• 한국표면공학회지
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• 제19권3호
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• pp.83-91
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• 1986

Codeposited of boron nitride(BN) particle dispersed into electroless nickel-phosphours (Ni-P) and nickel-boron(Ni-B) platings were studied for the purpose of developing the wear resistance and lubricity. BN can be codeposited from electroless nickel plating bath with $NaH_2PO_2$ and $NaBH_4$ as the reducing agents. Most dispersolids were distributed uniformly in the Ni-P and Ni-B matrix. Abrasion loss decreased with increasing amount of codeposits and reached a constant value 2.4 percent by volume percent of BN particle. The wear resistance and the friction coefficient of the heat treated BN composite coatings were improved about three times than that of as-coatings. The BN composite coatings were more wear resistance than hard chromium. Ni-B-BN composite coatings showed lower wear resistance and friction coefficient than Ni-P-BN. The BN content of the deposite was found to be 2.4 v/o for these optium conditions.

• 한국표면공학회지
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• 제37권4호
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• pp.208-214
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• 2004

The influence of the boron content on the various properties of Ni-B alloy films produced by electrodeposition was investigated. The considerable reduction in grain size was observed with increasing boron content. The internal stress was tensile and increased linearly with increasing boron content. Hardness increased up to $750H_{v}$ at 2 at% boron and then kept the value to 11 at% boron for as-plated Ni-B coatings. The hardness of Ni-B films increased up to $1,250H_{v}$ due to the intermetallic$ Ni_3$B precipitation by the heat treatment, and maximum hardness of each coating increases with boron content. Wear resistance decreased with increasing the boron content because of high friction coefficient and brittle fracture of film which has higher content of boron.

• Corrosion Science and Technology
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• 제3권3호
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• pp.112-117
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• 2004

This work investigated the material properties of Ni-P-B alloy electrodeposits obtained from a Ni sulfamate bath as a function of the contents of the P and B sources($H_3PO_3$ and dimethyl amine borane complex(DMAB), respectively) with/without additives. Chemical composition, residual stress, microstructure and micro hardness were investigated using ICP(inductively coupled plasma) mass spectrometer, flexible strip, XRD, TEM and micro Vickers hardness tester, respectively. From the results of the compositional analysis, it was observed that P and B are incorporated competitively during the electrodeposition and the sulfur from the additive is codeposited into the electrodeposit. The measured residual stress value increased in the order of Ni, Ni-P, Ni-B and Ni-P-B electrodeposits indicating that boron affects the residual tensile stress greater than phosphorus. As the contents of the alloying element sources of P and B increased, crystallinity and the grain size of the electrodeposit decreased. The effect of boron on crystallinity and grain size was also relatively larger than the phosphorus. It can be explained that the boron with a smaller atomic radius contributes to the increase of residual stress in the tensile direction and the larger restraining force against the grain growth more significantly than the phosphorus with a larger atomic radius. Introduction of an additive into the bath retarded crystallization and grain growth, which may be attributed to the change of the grain growth kinetics induced by the additive adsorbed on the substrate and electrodeposit surfaces during electrodeposition.