• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1346-1348
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• 2001

Generally, Invar alloy shows very low thermal expansion characteristics, lower than $2{\times}10^{-6}$/K approximately. To apply Fe-Ni-Co-C Invar alloy as a core material for large ampacity transmission line we studied the effects of magnetic properties on coefficient of thermal expansion. The coefficient of thermal expansion(CTE) suddenly decreases with addition of a little carbon(0.08%), increases with the increasing carbon and has a constant value at the composition over than 1.0%C. The trend of Curie temperature change with carbon is similar with that of CTE. Therefore, the CTE has a linear relationship with Curie temperature. However, the CTE linearly decreases with the ratio of saturation magnetization and Curie temperature(${\sigma}_s/T_c$).

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1315-1320
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• 2003

The thermal expansion coefficient, which causes the micro failure at the interfacial state of thin films is necessary to consider for proper designing MEMS. The effect of temperature on the coefficient of thermal expansion(CTE) of $SiO_2$ and $Si_3N_4$ film was investigated. Thermal strain induced by mismatch of CTE between substrate and thin film continuously measured with resolution-improved electronic speckle pattern interferometry(ESPI). The thermal stress induced by mismatch of CTE derivate through thermal strain. The thermal expansion coefficients of thin film were calculated with the general equation of CTE and thermal stress in thin films, and it confirmed that CTE of $SiO_2$changed from $0.25{\times}10^{-6}/^{\circ}C$ to $1.4{\times}10^{-6}/^{\circ}C$ with temperature increasing from 50 to $600^{\circ}C$

• Korean Journal of Materials Research
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• v.24 no.10
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• pp.515-519
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• 2014

The aim of this paper is to consider the effect of annealing on the coefficient of thermal expansion (CTE) of electroplated Invar Fe-Ni alloy. The CTE of the as-electroplated alloy is lower than those of alloys annealed at $400^{\circ}C$ and $800^{\circ}C$. XRD peaks become sharper as the as-electroplated alloy is annealed, which means the grain growth. The average grain sizes of as-electroplated and as-annealed alloys at $400^{\circ}C$ and $800^{\circ}C$ are 10 nm, 70 nm, and $2{\mu}m$, respectively, as determined by TEM and EBSD analyses. The CTE variation for the various grain sizes after annealing may come from the magnetostriction effect, which generates strain due to changes in the magnetization state of the alloys. The thermal expansion coefficient is considered to be affected by nano grain size in electroplated Fe-Ni Invar alloys. As grain size decreases, ferromagnetic forces might change to paramagnetic forces. The effect of lattice vibration damping of nano grain boundaries could lead to the decrease of CTE.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.192-197
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• 2004

The anisotropy in coefficient of thermal expansion (CTE) between the in-plane and out-of-plane of 3-dimensional thick composite structures induces residual stresses and the large void content due to insufficient compaction of fabric composites, which results in low interlaminar strengths. In order to reduce the through thickness CTE and the void content, in this work, carbon fabric phenolic laminates were compacted by pressure generated by autoclave and a compressive jig, from which the through-thickness CTEs and the void contents were measured. From the measurement, it was found that the through-thickness CTE and the void content had different characteristics from ordinary composites due to gas produced during the cure reaction of phenolic resin.

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1064-1069
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• 2010

Thin films have been used in a large variety of technological applications such as solar cells, optical memories, photolithographic masks, protective coatings, and electronic contacts. If thin films experience frequent temperature changes, thermal stresses are generated due to the difference in the coefficient of thermal expansion between the film and substrate. Thermal stresses may lead to damage or deformation in thin film used in electronic devices and micro-machined structures. Thus, knowledge of the thermomechanical properties of thin films, such as the coefficient of thermal expansion, is an important issue in determining the stability and reliability of the thin film devices. In this study, thermal cycling of Cu and Ag thin films with various microstructures was employed to assess the coefficient of thermal expansion of the films. The result revealed that the coefficient of thermal expansion (CTE) of the Cu and Ag thin films increased with an increasing grain size. However, the effect of film thickness on the CTE did not show a remarkable difference.

• Journal of the Korean Society for Heat Treatment
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• v.34 no.5
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• pp.226-232
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• 2021

The relationship between precipitation and coefficient of thermal expansion of Al-6%Si-0.4%Mg-0.9%Cu-(Ti) alloy (in wt.%) after various heat treatments were studied by the thermodynamic analyzer (TMA) and differential scanning calorimetry (DSC). Solution heat treatment of the alloy was carried out at 535℃ for 6 h followed by water quenching, and the samples were artificially aged in the air at 180℃ and 220℃ for 5 h. The coefficient of thermal expansion (CTE) curve showed some residual strain and decreased with increasing aging temperature. The CTE curves changed sharply in the temperature range of 200℃ to 400℃, and the corresponding peak shifted for the aged samples due to the change in the precipitation behavior of the secondary phase. These transformation peaks in the aged sample are related to the volume of the precipitation of the Si phase as determined by DSC analysis. The change in CTE is mainly caused by the precipitation of the Si phase in the Al-Si alloy, and the size of the change occurs simultaneously with the size of the precipitate.

• Polymer(Korea)
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• v.34 no.4
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• pp.352-356
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• 2010

The effects of the filler shapes and contents on the coefficient of thermal expansion (CTE) for polypropylene (PP) composites which included three dimensional ellipsoids ($a_1>a_2>a_3$), as determined by two aspect ratios (${\rho}_\alpha=a_1/a_3$ and ${\rho}_\beta=a_1/a_2$) were analyzed by the theoretical approach proposed by Lee and Paul and compared with the experimental results. The shapes of fillers in the composites were various, such as spherical, fiber, disc, and ellipsoid, using barium sulfate, glass fiber, and mica. The longitudinal CTE of barium sulfate whose shape was sphere ($\rho_\alpha=\rho_\beta=1$) decreased. For the glass fiber, primary aspect ratio decreased with the filler content, and longitudinal CTE decreased as filler contents increased. Normal CTE initially increased in the lower filler content. For the mica, longitudinal and transverse CTE decreased but normal CTE increased in the lower filler content like predicted values.

• Journal of Technologic Dentistry
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• v.31 no.4
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• pp.25-30
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• 2009

Zirconia($ZrO_2$) has attracted much attention in science and technology because of its high refractive index, high melting temperature, hardness, low thermal conductivity and corrosion barrier properties. And it is widely used as the dental restoration material because of its esthetic appearance. In this research, we analyzed the particle size and composition of the imported dental porcelain for zirconia. And the glass frit was produced. To decrease the glass transition temperature and softening temperature of the glass frit, $Li_2O$ was added into it and the effect of $Li_2O$ on the firing temperature was researched. Then the glass which contains leucite crystal with a high coefficient of thermal expansion(CTE) was manufactured and it was mixed with the glass frit to control the CTE. The phase composition were analyzed using the X-ray diffraction. The morphologies of the samples were observed by the scanning electron microscope. The 4wt% $Li_2O$-added glass frit has the optimal glass transition temperature and softening temperature. And 6 wt% leucite crystal was mixed with the glass frit to control the CTE. From the experimental results of crystallization, the crystal phase was found only leucite crystal.

• Progress in Superconductivity and Cryogenics
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• v.14 no.4
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• pp.24-27
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• 2012

The measurement of the coefficient of thermal expansion (CTE) of polypropylene laminated paper (PPLP) as electric insulating material is important for its practical superconducting device application. The thermal strain induced to HTS tapes and its insulating material during cooling from room temperature might largely affect the critical current ($I_c$) of HTS tapes. In this study, the thermal contraction of PPLP material was measured during cooling from 300 K to 77 K using double extensometers. Initially, the CTE of a brass tape was measured and it was compared with a reference data. It was found that the measured thermal expansion data of the brass material approaches that of the reference one. Based on the results, it was then confirmed that the measurement technique could be applied to thin and flexible samples. Therefore, the same measurement procedure was applied to PPLP material using double extensometers. As a result, the linear CTE of the PPLP at 77 K has been measured to be ${\sim}15.3{\times}10^{-6}/K$. Also, it was found that the thermal contraction characteristics of PPLP was dominated by polypropylene on the cross direction (higher thermal contraction) while it was dominated by Kraft paper on the machine direction (lower thermal contraction). Overall, this measurement procedure could be adopted for the determination of CTE of flexible materials such as PPLP.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.68-73
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• 2014

Among through silicon via (TSV) technologies, for replacing Cu filling method, the method of molten solder filling has been proposed to reduce filling cost and filling time. However, because Sn alloy which has a high coefficient of thermal expansion (CTE) than Cu, CTE mismatch between Si and molten solder induced higher thermal stress than Cu filling method. This thermal stress can deteriorate reliability of TSV by forming defects like void, crack and so on. Therefore, we fabricated SiC composite filling material which had a low CTE for reducing thermal stress in TSV. To add SiC nano particles to molten solder, ball-typed SiC clusters, which were formed with Sn powders and SiC nano particles by ball mill process, put into molten Sn and then, nano particle-dispersed SiC composite filling material was produced. In the case of 1 wt.% of SiC particle, the CTE showed a lowest value which was a $14.8ppm/^{\circ}C$ and this value was lower than CTE of Cu. Up to 1 wt.% of SiC particle, Young's modulus increased as wt.% of SiC particle increased. And also, we observed cross-sectioned TSV which was filled with 1 wt.% of SiC particle and we confirmed a possibility of SiC composite material as a TSV filling material.