• Journal of the Korean Society for Heat Treatment
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• v.17 no.2
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• pp.87-93
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• 2004

Nitrocarburizing was carried out with various $CH_4$ gas composition with 4 torr gas pressure at $570^{\circ}C$ for 3 hours and post oxidation was carried out with 100% $O_2$ gas atmosphere with 4 torr at different temperatures for various time. In the case of plasma nitrocarburizing, It is that the ratio of ${\varepsilon}-Fe_{2-3}$(N, C) and ${\gamma}^{\prime}-Fe_4$(C, N), which comprise the compound layer phase, depend on concentrations of $N_2$ gas and $CH_4$ such that when the concentration of $N_2$ and $CH_4$ increased, the ratio of ${\gamma}^{\prime}-Fe_4$(C, N) decreased, but the ratio of ${\varepsilon}-Fe_{2-3}$(N, C) increased. The thickness of compound layer consistently increased as gas concentration increased regardless of $N_2$ and $CH_4$ expect when the concentration of $CH_4$ was 3.5 volume%, it decreased insignificantly. When oxidizing for 15min in the temperature range of $460{\sim}570{^\circ}C$, the study found small amount of $Fe_3O_4$ at the temperature of $460{^\circ}C$ and also found that amounts of $Fe_2O_3$. and $Fe_3O_4$ on the surface and amount of ${\gamma}^{\prime}-Fe_4$(C, N) in the compound layer increased as the increased over $460^{\circ}C$, but the thickness of the compound layer decreased. Corrosion resistance was influenced by oxidation times and temperature.

• Journal of the Korean institute of surface engineering
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• v.40 no.6
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• pp.250-253
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• 2007

Plasma nitrocarburizing and plasma oxidizing treatments were performed to improve the wear and corrosion resistance of SKD 11 steel. Plasma nitrocarburizing was conducted for 12 h at $520^{\circ}C$ in the nitrogen, hydrogen and methane atmosphere to produce the $\varepsilon-Fe_{2-3}(N,C)$ phase. It was found that the compound layer produced by plasma nitrocarburising was predominantly composed of $\varepsilon-phase$, with a small proportion of $\gamma'-Fe_4(N,C)$ phase. The thickness of the compound layer was about $5{\mu}m$ and the diffusion layer was about $150{\mu}m$ in thickness, respectively. Plasma post oxidation was performed on the nitrocarburized samples with various oxygen/hydrogen ratio at constant temperature of $500^{\circ}C$ for 1 hour. The very thin magnetite($Fe_3O_4$) layer $1-2{\mu}m$ in thickness on top of the compound layer was obtained by plasma post oxidation. It was confirmed that the corrosion characteristics of the nitrocarburized compound layer could be further improved by the application of the superficial magnetite layer.

• Journal of Sericultural and Entomological Science
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• v.36 no.2
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• pp.147-151
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• 1994

This study was carried out investigate the characteristics of Habutae and Chiffon woven with silk and polyester(S/P) compound yarn. The S/P compound yarn could be produced by the automatic reeling machine with attachment of air jetting device, polyester yarn guider and tension control apparatus. The surface structure, tensile property and dyeing fastness of S/P compound fabric were examined for the fabric properties. Electron microscopy revealed that most part of S/P compound yarn was well interlaced and some silk part of compound yarn were hidden by polyester on an examination of surface of chiffon fabric. By the one bath and two step dyeing of disperse and acidic dyes, the colour fastness of S/P compound fabrics were 4 grade above. The tenacity and initial modulus of the finished S/P compound fabric were lower than those of grey and degummed fabrics, but reversed in elongation.

• Journal of Magnetics
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• v.18 no.4
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• pp.375-379
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• 2013

The electronic and the magnetic properties of (001) surface of $KCaN_2$ half-metallic compound with full-Heusler structure are studied with the use of a full-potential linearized augmented plane wave method. Two possible terminations of the surface are considered and only the one with N atoms in the topmost layer is found to retain the half-metallic properties of the bulk. The magnetic properties of N-terminated surface are enhanced compared with the properties of the bulk. The calculated magnetic moments on the N atoms in the $KCaN_2$ are 1.26 ${\mu}_B$ in the bulk and 1.90 ${\mu}_B$ at the surface. The subsurface metal atoms are also slightly polarized. In the surface terminated with metal atoms, not only the half-metallicity is destroyed, but also the magnetic properties of the system are weakened.

• Journal of the Korean institute of surface engineering
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• v.39 no.1
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• pp.1-8
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• 2006

In this study, effect of sputtering after plasma nitriding and before PVD coating on the microstucture, microhardness, surface roughness and the adhesion strength of CrN thin films were investigated. Experimental results showed that this sputtering process not only removed surface compound layer which formed during a plasma nitriding process but also induced an alteration of the surface of plasma nitrided substrate in terms of microhardness distribution and surface roughness, which in turn affected the adhesion strength of PVD coatings. After sputtering, microhardness distribution showed general decrease and the surface roughness became increased slightly. The critical shear stress measured from the scratch test on the CrN coatings showed an approximately twice increase in the binding strength through the sputtering prior to the coating and this could be attributed to a complete removal of compound layer from the plasma nitrided surface and to an increase in the surface roughness after sputtering.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.86.1-86.1
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• 2015

As the feature size of Si-based semiconductor shrinks to nanometer scale, we are facing to the problems such as short channel effect and leakage current. One of the solutions to cope with those issues is to bring III-V compound semiconductors to the semiconductor structures, because III-V compound semiconductors have much higher carrier mobility than Si. However, introduction of III-V semiconductors to the current Si-based manufacturing process requires great challenge in the development of process integration, since they exhibit totally different physical and chemical properties from Si. For example, epitaxial growth, surface preparation and wet etching of III-V semiconductors have to be optimized for production. In addition, oxidation mechanisms of III-V semiconductors should be elucidated and re-growth of native oxide should be controlled. In this study, surface preparation methods of various III-V compound semiconductors such as GaAs, InAs, and GaSb are introduced in terms of i) how their surfaces are modified after different chemical treatments, ii) how they will be re-oxidized after chemical treatments, and iii) is there any effect of surface orientation on the surface preparation and re-growth of oxide. Surface termination and behaviors on those semiconductors were observed by MIR-FTIR, XPS, ellipsometer, and contact angle measurements. In addition, photoresist stripping process on III-V semiconductor is also studied, because there is a chance that a conventional photoresist stripping process can attack III-V semiconductor surfaces. Based on the Hansen theory various organic solvents such as 1-methyl-2-pyrrolydone, dimethyl sulfoxide, benzyl alcohol, and propylene carbonate, were selected to remove photoresists with and without ion implantation. Although SPM and DIO3 caused etching and/or surface roughening of III-V semiconductor surface, organic solvents could remove I-line photoresist without attack of III-V semiconductor surface. The behavior of photoresist removal depends on the solvent temperature and ion implantation dose.

• Journal of the Korean institute of surface engineering
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• v.39 no.6
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• pp.268-275
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• 2006

In this study, effect of sputtering on the plasma-nitriding substrate and before PVD coating on the microstucture, microhardness, surface roughness and the adhesion strength of CrZrN thin films were investigated. Experimental results showed that this sputtering process not only removed surface compound layer which formed during a plasma nitriding process but also induced an alteration of the surface of plasma nitrided substrate in terms of microhardness distribution, surface roughness. This in turn affected the adhesion strength of PVD coatings. After sputtering, microhardness distribution showed general decrease and the surface roughness became increased slightly. The critical shear stress measured from the scratch test on the CrZrN coatings showed an approximately 1.4 times increase in the adhesion strength through the sputtering prior to the coating and this could be attributed to a complete removal of compound layer from the plasma nitrided surface and to an increase in the surface roughness after sputtering.

• Nuclear Engineering and Technology
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• v.51 no.3
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• pp.755-760
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• 2019

Compound samples based on the mineral-like magnesium potassium phosphate matrix $MgKPO_4{\times}6H_2O$ were synthesized by solidification of high level waste surrogate. Phase composition and structure of synthesized samples were studied by XRD and SEM methods. Compressive strength of the compounds is $12{\pm}3MPa$. Coefficient of thermal expansion of the samples in the range $250-550^{\circ}C$ is $(11.6{\pm}0.3){\times}10^{-6}1/^{\circ}C$, and coefficient of thermal conductivity in the range $20-500^{\circ}C$ is $0.5W/(m{\times}K)$. Differential leaching rate of elements from the compound, $g/(cm^2{\times}day)$: $Mg-6.7{\times}10^{-6}$, $K-3.0{\times}10^{-4}$, $P-1.2{\times}10^{-4}$, $^{137}Cs-4.6{\times}10^{-7}$; $^{90}Sr-9.6{\times}10^{-7}$; $^{239}Pu-3.7{\times}10^{-9}$, $^{241}Am-9.6{\times}10^{-10}$. Leaching mechanism of radionuclides from the samples at the first 1-2 weeks of the leaching test is determined by dissolution ($^{137}Cs$), wash off ($^{90}Sr$) or diffusion ($^{239}Pu$ and $^{241}Am$) from the compound surface, and when the tests continue to 90-91 days - by surface layer depletion of compound. Since the composition and physico-chemical properties of the compound after irradiation with an electron beam (absorbed dose of 1 MGy) are constant the radiation resistance of compound was established.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.9
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• pp.156-164
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• 1996

Tool interference is one of the most critical problems in machining die cavities and punches. When machining concave or convex regions of cavities with large radius tool in rough cutting, the tool easily overcuts or undercuts the portions of the surface, which result in machining inaccuracy. So the generation of interference-free tool path must be required for more efficient rough cutting. In this paper, we present a method for modeling die cavities which consist of simple surface or analytic compoyund surfaces and present an algorithm for checking and removing the tool interference occurred in machining the die cavities. Using these algorithms, we can represent a die cavity, and check the interfer- ence regions, and then remove these interferences. Especially we focus on the side interference in the sides of analytic elements and base surface boundary.

• Corrosion Science and Technology
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• v.7 no.3
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• pp.158-161
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• 2008

It is well known that iron is one of the most common impurity elements found in aluminum and its alloys. Iron in the aluminum forms an intermetallic compounds such as $FeAl_3$. The $FeAl_3$ particles on the aluminum surface are one of the most detrimental phases to the corrosion process and anodizing procedure for aluminum and its alloys. Trial and error surface treatment will be carried out to find the preferential and effective removal of $FeAl_3$ particles on the surfaces without dissolution of aluminum matrix around the particles. One of the preferable surface treatments for the aim of getting $FeAl_3$ free surface was an electrochemical treatment such as cathodic current density of $-2kAm^{-2}$ in a 20-30 mass% $HNO_3$ solution for the period of 300s. The corrosion characteristics of aluminum surface with $FeAl_3$ free particles are examined in a $0.1kmol/m^3$ NaCl solution. It is found that aluminum with free $FeAl_3$ particles shows higher corrosion resistance than aluminum with $FeAl_3$ particles.