• Journal of the Korean Society for Heat Treatment
• /
• v.31 no.1
• /
• pp.18-23
• /
• 2018

In this study, low cyclic fatigue test was carried out at room temperature condition for rolled STS304 steel. The results of this study show that rolled STS304 steel has excellent static tensile strength and fatigue characteristics. The relationship between plastic strain range and fatigue life was examined using the triangular wave in order to predict the low cycle fatigue life of rolled STS304 steel by Coffin-Manson equation. Cyclic behavior of rolled STS304 steel was characterized by cyclic hardening with increasing number of cycle through the Hysteresis loop analysis and cyclic response of maximum stress versus number of cycles. It is found that the plastic deformation energy consumed per cycle is reduced by calculating the area of the hysteresis loop.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.41 no.8
• /
• pp.765-770
• /
• 2017

GTD111 DS of nickel base superalloy has been used for gas turbine blades. In this study, low cycle fatigue test was conducted on the GTD111 DS alloy by setting conditions similar to the real operating environment. The low cycle fatigue tests were conducted at room temperature, $760^{\circ}C$, $870^{\circ}C$, and various strain amplitudes. Test results showed that fatigue life decreased with increasing total strain amplitude. Cyclic hardening response was observed at room temperature and $760^{\circ}C$; however, tests conducted at $870^{\circ}C$ showed cyclic softening response. Stress relaxation was observed at $870^{\circ}C$ because creep effects occurred from holding time. A relationship between fatigue life and total strain range was obtained from the Coffin-Manson method. The fratography using a SEM was carried out at the crack initiation and propagation regions.

• Journal of Navigation and Port Research
• /
• v.29 no.10 s.106
• /
• pp.871-876
• /
• 2005

Application of semiconductor sensors has been widely spreaded into various industries because those have several merits like easy miniaturization and batch production comparison with previous mechanical sensors. But external conditions such as thermal and repetitive load have a bad effect on sensors's lifetime. Especially, this paper was focused on fatigue life of a interconnect made by various materials. Firstly we implemented the stress analysis for interconnect under thermal load and wording pressure. And the fatigue lifetime of each material was induced by Manson & Coffin Equation using the plastic stress-strain curve obtained by the plastic-elastic Finite Element Analysis. The Fatigue lifetime in its bottom is smaller than others and bending load have not an effect on the fatigue lifetime of the interconnect but the stress distribution.

• Proceedings of the Korean Society of Propulsion Engineers Conference
• /
• 2009.05a
• /
• pp.18-21
• /
• 2009

The life of components under high thermal load is typically shorter than other components. The turbopump turbine of liquid rocket is operated under these environments like high temperature and high centrifugal dorce due to high rotating velocity during operating time. These conditions may often cause low-cycle fatigue problem in the turbopump turbine. First of all, to analyze heat stress, ABAQUS/CAE is used and Coffin-manson's equation is used to consider elasticity and plasticity strain. S.W.T's method is used to consider the mean stress effect, using strain history, low-cycle fatigue analysis is done for turbopump turbine which may have FCL(fracture critical location). In this paper, strain life method is applied to analyze low-cycle fatigue.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.36 no.8
• /
• pp.835-841
• /
• 2012

We measured the mechanical and thermal properties of four types of cast irons used for manufacturing the brake discs of railway vehicles. It was found that these properties could be controlled by varying the composition of Ni, Cr, and Mo. Thermal fatigue tests were carried out by using a thermal fatigue tester in which thermal cycles could be controlled. Thermal crack initiation and propagation were measured on cylindrical specimens. Finally, we simulated the thermal fatigue test procedure by finite element analysis and calculated the thermal fatigue lifetimes by Manson-Coffin's equation and the maximum principal strain. The estimated thermal fatigue lifetimes corresponded to the measured lifetimes when the total crack length was $40{\mu}m{\sim}1mm$.

• Journal of Welding and Joining
• /
• v.17 no.1
• /
• pp.124-132
• /
• 1999

Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

• 한국신재생에너지학회:학술대회논문집
• /
• 2011.11a
• /
• pp.62.2-62.2
• /
• 2011

To guarantee 20-25 years to the lifetime of the PV modules without failure, reliability test of the module is very important. Field-aged test of the outdoor environment is required. However, due to time constraints, accelerated testing is required to predict the lifetime of PV modules and find causes of failure. Failure is caused by many complex phenomena. In this study, we experimented two accelerated tests about corrosion and fatigue, respectively. First, temperature cycling test for fatigue were tested and Coffin-Manson equation was analyzed. Second, damp heat test for corrosion were tested and Eyring equation were analyzed. Finally, using two-mode failure model, we suggest a new lifetime model that analyze the phenomenon by combining two kinds of data.

• International Journal of Korean Welding Society
• /
• v.4 no.1
• /
• pp.61-66
• /
• 2004

In this paper, the effect of underfill packages was investigated by numerical approach and experimental test. Reliability improvement was the main issue in the package technology. BGA, CSP and small-sized packages, have problems due to concentration of the stress in solder joints. One of the latest technologies to overcome is underfill encapsulant. Mainly, it is noticed the effect of the underfill in the packages. The predicted thermal fatigue lifes are performed by Coffin-Manson's equation with ANSYS (v.5.62). Also, thermal cycle test during from 218K to 423K was included. Finally we could find that underfill greatly reduce the concentration stress in solder joint, thus the fatigue life was improved than without underfill.

• Journal of Welding and Joining
• /
• v.21 no.4
• /
• pp.25-30
• /
• 2003

There have been many researches for small scale packages such as CSP, BGA, and Flipchip. Underfill encapsulant technology is one of the latest assembly technologies. The underfill encapsulant could enhance the reliability of the packages by flowing into the gap between die and substrate. In this paper, the effects of underfill packages by both aspects of thermal and mechanical reliabilities are studied. Especially, it is focused to value board-level reliability whether by the underfill is applied or not. First of all, The predicted thermal fatigue lifes of underfilled and no underfilled $\mu$ BGA solder joints are performed by Coffin-Manson's equation and FEA program, ANSYS(version 5.62). Also, the thermal fatigue lifes of $\mu$ BGA solder joints are experimented by thermal cycle test during the temperature, 218K to 423k. Consequently, both experimental and numerical study show that $\mu$ BGA with underfill has over ten times better fatigue lift than $\mu$ BGA without underfill.

• Journal of the Korean Society of Safety
• /
• v.33 no.3
• /
• pp.8-14
• /
• 2018

Ni-base superalloy has excellent resistance to extreme environments such as high temperatures and high stresses and are used as materials for large gas turbines. In this paper, the specimens were taken from the blade that were used for a long time, and their life span was studied by microstructure analysis and avoidance of cursing. The microstructural analysis of the specimens was carried out using a OM and SEM to observe the coarsening, carbides on gamma prime. Low-cycle fatigue tests were performed on new material and airfoil of long time-used blade. The test was conducted under various deformation conditions and temperature conditions of $760^{\circ}C$ and $870^{\circ}C$. The low cycle fatigue test was carried out using the Coffin-Manson equation and the fatigue life was predicted. After the test, crack path and fracture surface were analyzed using SEM.