• 한국초지조사료학회지
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• 제11권3호
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• pp.182-188
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• 1991

With a purpose of finding out the effects of cattle slurry applicatioin on the dry matter yield, yield component, and botanical composition in the mixed sward, a field experiment was conducted with two times and five levels of cattle slurry application. The experimental field was laid.out in a split-plot design with three replications, and lasted from September. 1986 to October, 1990 at the Livestock Experiment Station in Suweon, The results obtained are summarized as follows: 1. At each harvest time, the plant growth of the plots with cattle slurry application was slightly worse when compared to dressing of mineral fertilizer. 2. Average dry matter yield for 4 years was not significantly different between the slurry application times, just after cutting, and 15 days after cutting, The DM yield in the plot with cattle slurry 30 m!/ha and mineral fertilizer(9,095 kg/ha) and with cattle slurry 60 m1/ha and mineral fertilizer(8, 987 kg/ha) were decreased by 8% and 10% than that of the plot with mineral fertilizer application(9,937 kg/ha), respectively. 3. The DM yield component of the plots with cattle slurry application just after cutting was much better when compared to manuring 15 days after cutting. And it was much better in the plot with cattle slurry 60 m"/ha and mineral fertilizer which was composed of 73.8% grasses(6.636 kg/ha). 24.6% legumes (2,207 kdha) and 1.6% weeds(144 kdha). 4. In general, the botanical composition was relatively good in the plots with slurry application just after cutting. Grassland vegetation of the plots with cattle slurry 60 m"/ha and mineral fertilizer was changed into much better botanical composition with 66.8% grasses, 30.2% legumes and 3. 1% weeds at the end of the experiment.xperiment.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.41-44
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• 2003

As the device feature size is reduced to the deep sub-micron regime, the chemical mechanical polishing (CMP) technology is widely recognized as the most promising method to achieve the global planarization of the multilevel interconnection for ULSI applications. However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

• 한국축산시설환경학회지
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• 제8권2호
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• pp.111-114
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• 2002

This study was conducted to determine the volume of pig slurry productinn and the characteristics from 4 swine farms. For the composition of pig slurry produced, contents of N, $P_2O_5$ and $K_2O$, were 0.13, 0.25 and 0.13% in slurry, respectively. Water pollutant concentration in slurry of swine farms, $BOD_5$, $COD_MN$, SS, T-N and T-P, was $24,047mg/{\ell}$, $30,232mg/{\ell}$, $36,833mg/{\ell}$, $2,805mg/{\ell}$, $465mg/{\ell}$, respectively. The average volume of pig slurry was 6.30 ${\ell}/head/day$ and 6.32 ${\ell}$ in spring, 6.69 ${\ell}$ in summer, 6.09 ${\ell}$ in autumn, and 6.12 ${\ell}$ in winter. The average moisture content of slurry was 95.8%. The composition of slurry produced by pig farms.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.378-381
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• 2003

The chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.723-726
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• 2004

In this work, we have studied the CMP characteristics by mixing of original slurry and used slurry in order to investigated the possibility of recycle of used silica slurry. The removal rate and within-wafer non-uniformity (WIWNU) were measured as a function of different slurry composition. Also, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and the original slurry. Our experimental results revealed comparable removal rate and good planarity with commercial products.

• 한국전기전자재료학회논문지
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• 제16권9호
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• pp.759-764
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• 2003

Recently, CMP (chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of roused silica slurry in order to reduce the costs of CMP slurry. The post-CMP thickness and within-wafer non-uniformity (WIWNU) wore measured as a function of different slurry composition. As an experimental result, the performance of reused slurry with annealed silica abrasive of 2 wt％ contents was showed high removal rate and low non-uniformity. Therefore, we propose two-step CMP process as follows , In tile first-step CMP, we can polish the thick and rough film surface using remaked slurry, and then, in the second-step CMP, we can polish the thin film and fine pattern using original slurry. In summary, we can expect the saying of high costs of slurry.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.39-42
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• 2002

Recently, CMP (chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of reused silica slurry in order to reduce the costs of CMP slurry. The post-CMP thickness and within-wafer non-uniformity(WIWNU) were measured as a function of different slurry composition. As a experimental result, the performance of reused slurry with annealed silica abrasive of 2 wt% contents was showed high removal rate and low non-uniformity. Therefore, we propose two-step CMP process as follows In the first-step CMP, we can polish the thick and rough film surface using remaked slurry, and then, in the second-step CMP, we can polish the thin film and fine pattern using original slurry. In summary, we can expect the saving of high costs of slurry.

• 한국전기전자재료학회논문지
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• 제17권2호
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• pp.156-161
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• 2004

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. In order to compare the removal rate and non-uniformity as a function of oxidizer contents, we used alumina-based tungsten slurry and copper blanket wafers deposited by DC sputtering method. According to the CMP removal rates and particle size distribution, and the microstructures of surface layer by SEM image as a function or oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2$O$_3$abrasive particles in CMP slurry.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2000년도 추계학술발표강연 및 논문개요집
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• pp.80-80
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• 2000

차세대 대화면 평판 디스플레이에서 가장 주목을 받고 있는 디스플레이 소자는 PDP라고 할 수 있다. PDP 패널 제조 공정 기술에서 난해한 공정 중 하나인 투명 유전체 제조 공정은 현재까지 인쇄법에 의한 연구가 주로 진행되어 왔다. 그러나 인쇄법은 여러 번의 인쇄와 건조, 소성이 반복되어야 함으로써 유전체 제조에 있어서 복잡한 제조 공정이므로 대폭 단순화할 필요가 있다. 이에 대한 해결책으로서 제시된 것이 tape casting을 이용한 건식 공정이다. 본 연구에서는 tape casting용 slurry에 포함되는 유기물인 binder, plasticizer, solvent의 변화에 따른 dry film의 특성 및 소성 조건에 따른 유전체 특성에 관하여 조사하였다. PbO-SiO$_2$-B$_2$O$_3$계 유리 분말과 유기 vehicle을 ball mill을 이용하여 분산, 혼합하여 tape casting용 slurry를 제조하고, 이 slurry를 doctor blade법으로 tape를 제조하고 건조한 후 유리기판에 transfer한 후 소성하였다. Slurry의 조건과 소성 조건에 따른 투광성, 표면 조도 및 단면의 미세구조 등 투명 유전체의 특성을 평가하였다.

• Asian-Australasian Journal of Animal Sciences
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• 제13권11호
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• pp.1593-1597
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• 2000

In the quiescent state, cattle-manure slurry stratifies into three discernible layers, namely a floating scum layer, a bottom sludge layer and a watery middle layer. The proportions of top (scum), middle and bottom (sludge) layers were approximately 20, 60 and 20% respectively of the volume of the whole slurry. Particulate matter from the different stratified layers was characterised for particle size distribution and cellulose, hemicellulose and lignin composition. Total solids concentrations of top, middle and bottom layers were 12.7, 2.8 and 7.4% respectively. Larger particles were found in the top layer compared with the bottom. The top layer contained the highest amounts of Neutral Detergent Fibre (NDF), Acid Detergent Fibre (ADF), cellulose and hemicellulose, but the lowest amount of Total Kjeldahl Nitrogen (TKN). The bottom layer contained the highest amounts of Acid Detergent Lignin (ADL) and TKN. With increase in particle size, there were increases in NDF, ADF, cellulose and hemicellulose, accompanied by decreases in ADL and TKN. Biochemical methane potential of the three layers was also measured. The top layer was found to produce the most methane with the middle layer producing the least. Biomethanation rate from the top layer was also the highest. Differences in biomethanation rates and biochemical methane potential were attributed to differences in chemical composition of the particulate matter. About 48%, 23% and 30% of the total chemical oxygen demand (COD) in the top, middle and bottom layers respectively of the slurry was found to be degradable.