• Journal of Sensor Science and Technology
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• v.9 no.1
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• pp.76-82
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• 2000

PTC thermistors with multilayer structure were fabricated by internal electrode bonding technique in order to realize low resistance. MLPTC (Multilayer Positive Temperature Coefficient) possess various features, such as small size, low resistivity and large current. We describe the effect of additives on the PTC characteristics, voltage - current characteristics, temperature dependence of resistance and complex impedance spectra as a function of frequency range 100 Hz to 13MHz to determine grain boundary resistance. It was found that MLPTC thermistor has both highly nonlinear effects of temperature dependent resistance and voltage dependent current behaviors, which act as passive element with self-repair mechanisms. Decrease of room temperature resistance with increasing the number of layers was demonstrated to be a grain boundary effect. Switching characteristics of current were caused by heat capacity of PTC thermistor with multilayer structure. Switching times are lengthened by increasing the number of layers.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.473-476
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• 2003

This paper shows necessity of encapsulation layer to maximite flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer have an significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that have a significant effect on internal thermal stress. To compare magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.

• Journal of Korea Foundry Society
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• v.12 no.4
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• pp.317-325
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• 1992

Diamond is the hardest material known to humans, also possesses the highest thermal conductivity and a very low thermal expansion coefficient. Therefore, these properties of diamond make them logical choices for many difficult grinding application. Bonding material is a very important factor to performance of a grinding wheel. Grinding glass constitutes one of the major application areas of diamond grinding wheels, and Cu-Sn tin bronze matrix is widely used as a metal bond of diamond wheel in grinding glass but these studies are rarely reported. The bronze test pieces excluding diamond are sintered by the method of hot sizing respectively at $600^{\circ}C$, $650^{\circ}C$, $700^{\circ}C$, with a composition(Cu-10wt%Sn) on ${\alpha}$ phase and two compositions(Cu-20wt%Sn and Cu-23wt%Sn) on ${\alpha}+{\beta}$ phase. The rupture strength of Cu-10wt%Sn is highest. The bronze bonded diamond wheels are manufactured by same conditions as the bronze test pieces. The results of grinding ratio of wheels are highest in case of Cu-10wt%Sn bonded wheel sintered at $650^{\circ}C$ and grinding power is highest in same composition sintered at $700^{\circ}C$.

• Journal of the Korean Society for Heat Treatment
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• v.13 no.2
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• pp.91-97
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• 2000

The structure and mechanical properties of TiN and TiCN thin films deposited on STD61 steel substrates by the RF-sputtering methods has been studied by using XPS, XRD, micro-hardness tester, scratch tester, and wear-resistance tester. XPS results showed that the TiCN thin film formed with chemical bonding state. The TiN thin films grew with (111) orientation having the lowest strain energy by compressive stress, whereas the TiCN thin films grew with both (111) and (200) orientation, but (200) orientation having the lowest surface energy becomes dominant as carbon contents increase. The pre-etching treatment of substrate did not affect on the preferred orientation of thin films, but it played an important role in improving mechanical properties of thin films such as the hardness, adhesion and wear- resistance. Especially, the TiCN thin films showed the superior wear resistances due to high hardness and low friction coefficient compared with TiN thin films.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.3
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• pp.594-599
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• 2011

A SAW strain sensor based on Shear Horizontal wave with an 92 MHz central frequency was developed. It consists of SAW sensor, PCB substrate and bonding material (Loctite 401). External force applied to PCB substrate bonded to a piezoelectric substrate induces strain at the substrate surface, which causes changes in the elastic constant and density of the substrate and hence the propagation velocity of the SAW. The change in the velocity of the SAW result in a frequency shift of the sensor and by measuring a frequency shift, we can extract the strain induced by the external force. The $41^{\circ}$ YX $LiNbO_3$ was used because it has a Leaky shear horizontal(SH) wave propagation mode and a high electromechanical coupling coefficient ($K^2$=17.2%). And to compare with Rayleigh wave mode, $128^{\circ}$ YX $LiNbO_3$ was used. And to make a stable and low insert loss, Split IDT structure was used. The obtained sensitivity and linearity of the SAW strain sensor in the case of Split IDT were measured to be 17.2 kHz / % and 0.99, respectively.

• Tribology and Lubricants
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• v.29 no.6
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• pp.372-377
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• 2013

This study investigated the interface temperatures for the sliding friction of three types of pins fabricated with thermocouple wires by the suction casting method. Optical microscopy was used to examine the surrounding material state at the bonding interface with the thermocouple wires. Friction tests were performed under dry sliding conditions against stainless steel 304 at nominal stresses of 1.42-4.25 MPa and sliding speeds of 0.5-1.25 m/s. Tribological data were collected using a custom-made pin-on-disk apparatus that measured the interface temperature and corresponding friction coefficient. Static tests were performed to demonstrate the functionality and reliability of the thermocouple wires-combined temperature sensor (TCTS). Each TCTS showed good linearity and sensitivity and very similar response times for the thermocouple and critical temperature during sliding friction.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.31-36
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• 2001

Dielectric material which is suitably designed for the application of the high-temperature electrostatic chucks(HTESCS) has been developed. Electrical resistivities and dielectric constants of the dielectric layer satisfy the demands for the proper operation of HTESC, and coefficient of thermal expansion(CTE) of the dielectric material matches well that of the bottom insulator so that it secures stable structure. In order to minimize particle contaminations, borosilicate glass(BSG) is selected as a bonding layer between dielectric layer and bottom insulator, and silver is used as a electrode. BSG is solidly bonded between upper dielectric and bottom insulator, and no diffusions or reactions are observed among silver electrode, dielectric, and glass layers. The chucking characteristics of the fabricated HTESC are found to be superior to those of the commercialized one.

• Advances in concrete construction
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• v.13 no.3
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• pp.265-279
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• 2022

The roughness of substrate concrete interfaces before new concrete placement has a major effect on the interface bond behaviour. However, there are challenges associated with the consistency of the final roughness interface prepared using conventional roughness preparation methods which influences the interface bond performance. In this study, five quantitative interface roughness textures with different roughness tooth angles, depths, and tooth distribution were created to ensure consistency of interface roughness and to evaluate the bond behaviour at a precast and new concrete interface using the splitting tensile test, slant shear test, and double-shear test. In addition, smooth interface specimens and two separate the pitting interface roughness were also utilized. Obtained results indicate that the quantitative roughness has a very limited effect on the interface tensile bond strength if no extra micro-roughness or bonding agent is added at the interface. The roughness method however causes enhanced shear bond strength at the interface. Increased tooth depth improved both the tensile and shear bond strength of the interfaces, while the tooth distribution mainly influenced the shear bond strength. Major failure modes of the test specimens include interface failure, splitting cracks, and sliding failure, and are influenced by the tooth depth and tooth distribution. Furthermore, the interface properties were obtained and presented while a comparison between the different testing methods, in terms of bond strength, was performed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.467-470
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• 2004

Diamond-Like Carbon (DLC) thin film is a semiconductor with high mechanical hardness, low friction coefficient, high chemical inertness, and optical transparency. DLC thin films have widespread applications as protective coatings and solid lubricant coatings in areas such as Hard Disk Drive (HDD) and Micro-Electro-Mechanical-Systems (MEMS). In this work, the wear characteristics of DLC thin films deposited on silicon substrates using a DC-magnetron sputtering system were analyzed. The wear tracks were measured with an Atomic Force Microscope (AFM). To identify the sp2 and sp3 hybridization of carbon bonds and other bonds Raman spectroscopy was used. The structural information of DLC thin films was obtained with Fourier transform infrared spectroscopy and wear tests were conducted by using a micro-pin-on-reciprocator tester. Results showed that the wear characteristics were dependent on the sputtering conditions. The wear rate could be correlated with the bonding state of the DLC thin film.

• Korean Journal of Materials Research
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• v.12 no.7
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• pp.545-549
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• 2002

Potassium-Calcium-Phosphate glasses in range $XCaO\cdot(50-X)K_2O$ \cdot $50P_2$$O^{5}$were investigated. Glass transition temperature(Tg) of prepared glasses were below $520^{\circ}C$, thermal expansion coefficient from $270.3$\times$10^{7}$ to $604.5$\times$10^{7}$/$^{\circ}C$. The structure of XCaO.(50-X)$K_2$O\cdot$50P_2$$O^{5}$ glasses were examined by FT-IR spectroscopy indirectly. As CaO was increased, Ts, Tg, P-O-P bonding strength and chemical durability were increased. Glass surface change was observed with increasing dissolution time using bulk specimen, weight loss and pH change were measured as function of the dissolution time.