• Steel and Composite Structures
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• v.24 no.4
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• pp.455-465
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• 2017

This paper presents a series of ultimate and fatigue experimental investigation on concrete-filled rectangular hollow section (CRHS) X joints with Perfobond Leister rib (PBR) under tension. A total of 15 specimens were fabricated, in which 12 specimens were tested under ultimate tension and 3 specimens were investigated in fatigue test. Different parameters including PBR stiffening, brace-to-chord ratio (${\beta}$) and inclined angle (${\theta}$) were considered in the test. Each joint was tested to failure under tension load. Obtained from test result, PBR was found to improve the tension strength and fatigue durability of CRHS joint substantially. Concrete dowel consisted by PBR and concrete inside the chord stiffened the joint, which leaded to a combination failure mode of punching shear and chord plastification of CRHS joint under tension. Finite element analysis validated the compound failure mode. Stress concentration on typical spot of CRHS joint was mitigated by PBR which was observed from fatigue test. Initial fatigue crack presented in CRHS joint with PBR also differentiated with the counterpart without PBR.

• Tuberculosis and Respiratory Diseases
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• v.73 no.1
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• pp.1-10
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• 2012

Care of patients with sepsis has improved over the last decade. However, in the recent two years, there was no significant progress in the development of a new drug for critically ill patients. In January 2011, it was announced that the worldwide phase 3 randomized trial of a novel anti-Toll-like receptor-4 compound, eritoran tetrasodium, had failed to demonstrate an improvement in the mortality of patients with severe sepsis. In October 2011, Xigris (drotrecogin alfa, a recombinant activated protein C) was withdrawn from the market following the failure of its worldwide trial that had attempted to demonstrate improved outcome. These announcements were disappointing. The recent failure of 2 promising drugs to further reduce mortality suggests that new approaches are needed. A study was published showing that sepsis can be associated to a state of immunosuppression and loss of immune function in human. However, the timing, incidence, and nature of the immunosuppression remain poorly characterized, especially in humans. This emphasizes the need for a better understanding of sepsis as well as new therapeutic strategies. Many clinical experiences of the extracorporeal membrane oxygenator (ECMO) treatment for adult acute respiratory distress syndrome (ARDS) patients, which is caused by the H1N1 influenza A virus, were reported. The use of ECMO in severe respiratory failure, particularly in the treatment of adult ARDS, is occurring more commonly.

• Korean Journal of Materials Research
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• v.9 no.5
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• pp.503-508
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• 1999

We have investigated the physical and diffusion barrier property of Ti-Si-N film for Cu metallization. The ternary compound was deposited by using reactive rf magnetron sputtering of a TiSi$_2$target in an Ar/$N_2$gas mixture. Resistivities of the films were in range of 358$\mu$$\Omega$-cm, to 307941$\mu$$\Omega$-cm, and tended to increase with increasing the $N_2$/Ar flow rate ratio. The crystallization of the Ti-Si-N compound started to occur at 100$0^{\circ}C$ with the phases of TiN and Si$_3$N$_4$identified by using XRD(X-ray Diffractometer). The degree of the crystallization was influenced by the $N_2$/Ar flow ratio. The diffusion barrier property of Ti-Si-N film for Cu metallization was determined by AES, XRD and etch pit by secco etching, revealing the failure temperature of 90$0^{\circ}C$ in 43~45at% of nitrogen content. In addition, the very thin compound (10nm) with 43~45at% nitrogen content remained stable up to $700^{\circ}C$. Furthermore, thermal treatment in vacuum at $600^{\circ}C$ improved the barrier property of the Ti-Si-N film deposited at the $N_2$(Ar+$N_2$) ratio of 0.05. The addition of Ti interlayer between Ti-Si-N films caused the drastic decrease of the resistivity with slight degradation of diffusion barrier properties of the compound.

• Journal of Welding and Joining
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• v.25 no.2
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• pp.82-88
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• 2007

Sn-3.0Ag-0.5Cu lead fee solder was generally utilized in electronics assemblies. But it is insufficient to research about activation energy(Q) that is applying to evaluate the solder joint reliability of environmental friendly electronics assemblies. Therefore this study investigated Q values which are needed to IMC formation and growth of Sn-3.0Ag-0.5Cu/Cu and Sn-40pb/Cu solder joints during aging treatment. We bonded Sn-3.0Ag-0.5Cu and Sn-40Pb solders on FR-4 PCB with Cu pad$(t=80{\mu}m)$. After reflow soldering, to observe the IMC formation and growth of the solder joints, test specimens were aged at 70, 150 and $170^{\circ}C$ for 1, 2, 5, 20, 60, 240, 960, 15840, 28800 and 43200 min, respectively. SEM and EDS were utilized to analysis the IMCS. From these results, we measured the total IMC$(Cu_6Sn_5+Cu_3Sn)$ thickness of Sn-3.0Ag-0.5Cu/Cu and Sn-40Pb/Cu interface, and then obtained Q values for the IMC$(Cu_6Sn_5,\;Cu_3Sn)$ growth of the solder joints.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.83-88
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• 2018

The electromigration (EM) tests were performed at $150^{\circ}C$ with $1.5{\times}10^5A/cm^2$ conditions in order to investigate the effect of non-conductive film (NCF) trap on the electrical reliability of Cu/Ni/Sn-Ag microbumps. The EM failure time of Cu/Ni/Sn-Ag microbump with NCF trap was around 8 times shorter than Cu/Ni/Sn-Ag microbump without NCF trap. From systematic analysis on the electrical resistance and failed interfaces, the trapped NCF-induced voids at the Sn-Ag/Ni-Sn intermetallic compound interface lead to faster EM void growth and earlier open failure.

• Korean Journal of Metals and Materials
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• v.47 no.3
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• pp.202-208
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• 2009

The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.

• Journal of Welding and Joining
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• v.34 no.3
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• pp.17-22
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• 2016

In terms of mechanical and metallurgical characteristics, the effect of tool plunge depths(0.2, 0.5, 0.7, 1.0, 1.5mm) on weldability in dissimilar Al5083-O/DP590 friction spot joint has been clarified. From the results, it is found that the stirred nugget was stably formed at a plunge depth of more than 0.7mm, which is caused by improved stirring action against each other material. With increasing a plunge depth, the thickness of intermetallic compound(IMC) layer in Al5083-O/DP590 joint has a tendency to increase. The tensile shear strength reaches to the maximum failure load of 6.5kN at a plunge depth of 0.7mm due to relatively small decrease in the thickness of Al5083-O sheet and relatively minute thickness of IMC layer, compared with those of other plunge depth conditions.

• Proceedings of the Korean Geotechical Society Conference
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• 1991.10a
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• pp.362-375
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• 1991

Background and Necessity of the study : For more than 20 years, the soil engineering reserach group of Chonnam National University has been performing the deformation analysis of soft clayey foundation, since the University is located near the south-western coast of Korean Peninsulla, along which tide reclamation works have been under proaressing. Associsted with the fact mentioned above, the researchers have been developing a computer program in order to carry out deformation analysis of soft foundation since early 1980. Case-studies : In this research, the Biot's equation was selected as the governing equation coupled with several constitutive models including original and modified Cam-clay models, elasto-viscoplastic model, Lade's model etc. The anisotropy of soi1 can be considered in this program. To validate the accuracy of the computer program developed a couple of case-studies were performed. These include the pilot banking, sand drain considering smear effect and compound foundation reinforced with sheet pile into soft foundation.i) The pilot banking Good results could be acquired by assuming banking load as the body force composed of finite element mesh rather than equivalent concentrated load.ii) The sand drain Due to smear, the delay of consolidation was remarkable at the early stsge. so safety for the failure of foundation should be checked for the initial step of consolidation. iii) The compound foundation Accurate results were obtained by introducing the joint element method for the soft foundation reinforced with sheet pile into soiㅣ.

• Journal of Korea Foundry Society
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• v.17 no.3
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• pp.258-266
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• 1997

The purpose of this study is to improve hardness and wear resistance of high strength yellow brass by adding Fe, Cr, Mn, Si and Ni. Results showed that NiO, $FeCr_2O_4$ and intermetallic compound $Mn_5Si_3$ were produced when Ni, Fe-Cr and Mn-Si were added to the yellow brass. The hardness and wear tests showed the best results with the presence of the product precipitates and intermetallic compound. The calculation of relative wear resistance by volume fraction of each phases showed that the relative wear resistance of $Mn_5Si_3$ had the highest value, that of ${\beta}$ phase had the lowest. Observation of the worn surface showed that the main wear mechanism were found to be the abrasive wear, and also showed that the wear is caused by mechanical failure at the early stage.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.81-88
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• 2019

In this study, the effects of graphene oxide (GO) addition on electromigration (EM) lifetime of Sn-3.0Ag-0.5Cu Pb-free solder joint between a ball grid array (BGA) package and printed circuit board (PCB) were investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of package side finished with electroplated Ni/Au, while $Cu_6Sn_5$ IMC was formed at the interface of OSP-treated PCB side. Mean time to failure of solder joint without GO solder joint under $130^{\circ}C$ with a current density of $1.0{\times}10^3A/cm^2$ was 189.9 hrs and that with GO was 367.1 hrs. EM open failure was occurred at the interface of PCB side with smaller pad diameter than that of package side due to Cu consumption by electrons flow. Meanwhile, we observed that the added GO was distributed at the interface between $Cu_6Sn_5$ IMC and solder. Therefore, we assumed that EM reliability of solder joint with GO was superior to that of without GO by suppressing the Cu diffusion at current crowding regions.