• Korean Journal of Materials Research
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• v.15 no.6
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• pp.426-430
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• 2005

Chemical mechanical polishing (CMP) is an essential process in the production of integrated circuits containing copper interconnects. The effect of alanine in reactive slurries representative of those that might be used in copper CMP was studied with the aim of improving selectivity between copper(Cu) film and tantalum-nitride(TaN) film. We investigated the pH effect of nano-colloidal silica slurry containing alanine through the chemical mechanical polishing test for the 8(inch) blanket wafers as deposited Cu and TaN film, respectively. The copper and tantalum-nitride removal rate decreased with the increase of pH and reaches the neutral at pH 7, then, with the further increase of pH to alkaline, the removal rate rise to increase soddenly. It was found that alkaline slurry has a higher removal rate than acidic and neutral slurries for copper film, but the removal rate of tantalum-nitride does not change much. These tests indicated that alanine may improve the CMP process by controlling the selectivity between Cu and TaN film.

• Transactions on Electrical and Electronic Materials
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• v.7 no.4
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• pp.167-172
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• 2006

Submicron colloidal silica coated with ceria were prepared by mixing of silica and nano ceria particles and modified by hydrothermal reaction. The polishing efficiency of the ceria coated silica slurry was tested over oxide film on silicon wafer. By changing the polishing pressure in the range of $140{\sim}420g/cm^2$ with the ceria coated silica slurries in $100{\sim}300nm$, rates, WIWNU and friction force were measured. The removal rate was in the order of 200, 100, and 300 nm size silica coated with ceria. It was known that the smaller particle size gives the higher removal rate with higher contact area in Cu slurry. In the case of oxide film, the indentation volume as well as contact area gives effect on the removal rate depending on the size of abrasives. The indentation volume increase with the size of abrasive particles, which results to higher removal rate. The highest removal rate in 200 nm silica core coated with ceria is discussed as proper combination of indentation and contact area effect.

• Journal of Ceramic Processing Research
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• v.13 no.spc2
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• pp.428-432
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• 2012

Polyamidimide (PAI)-colloidal silica (CS) nanohybrid films were synthesized by an advanced sol-gel process. The synthesized PAI-CS hybrid films have a uniform and stable chemical bonding and there is no interfacial defects observed by TEM. The thermal degradation ratio of PAI-CS (10 wt%) hybrid films is delayed by 100 ℃ compared with pure PAI sample determined by on set temperature range in TGA. The dielectric constant of PAI-CS (10 wt%) hybrid films decreases with increasing CS content up to about 5 wt% but increases at higher CS content, which is not explained simply by effective medium therories (EMT). The duration time of PAI-CS (10 wt%) hybrid coil is 38 sec, which is very longer than that of pure PAI coil sample. The PAI-CS (10 wt%) hybrid film has a higher breakdown voltage resistance than the pure PAI film at surge environment and exhibits superior heat resistance. The PAI-CS (10 wt%) sample shows the advanced and stable thermal emission properties in transformer module compared with the pure PAI sample. This result illustrates that the advanced thermal conductivity and expansion properties of PAI-CS sample in the case of appropriate sol-gel processes brings the stable thermal emission in transformer system. Therefore, new PAI-CS hybrid samples with such stable thermal emission properties are expected to be used as a high functional coating application in ET, IT and electric power products.

• Journal of Adhesion and Interface
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• v.4 no.1
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• pp.9-17
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• 2003

The UV hard coating materials are attracting more and more attention to modern industry, in terms of the development of low or non solvent coating materials which will contribute to economizing both materials and energy and to reducing pollution. This study was performed in order to invent UV curable coating materials containing colloidal silica which have actual industrial applications. As results of experiments, the oligomers type and the concentration of colloidal silica acrylate oligomer (SAOC) have an influence on various especially, The properties of UV hardening cooling, such as chemical, abrasion resistance and weatherability, were greatly enhanced, the impact properties of coated polycarbonate substrate were improved compared with the noncoated that. The UV cured films containing 30 wt% SAOC obtained showed the best properties.

• Applied Chemistry for Engineering
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• v.23 no.1
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• pp.53-58
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• 2012

In order to improve the surface hardness of transparent plastic films, an organic-inorganic hybrid coating solution was sunthesized by the sol-gel method. Coating solutions that were prepared colloidal silica (CS), poly methyl methacrylate (PMMA), vinyltrimethoxysilane (VTMS), and [3-(methacryloyloxy)]propyltrimethoxy silane (MAPTMS) was varied with synthesizing parameters such as kinds of organic silane and weight ratio of CS to PMMA. Such coating solution was bar coated on the PET film, cured, and investigated on the chemical and physical properties of coating film. The organic-inorganic hybrid coating solutions have better properties at the pencil hardness and adhesion of coating film than those of an organic material such as PMMA.

• Journal of the Korean Ceramic Society
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• v.41 no.10 s.269
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• pp.766-770
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• 2004

High-transmittance film was coated by using spherical silica nano colloids. Silica colloid sol was preservred between two inclined slide glasses by capillary force, and particles were stacked to form a film onto the substrate as the upper glass was sliding. As the sliding speed increased, the thickness of the film decreased and light transmittance varied. The microstructure observed by SEM showed that silica particles were nearly close packed, which enabled the calculation of the effective refractive index of the film. The film thickness calculated from the wavelength of maximum transmittance and the effective refractive index was well coincided with the thickness observed by SEM and measured by profiler. The maximum transmittance of $94.7\%$ was obtained. This means that $97.4\%$ of transmittance or $1.3\%$ of reflectance can be achieved by simple process if both sides of the substrate are coated.

• Polymer(Korea)
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• v.29 no.3
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• pp.242-247
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• 2005

Two kinds of colloidal silica(CS)/silane sol solutions were prepared in variation with synthesizing parameters such as kinds of CS, ratio of CS to silane and reaction time. Such sol solutions were obtained from 1034A Cs/methyl-trimethoxysilane(MTMS) and HSA CS/MTMS solutions. In the case of 1034A CS/MTMS CS/silane sol, coating film had high contact angle and more enhanced flat surface than those in the case of HSA CS/MTMS sol. In the case of thermal stability, thermal dissociation of 1034A CS/MTMS sol did not occur up to $550^{circ}$. The thickness of coating film obtained from 1034A CS/MTMS sol increased with increasing the amount of MTMS. The hardness of coating films obtained from 1034A CS/MTMS sol decreased with increasing the amount of MTMS. Surface free energy of CS/silane sol-gel coating film decreased with increasing amount of MTMS.

• Applied Chemistry for Engineering
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• v.22 no.6
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• pp.691-696
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• 2011

Organic-inorganic hybrid coating solutions were prepared by using a sol-gel method for transparent film. In this study, colloidal silica (CS) and alkoxy silane such as vinyltrimethoxysilane (VTMS), and [3-(methacryloyloxy)]propyltri methoxy silane (MAPTMS) were used in various conditions such as types of organic silane, weight ratios of CS to silane and reaction times. Coating solutions which were bar coated on the PET (polyethyleneterephthalate) film and cured were investigated on the chemical and physical properties. The pencil hardness and adhesion of coating films were increased with increasing the organic silane content in the coating solution compared to that of PMMA (polymethamethylcrylate) coating solution.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.545-545
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• 2008

Poly-Si is an essential material for floating gate in NAND Flash memory. To fabricate this material within region of floating gate, chemical mechanical polishing (CMP) is commonly used process for manufacturing NAND flash memory. We use colloidal silica abrasive with alkaline agent, polymeric additive and organic surfactant to obtain high Poly-Si to SiO2 film selectivity and reduce surface defect in Poly-Si CMP. We already studied about the effects of alkaline agent and polymeric additive. But the effect of organic surfactant in Poly-Si CMP is not clearly defined. So we will examine the function of organic surfactant in Poly-Si CMP with concentration separation test. We expect that surface roughness will be improved with the addition of organic surfactant as the case of wafering CMP. Poly-Si wafer are deposited by low pressure chemical vapor deposition (LPCVD) and oxide film are prepared by the method of plasma-enhanced tetra ethyl ortho silicate (PETEOS). The polishing test will be performed by a Strasbaugh 6EC polisher with an IC1000/Suba IV stacked pad and the pad will be conditioned by ex situ diamond disk. And the thickness difference of wafer between before and after polishing test will be measured by Ellipsometer and Nanospec. The roughness of Poly-Si film will be analyzed by atomic force microscope.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.10 no.4
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• pp.309-317
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• 2000

Langasite is a promising new piezoelectric material for SAW filter application. Little was known until recently about the methods needed to mechanically polish and chemically polish/etch this material. In this experiment, polishing, slurry chemistry and chemical wet etching for langasite is described. Conventional quartz and LN ($LiNbO_3$) polishing methods did not produce satisfactory polished surfaces, and polishing with a colloidal silica slurries has shown to be most effective. The optimum condition was investigated by changing the slurry chemistry. As the planarization effect is very important in SAW filter applications, the examination of the effective particle number effect and the particle size effect was carried out. Z-cut langasite surface which had been polished with the colloidal silica slurries was etched in a variety of etchants. Conventional quartz etchants destroyed the polished surface. Other etchants formed a thin film on the surfaces. In this experiment, the reaction between langasite and a few etching solution was analysed. And an appropriate selective etchant solution for analyzing the defects was synthesized.