 대한 수치해석)

  • Lee, Sang-Hyuk;Lee, Myung-Sung;Hur, Nahm-Keon
    • Journal of computational fluids engineering
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    • v.12 no.3
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    • pp.13-19
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    • 2007
  • A numerical simulation on the heat transfer and flow field was carried out to improve the performance of the shell and tube heat exchanger. The steady incompressible 3-D Navier-Stokes solution is obtained with the actual operational condition and geometry of the heat exchanger. Based on this study, it is noted that the present geometry of the heat exchanger causes poor heat transfer since the air inside shell does not flow through the tube bundle, but around it. The enhancement of the heat transfer can be achieved by the variation of the design factor like the sealing strip located on the top/bottom and middle of the baffle, but it causes the increasement of the pressure drop. In this paper, the effects of the location and size of the sealing strips and flow rate through the heat exchanger on the heat transfer and pressure drop are studied.

Thermal Stress Analysis for the Printed Circuit Board of Electronic Packages (전자장비 회로기판의 열응력해석)

  • Kwon Y. J.;Kim J. A.
    • Korean Journal of Computational Design and Engineering
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    • v.9 no.4
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    • pp.416-424
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    • 2004
  • In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

Analysis of turbulent heat transfer over V-shaped ribs (V-형 사각리브에 의한 난류열전달 해석)

  • Lee, Young-Mo;Kim, Kwang-Yong
    • 유체기계공업학회:학술대회논문집
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    • 2005.12a
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    • pp.169-172
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    • 2005
  • Numerical analysis of turbulent flow in three-dimensional channel with V-shaped ribs extruded on both walls has been carried out. Reynolds-averaged Navier-Stokes are calculated for analysis of fluid flow and heat transfer. Shear stress transport (SST) turbulence model is used as a turbulence closure. Computational results for heat transfer rate show good agreements with experimental data.

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A Numerical Process for the Underhood Thermal Management with the Microscopic and Semi-microscopic Heat Transfer Method (미시적/준미시적 방법을 이용한 자동차용 열교환기 해석기법)

  • Lee, Sang-Hyuk;Kim, Joo-Han;Lee, Na-Ri;Hur, Nahm-Keon
    • 한국전산유체공학회:학술대회논문집
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    • 2008.03b
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    • pp.75-79
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    • 2008
  • In this study, the numerical process for analyzing the automotive louver fin heat exchanger was developed with a 3D microscopic and semi-microscopic analysis. In the microscopic analysis, the simulation with the detailed meshes was performed for obtaining the characteristics of the heat exchanger. From this simulation, the numerical correlations of the heat transfer and flow friction were obtained. In the semi-microscopic analysis, the Semi-microscopic Heat Exchanger (SHE) method, which is characterized by a conjugate heat transfer and porous media analysis was used with the numerical correlation from the microscopic analysis. This analysis predicted the flow and heat transfer characteristics of the louver fin heat exchanger in the wind tunnel and vehicle. In the design of the louver fin heat exchanger, this numerical process can predict the performance and characteristic of the louver fin heat exchanger.

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