• Title/Summary/Keyword: Columnar Structure

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Analysis on Groundwater Flow According to Low Permeable Layer Structure over Seongsan Watershed of Jeju Island (제주도 성산유역의 저투수층 구조에 따른 지하수 흐름 분석)

  • Kim, Min-Chul;Yang, Sung-Kee;Oh, Seung-Tae
    • Journal of Environmental Science International
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    • v.24 no.4
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    • pp.449-459
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    • 2015
  • The depth of low permeable layer in Jeju Island was analyzed using the geologic columnar section data. The highest low permeable layer was found in center of Mt. Halla and the deepest area was in eastern part of Jeju Island. The study area, Seongsan watershed, is located in the eastern part of Jeju where the low permeable layer showing deep in a northward direction. Based on this analysis, the MODFLOW modeling was performed for groundwater flow of Seongsan watershed. The boundary of Seongsan watershed was set up as a no-flow and the modeling result showed the difference -0.26~0.62 m compared to the observed groundwater level. Meanwhile, MODFLOW model results considering low permeable layer showed -0.26~0.36 m differences compared to groundwater level and indicated more accurate than no-flow method result. Therefore, to interpret the groundwater flow over Seongsan watershed, comprehensive consideration including the low permeable layer distribution below the basalt layer is needed.

Low Temperature Deposition of $\mu$ c-Si:H Films by Hot Wire CVD (Hot Wire CVD법에 의한 미세결정 실리콘 박막의 저온 증착)

  • Lee, Jeong-Chul;Kan, Ki-Whan;Kim, Seok-Ki;Yoon, Kyung-Hoon;Song, Jin-Soo;Park, I-Jun
    • Proceedings of the KIEE Conference
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    • 2000.07c
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    • pp.1763-1765
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    • 2000
  • This paper presents deposition and characterizations of microcrystalline silicon ($\mu$ c-Si:H) films prepared by hot wire chemical vapor deposition at substrate temperature at 300$^{\circ}C$. The flow rates of $SiH_4$ gas are critical parameter for the formation of Si films with microcrystalline phase. We could obtain $\mu$ c-Si:H with columnar grain structure and volume fraction of 75% without H2 dilution. The electronic properties, hydrogen bonding configurations, and $H_2$ concentration inside the films are also strongly affected by $SiH_4$ flow rate, which is provided in this paper.

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The Effect of Si Underlayer on the Magnetic Properties and Crystallographic Orientatation of CoCr(Mo) Thin Film (CoCr(Mo) 박막의 자기적 특성 및 미세구조에 미치는 Si 하지층의 영향)

  • 이호섭;남인탁
    • Journal of the Korean Magnetics Society
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    • v.9 no.5
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    • pp.256-262
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    • 1999
  • Sputter deposited CoCr(Mo)/Si film were studied with emphasis on the correlation between magnetic properties and crystallographic orientation. The perpendicular coercivities of CoCr films decreased with Si underlayer thickness, whereas those of CoCrMo films increased with Si underlayer thickness. It has been explained that additions of the larger atomic radius Mo atoms in CoCr films impedes crystal growth resulting in a decrease in grain size, thus this small grain size may induce high perpendicular coercivity. The c-axis alignment of CoCrMo film was improved due to addition of 2at.%Mo. It means CoCrMo layer grow self-epitaxial directly from orientation and structure of Si underlayer when the main layer grow on underlayer.

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Microstructure and electrical properties of high power laser thermal annealing on inkjet printed Ag films

  • Yoon, Yo-Han;Yi, Seol-Min;Yim, Jung-Ryoul;Lee, Ji-Hoon;Joo, Young-Chang
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.36.2-36.2
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    • 2009
  • In this work, the high power CW Nd:YAG laser has been used for thermal treatment of inkjet printed Ag films-involving eliminating organic additives (dispersant, binder, and organic solvent) of Ag ink and annealing Ag nanoparticles. By optimizing laser parameters, such as laser power and defocusing value, the laser energy can totally be converted to heat energy, which is used to thermal treatment of inkjet printed Ag films. This results in controlling the microstructures and the resistivity of films. We investigated the thermal diffusion mechanisms during laser annealing and the resulting microstructures. The impact of high power laser annealing on microstructures and electrical characteristic of inkjet printed Ag films is compared to those of the films annealed by a conventional furnace annealing. Focused ion beam (FIB) channeling image shows that the laser annealed Ag films have large columnar grains and dense structure (void free), while furnace annealed films have tiny grains and exhibit void formation. Due to these microstructural characteristics of laser annealed films, it has better electrical property (low resistivity) compared to furnace annealed samples.

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Deposition of Cu-Ni films by Magnetron Co-Sputtering and Effects of Target Configurations on Film Properties

  • Seo, Soo-Hyung;Park, Chang-Kyun;Kim, Young-Ho;Park, Jin-Seok
    • KIEE International Transactions on Electrophysics and Applications
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    • v.3C no.1
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    • pp.23-27
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    • 2003
  • Structural properties of Cu-Ni alloy films, such as preferred orientation, crystallite size, in-ter-planar spacing, cross-sectional morphology, and electrical resistivity, are investigated in terms of tar-get configurations that are used in the film deposition by means of magnetron co-sputtering. Two different target configurations are considered in this study: a dual-type configuration in which two separate tar-gets (Cu and Ni) and different bias types (RF and DC) are used and a Ni-on-Cu type configuration in which Ni chips are attached to a Cu target. The dual-type configuration appears to have some advantages over the Ni-on-Cu type regarding the accurate control of atomic composition of the deposited Cu-Ni alloy. However, the dual-type-produced film exhibits a porous and columnar structure, the relatively large internal stress, and the high electrical resistivity, which are mainly due to the relatively low mobility of adatoms. The affects of thermal treatment and deposition conditions on the structural and electrical properties of dual-type Cu-Ni films are also discussed.

The Fire Dispersive Patterns of the Power Cord Sets for Low Voltage Appliances in Wall-modeling (벽면 모델링을 이용한 저압용 일체형 코드의 화재확산 패턴)

  • Shong, Kil-Mok;Kim, Hyang-Kon;Kim, Dong-Ook;Kim, Dong-Woo;Kim, Young-Seok;Choi, Chung-Seog
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2004.05a
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    • pp.330-334
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    • 2004
  • In this paper, we studied on the fire dispersive patterns and the fire progress at the power cord sets for low voltage appliances in the wall-model. For the experiment, we manufactured a wall-model and applied the external flame at the power cord sets. From the results, short-circuit of the power cord sets was haunted by the external flame it was disconnected with the flashing and the scattering. The fire progress on the polyvinyl chloride insulated flexibel cords is not observed because the ignition energy decreases. In case of rubber insulated flexible cords, however, the fire was progressed continuously. Molten marks were formed at a two electric wire by continuous electric discharge in power source part. A large molten mark was formed in load part. And the columnar structure and voids were observed in molten wire.

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Corrosion Characteristics of Ti, Ti/Cr Coated and Plasma-Nitrided Surface for Stainless Steel Containing Ti (Ti가 함유된 스테인리스강에서 Ti, Ti/Cr 코팅표면과 플라즈마질화표면의 부식특성)

  • 최한철;이승훈;김관휴
    • Journal of the Korean institute of surface engineering
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    • v.36 no.1
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    • pp.89-98
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    • 2003
  • Corrosion characteristics of Ti, Ti/Cr coated and plasma-nitrided surface for stainless steel containing Ti have been studied. Stainless steels containing 0.09-0.92wt% Ti were fabricated by using vacuum furnace and solutionized for 1hr at $1050^{\circ}C$. Ti and Cr coatings were done on solutionized stainless steel surface by EB-PVD. The Ti coated specimen were coated by Cr and were nitrided by plasma at $450^{\circ}C$ for 5hr Microstructure and phase analysis were performed using SEM, OM and EDX. Corrosion behavior of the coated specimen was investigated by electrochemical test. The coated surface was of fine columnar structure. The Ti/Cr coated surface was denser than the Ti coated and the Ti coated-nitrided surfaces. The corrosion and pitting potential increased in proportion to the Ti content, coating temperature, coating thickness and formation of stable oxide film. The current density in active and passive region decreased in the case of Ti/Cr coated sample and Ti coated-nitrided samples. Especially the plasma nitrided specimen after Ti coating have a good corrosion resistance compared with the Ti coated specimen. The number and size of pits decreased as Ti content of matrix increased.

Oxidation of CrAlN and CrZrN Films (CrAlN과 CrZrN의 산화)

  • Kim, Min-Jeong;Kim, Seul-Gi;Lee, Sang-Yul;Lee, Dong-Bok
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2011.05a
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    • pp.33-35
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    • 2011
  • Films of CrAlN and CrZrN were deposited on a steel substrate by closed field unbalanced magnetron sputtering, and their oxidation behaviors were investigated. CrAlN films consisted of dense, polycrystalline CrN and AlN fine columns. The formed oxides consisted primarily of crystalline $Cr_2O_3$ incorporated with $Al_2O_3$. The oxide layers were thin and compact so as to make CrAlN films more protective than CrN films. In case of CrZrN films, Zr atoms were dissolved in the CrN phase. Zr atoms advantageously refined the columnar structure, reduced the surface roughness, and increased the micro-hardness. However, the addition of Zr did not increased oxidation resistance, mainly because Zr was not a protective element. All the deposited films displayed relatively good oxidation resistance, owing to the formation of the highly protective $Cr_2O_3$ on their surface. The $Cr_{40}Zr_9N$ and $Cr_{31}Zr_{16}N$ films oxidized to $Cr_2O_3$ as the major phase and ${\alpha}-ZrO_2$ as the minor one, whereas the CrN film oxidized to $Cr_2O_3$.

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Modulated Pulse Power Sputtering Technology for Deposition of Al Doped ZnO Thin Film (Al doped ZnO 박막 증착을 위한 모듈레이티드 펄스 스퍼터링)

  • Yang, Won-Kyun;Joo, Jung-Hoon
    • Journal of the Korean institute of surface engineering
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    • v.45 no.2
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    • pp.53-60
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    • 2012
  • Modulated Pulse Power (MPP) magnetron sputtering is a new high-power pulsed magnetron sputtering (HPPMS) technology which overcomes the low deposition rate problem by modulating the pulse voltage shape, amplitude, and the duration. Highly ionized magnetron sputtering can be performed without arcing because it can be controlled as multiple steps of micro pulses within one overall pulse period in the range of 500-3,000 ${\mu}s$. In this study, the various waveforms of discharge voltage and current for micro pulse sets of MPP were investigated to find the possibility of controlling the strongly ionized plasma mode. Enhanced ionization of the sputtered metal atoms was obtained by OES. Large grained columnar structure can be grown by the strongly ionized plasma mode in the AZO deposition using MPP. In the most highly ionized deposition condition, the preferred orientation of (002) plane decreased, and the resistivity, therefore, increased by the plasma damage.

Investigation of Geometrical Properties on Deposition Rate in Cesium Iodine Film (증착속도에 따른 CSI layer의 기하학적 특성 연구)

  • Lee, Kyu-Hong;Park, Ji-Koon;Kang, Sang-Sik;Cha, Byung-Yul;Cho, Sung-Ho;Nam, Sang-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.11a
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    • pp.415-417
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    • 2003
  • CsI 형광체는 X선에 대한 분해능 및 변환효율이 우수한 물질이다. 최근 대면적 평판형 X선 영상검출기의 변환층으로 이용하기 위해 CsI 형광체의 대면적 제조에 대한 연구가 활발히 진행되고 있다. 본 논문은 진공 열증착법을 이용하여 증착속도(3, 3.8, $4.5\;{\mu}m/min$)에 따라 $20\;{\mu}m$ 두께의 CsI 필름을 제조하였고, XRD 및 SEM 분석을 통해 CsI 필름의 기하학적 구조를 조사하였다. 증착된 CsI 필름은 증착속도에 관계없이 복잡한 다결정 구조를 가지며, $3\;{\mu}m/min$의 증착속도에서 약 $1\;{\mu}m$ 크기로 needle-like 한 columnar structure를 가졌다. As results, about 3um/min evaporation rate formed as good geometry characteristics CsI layer.

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