• Journal of the Korean Institute of Landscape Architecture
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• v.33 no.5 s.112
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• pp.69-82
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• 2005

These studies were carried out (1) to investigate the growth characteristics of Sedum album L. in the field, (2) to propose a suitable shallow peen roof system for this plant, and (3) to evaluate plant growth in the proposed system over the long term. The growth characteristics, such as morphological properties, growth habit, shade tolerance, and flowering, were surveyed. In experimental shallow green-roof systems, the effects of drainage type, substrate type, and soil depth on plant growth were investigated. Then drought tolerance was investigated. After planting Sedum album L. in the proposed system survival rate, cover, and resistance to insects, heal and cold were evaluated for about 2 years. The results of these studies are summarized below. 1. In the field, the aboveground part of Sedum album L. did not die back during the winter. Plant height was 4$\sim$7 cm. Roots were distributed to a depth of 5$\sim$7 cm. Sedum album L. is a compact ground-cover plant that spreads vigorously. Shading condition of less than $30\%$ of full sunlight didn't cause any trouble, but shading conditions above $87\%$ made the shape of the shoots and leaves abnormal. The plant bloomed from June to August and had a rather large compound umbel of white, star-shaped flowers. 2. Two systems, a drainage-blend-10 cm soil depth and a reservoir$\cdot$drainage-blend-15 cm soil depth, performed best in terms of cover, fresh weight, and dry weight. The first has an advantage for green roofs because it is lighter than the latter. 3. In drainage-blend-10 m soil depth and modified reservoir · drainage-blend-10 cm soil depth system no plants died for about 4 months after stopping the irrigation. The visual quality of the latter system was above 5 for 4 months and that of the former was under 5 after 2 months. In the field, however, the drought tolerance of Sedum album L. grown in the former would be enough to withstand the dry season. Considering the urban ecosystem and the importance of healthy growth the modified reservoir $\cdot$ drainage-blend-10 cm soil depth system was finally recommended. This system was composed of a 4 cm thick drainage layer and drain outlets placed at a height of 2.5 cm. 4. In the proposed system, the survival rate was $100\%$, and there was no injury induced by insects and heat. The leaf density decreased a little in winter. Cover increased throughout the year. Sedum album L. was planted with a cover of 72$cm^{2}$ on 3 April 2003; on 16 June 2003 and 15 June 2004, cover was $132.66\pm$5.87 $cm^{2}$(1.8 times) and $886.98\pm$63.51 $cm^{2}$(12.3 times), respectively.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.61-68
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• 2015

Warpage analysis has been performed for top and bottom packages of thin package-on-packages processed with different epoxy molding compounds (EMCs). Warpage deviation was measured for packages molded with the same EMCs and also the warpage deviations of top and bottom substrates themselves were characterized in order to identify the major factor causing the package warpage. For the top and bottom packages processed with thin substrates, the warpage deviation of the substrates was large, which made it difficult to figure out the effect of EMC properties on the package warpage. Top packages, where the molding area of $13mm{\times}13mm$ covered the most of the substrate area ($14mm{\times}14mm$), exhibited similar warpage behavior with changing the temperature. On the other hand, bottom packages, where the molding area was only $8mm{\times}8mm$, exhibited the complex warpage behavior due to simultaneous occurrence of (+) and (-) warpages on the same package. Accordingly, the bottom packages showed dissimilar temperature-warpage behavior even being processed with the same EMCs.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Journal of Korean Society of Forest Science
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• v.19 no.1
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• pp.1-23
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• 1973

The results of ground vegetation experiment conducted at completely denuded forestland in the mudstone region are summerized as follows: On the reaults of soiling quantity the effect of soiling was observed where depth of soiling over 10 cm was practiced, and a plot where treated with 15cm soiling and without fertilizer showed poor growth and it was even worser than the plot where soiling was practiced only 1 cm in thikness but applied adequate amount of fertilizers. The depth of slits between 30cm and 40cm showed no significant difference in the effect. A plot where covered with vegetation bag showed somewhat better results in seed loss and early growth but no differences observed in the fall result over the none covered plot. And then, it is recommendable to have soiling over 10cm in thikness with slit of 30cm and 30cm in depth and to apply 30 gram of fertilizer (22;22:11, 50 gram) per slit. On various soiling materials trial there were no striking differences in the effect of soiling between weathered granite soil, wheathered tuffs soil and weathered mudstone soil. In the treatment with various green materials, a plot treated with straw mat showed a significant difference at 1 percent. The results show that weathered mudstone soil is effective to use as soiling materials and straw mat treatment was better. On forest fertilization trial, in the mudstone region where red and black pine trees already existing at a rate of 2,000-3,000 trees per hectare had applied 110kg of compound fertilizers (9:12:3 and 22:22:11) per hectare basis in terms of plant nutrient. As a result, the difference in effect between the compound fertilizers was not found however the leaf color and leaf length of the fertilizer added plot showed darker and longer at 30 percent over the no fertilizer received plot. Compound fertilizers, 14:37:12 and 9:12:3 were applied to alder trees at a rate of 20 gram and 40 gram per tree in terms of plant nutrient and a remarkable growth accelerantion was observed where 40 grams of plant nutrient applied. The effect difference between the compound fertilizers was not found. On investigation of tree root elongation, forty years old red pine trees showed only 15cm tap root elongation through mudstone while black pine had 23 cm tap root elongation. The total length of supporting root elongtion of red and black pines showed 20 and 13 meters, respectively. The tap roots of Black locusts were not able to elongate through mudstone, however, the supporting roots tended to develop to the underneath of pine tree where some moisture content is available. Black locusts And grown on the residual soil of mudstone normally die between 8 to 10 years. The red pine trees show flat in tree shape while black pine had triangle in the shape. With the results it can be said that in an artificial reforestation in denuded forest land of the mudstone region the adequate slit and enough amount of fertiliizer application must be provided for the succesful performance of the program. On integrated experimental results of 1972. for the establishment of ground vegetation on the completely denuded forest land in mudstone region, soiling could be effectively practiced with weathered mudstone soil and it would not specially necessiate to have either weathered granite or tuffssoil for the soiling. And the soiling depth should be more than 10 cm in thickness. Among green materials used the straw mat proved to be the most effective reatment. Three major factors which enable to establish ground vegetation by the shortest period of time: A. Physical improvement of soil is necessary to breakdown of the horizontal cracks sushas Slit, contour line plot, seeding hole and etc., and soiling with weathered mudstone soil. B. Chemical improvement of soil: is needed sufficient amount of fertilizer application 300~400kg ha, $N+P_2O_5+K_2O$), and increased production of ground covering and expedite resolution of the vegetation (ground vegetation, fallen leaves and twigs). C. Complete establishment of the basic structure for the erosion control (Prevention of surface soil erosion)