• Proceedings of the Korean Society of Precision Engineering Conference
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• 1993.04b
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• pp.257-261
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• 1993

This paper presents a design method of turning device for robotic assembly based on the verification of a instability for a base assembly. To derive the instability, first we inference collision free assembly directions by extracting separable directions for the part, and calculate the separability which gives informations as to how the part can be dasily separated. Using the result, we determine the instability evaluated by summing the all separabilites of each component part in base assembly. The proposed method gives a design guidance of turning device by evaluating a degree of the motion istability for the base assembly in flexible manufacturing application. An example is given to illustrate the concepts and procedure of the proposed scheme.

• 제어로봇시스템학회:학술대회논문집
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• 1986.10a
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• pp.419-424
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• 1986

A technique is developed which allows a designer to interactively create an assembly of components by specifying mating contions between the individual components. Once establishing the relationships between components via the mating conditions, each component's location and orientation in the final assembly is computed. The joint information for a kinematic and dynamic analysis can be derived from the mating conditions, therefore this work may be extended to incorporate this analysis. Thorugh this development it will no longer be necessary for a designer to specify cumbersome and error prone transformation matrices in order to create an assembly. The designer also will be able to perform a kinematic or a dynamic analysis directly from an assembly model if the joint information can be automatically derived.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 1993.10a
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• pp.44-44
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• 1993

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.5
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• pp.57-63
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• 2010

Tolerance analysis is one of the most important processes to improve the image quality of products. High resolution camera module for mobile phones needs precision assembly technology since the module becomes smaller and thinner. This paper will focus on the unit tolerance and the assembly tolerance which can affect the performance of the module. Lens shading and relative illumination were used to evaluate the optical axis scatter for each component on camera and estimate the assembly yield rate based on the evaluation result. A program was developed to analyze the impact on optical axis by each module, then to optimize the dimensions and tolerance for reducing the scatter of optical axis assembly. Through the simulation, though a rate of relative illumination was declined in where optical axis is displaced $100{\mu}m$ from sensor center, MTF performance is not influenced by increasing in optical axis displacement. It was seen that assembly yield was improved in result of simulation after correcting optical axis tolerance.

• Analytical Science and Technology
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• v.27 no.6
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• pp.284-291
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• 2014

The handling process of car indoor air quality is composed of 2 steps of testing. First, assambly part is tested to find a source of car indoor VOCs. Second, cut sample of unit component is tested to find a source material of VOCs emission. If the source material of VOCs emission is found, it can reduce car and assembly part of VOCs by improving material. As cut sample testing has problem of emission from cut surface to find the source of VOCs, it needs to apply unit components testing method. The aim of study is to evaluate VOCs impact factor of unit components in assembly parts. ISO 12219-5 test method reflects not only material effect but also surface area effect by testing unit component without cutting. The unit components of doortrim and console, were tested by ISO12219-5. And it could figure what unit component is main source of VOCs in assembly. And quantity conversion Factor which gets by testing assembly and unit components can be used to make guideline of ISO 12219-5.

• Journal of Information Technology Services
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• v.1 no.1
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• pp.141-148
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• 2002

As an optimun alternatives for the solution of recent software crisis, we have to develop component technologies so as to develop and propagate business components for various domains to industries. For the sake of development of business components, a conceptual architecture which defines a model for component assembly should be prescribed first, and a systematic specification method based on this model be defined, so we can build a system environments for making specifications and development of each component by the consistent scheme. In this study, we propose a domain architecture model for implementing the pUblic component bank as a project supported by the ministry of information and communication, discuss the conceptual model of specification for developing components of storing component bank, specification steps, specification approach for application of business domains and the development results of them.

• Proceedings of the Korean Reliability Society Conference
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• 2004.07a
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• pp.183-190
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• 2004

Found important components in terms of frequency in the assembly (but not in terms of money). Component 39*** was most important. The failure mode was N69(no light on warning signal the cause of the failure was C15(bad connection). Formed a population for each component. Performed reliability and warranty cost analyses At the component level. At the subsystem level. At the system level. **They don'l trust the warranty cost analysis.** Reliability improvement. Among all the subsystems front \ulcorner subsystem is most vulnerable (among other things due to the large number of components in it), especially components 39*** and 28***.

• Steel and Composite Structures
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• v.18 no.5
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• pp.1305-1330
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• 2015

The successful application of the component-based approach - widely used to model structural joints - requires knowledge of the mechanical properties of the constitutive joint components, including an appropriate assembly procedure to derive the joint properties. This paper presents a component-method model for a structural joint component that is located in the tension zone of blind-bolted connections to concrete-filled tubular steel profiles. The model relates to the response of blind-bolts with headed anchors under monotonic loading, and the blind-bolt is termed the "Extended Hollo-bolt". Experimental data is used to develop the model, with the data being collected in a manner such that constitutive models were characterised for the principal elements which contribute to the global deformability of the connector. The model, based on a system of spring elements, incorporates pre-load and deformation from various parts of the blind-bolt: (i) the internal bolt elongation; (ii) the connector's expanding sleeves element; and (iii) the connector's mechanical anchorage element. The characteristics of these elements are determined on the basis of piecewise functions, accounting for basic geometrical and mechanical properties such as the strength of the concrete applied to the tube, the connection clamping length, and the size and class of the blind-bolt's internal bolt. An assembly process is then detailed to establish the model for the elastic and inelastic behaviour of the component. Comparisons of model predictions with experimental data show that the proposed model can predict with sufficient accuracy the response of the component. The model furthers the development of a full and detailed design method for an original connection technology.

• Industrial Engineering and Management Systems
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• v.12 no.4
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• pp.330-335
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• 2013

A surface mount device (SMD) assembles electronic components on printed circuit boards (PCB). Since a component assembly process is a bottleneck process in a PCB assembly line, making an efficient SMD plan is critical in increasing the PCB assembly line productivity. Feeder assignment is an important part of the SMD plan optimization. In this paper, we propose a feeder re-assign improvement algorithm for a specific type of SMD machine with a piano type multi-head gantry. Computational results on some real-world benchmark data sets show the effectiveness of our proposed algorithm.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1063-1068
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• 2004

A numerical study is performed to predict the effect of operating conditions on the thermal response of electronic assemblies during infrared reflow soldering. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated, and the predictions illustrate the detailed thermal responses. Parametric study is performed to determine the thermal response of electronic assemblies to various conditions such as conveyor speed, exhaust velocity, and component emissivity. The predictions of the detailed electronic assembly thermal response can be used in selecting the oven operating conditions to ensure proper soldering and minimization of thermally-induced electronic assembly stresses.