• Title/Summary/Keyword: Coating Uniformity

Search Result 143, Processing Time 0.021 seconds

Polyimide Multilayer Thin Films Prepared via Spin Coating from Poly(amic acid) and Poly(amic acid) Ammonium Salt

  • Ha, You-Ri;Choi, Myeon-Cheon;Jo, Nam-Ju;Kim, Il;Ha, Chang-Sik;Han, Dong-Hee;Han, Se-Won;Han, Mi-Jeong
    • Macromolecular Research
    • /
    • v.16 no.8
    • /
    • pp.725-733
    • /
    • 2008
  • Polyimide (PI) multilayer thin films were prepared by spin-coating from a poly(amic acid) (PAA) and poly(amic acid) ammonium salt (PAAS). PI was prepared from pyromellitic dianhydride (PMDA) and 4,4'-oxydianiline (ODA) PAA. Different compositions of PAAS were prepared by incorporating triethylamine (TEA) into PMDA-ODA PAA in dimethylacetamide. PI multilayer thin films were spin-coated from PMDA-ODA PAA and PAAS. The PAAS comprising cationic and anionic moieties were spherical with a particle size of $20{\sim}40\;nm$. Some particles showed layers with ammonium salts, despite poor ordering. Too much salt obstructed the interaction between the polymer chains and caused phase separation. A small amount of salt did not affect the interactions of the interlayer structure but did interrupt the stacking between chains. Thermogravimetric analysis (TGA) showed that the average decomposition temperature of the thin films was $611^{\circ}C$. All the films showed almost single-step, thermal decomposition behavior. The nanostructure of the multilayer thin films was confirmed by X -ray reflectivity (XRR). The LF 43 film, which was prepared with a 4:3 molar ratio of PMDA and ODA, was comprised of uniformly spherical PAAS particles that influenced the nanostructure of the interlayer by increasing the interaction forces. This result was supported by the atomic force microscopy (AFM) data. It was concluded that the relationship between the uniformity of the PAAS particle shapes and the interaction between the layers affected the optical and thermal properties of PI layered films.

Comparision of Immobilized TiO2 Catalyst for Water Purification (정수처리용 TiO2 고정화 촉매 비교)

  • Jeon, En Ju;Kang, Sung Hwan;Kim, Byung Ug;Rim, Jay Myung
    • Journal of Korean Society of Water and Wastewater
    • /
    • v.13 no.3
    • /
    • pp.101-106
    • /
    • 1999
  • This research aims to compare immobilized catalysts prepared by various methods and determine suitable $TiO_2$ catalyst for water purification. Sol-gel method by Anderson and powder coation method by Tanaka ate famous in the methods to immobilize catalyst. Therefore, the $TiO_2$ catalyst for this research was prepared by sol-gel method and powder coating method. Its structure was tested by X-ray diffractometer (XRD), Scanning electron microseope (SEM). Durability of a catalyst-support couple in an solution was investigated. too. Experimental results were summarized as following; i) Optimum ratio of Ti : $H_2O$ : $H^+$ to obtain stable sol was 1 : 10 : 0.1 and the XRD patterns of $TiO_2$ film immobilized by sol-gel method which were fired at $700^{\circ}C$ showed that the catalyst had an anatase structure. ii) The particle size of $TiO_2$ prepared by sol-gel method was less than $5{\mu}$, but it was observed that coated side was not unifiom. iii) Sol-gel method was very effective to obtain $TiO_2$ catalyst of thin film, but spreadability and durability of a catalyst-support couple in a solution were than $TiO_2$ film immobilized by powder coating method. iv) The particle size of $TiO_2$ immobilized by powder coating method was a little larger than it prepared by sol-gel method, but spreadability and uniformity of $TiO_2$ film and durability of a catalyst-support couple in a solution were better than it immobilized by sol-gel method.

  • PDF

Fabrication of Anti-Moiré Filter Using Multi-Array Needle Coating for LED Screens (다중 배열 니들 코팅을 이용한 LED 스크린용 Anti-Moiré 필터 제작)

  • Jeon, Kyungjun;Lee, Jinyoung;Park, Jongwoon
    • Journal of the Semiconductor & Display Technology
    • /
    • v.20 no.1
    • /
    • pp.77-82
    • /
    • 2021
  • Using a multi-array needle module developed for coating of high-density cylindrical microlens array (C-MLA), we have fabricated an anti-Moiré filter for LED screens. The Moiré phenomenon appears due to the interference between the array pattern of image sensors in a camera and the non-emission area (grid pattern) of a LED screen. To suppress it, we have employed poly(methyl methacrylate) (PMMA) and coated it on a glass substrate in the form of a grid and non-grid (parallel lines). We have rotated the needle module in order to increase the number of C-MLAs. With this scheme, we have fabricated the 150 mm × 150 mm anti-Moiré filters where 836 microlens lines are formed. They show the average width of 255.4 ㎛, the average distance between CMLs of 94.6 ㎛, and C-MLA width non-uniformity of 4.7%. We have shown that the Moiré patterns still appear in the presence of the parallel (non-grid)-type filter, whereas they disappeared completely by the grid-type filter. It is due to the fact that the Moiré patterns are diffused more effectively by the grid-type C-MLA.

Implementation of Whiteness Measurement Sensor System (백색도 측정 센서 시스템 구현)

  • Joo, Ji-Su;Jang, Min-Seok;Lee, Yon-Sik
    • Proceedings of the Korean Society of Computer Information Conference
    • /
    • 2017.01a
    • /
    • pp.245-248
    • /
    • 2017
  • 제품 생산 공정에서 주로 사용하는 담체에 인디케이터나 제품 용액 등을 코팅할 경우 온도 습도 조도 등 외무 요인에 의해 제조조건이 상이해지고 공정 시간 및 품질에 영항을 준다. 본 논문에서는 RGB 값을 통하여 백색도를 측정하여 담체에의 코팅 균일도를 측정할 수 있는 센서 시스템을 구현한다. 구현 시스템은 대량으로 발생되는 센서 데이터 정보를 저장 분석 및 기술적 해석을 통한 다양한 파라미터들을 조정함으로서 공정 진행과 코팅 결과의 최적합성을 유도하고, 다양한 유사제품들의 생산 공정의 모니터링 및 자동화 시스템 개발에 적용이 가능하다.

  • PDF

A Study on Low Temperature Phosphating for Cold Forming (냉간 가공용 인산염 피막처리의 저온화에 관한 연구)

  • 이만식;정충택;이광호;김준호;이근대;홍성수
    • Journal of the Korean institute of surface engineering
    • /
    • v.35 no.5
    • /
    • pp.279-288
    • /
    • 2002
  • Zinc phosphating for cold forming of steel was studied with emphasis on decreasing phosphating temperature. To lower phosphating temperature, some techniques, such as adding Cu ion into bath, using activator in the form of pre-dip, and aeration in bath, instead of using conventional accelerator, namely oxidizing agent, have been tried. It was revealed that phosphating, leading to coatings of Improved uniformity and fine crystal size, can be carried out using above techniques at lower temperature ($55^{\circ}C$) compared to conventional phosphating temperature ($80 ~ 90^{\circ}C$ ). Under present condition, it was seen that optimum concentrations of Cu ion in phosphating bath and activator in pre-dip are 0.015% (w/w) and 2.0 g/1, respectively. The coating weight was within the range of 15 ~ 20 g/$\m^2$. When lubricant was applied into phosphating coatings, the amount of lubricating component (total soap) was found to be 6 ~ 10 g/$\m^2$ and the lubricated panel revealed excellent lubricating properties.

Fabrication of 8 inch Polyimide-type Electrostatic Chuck (폴리이미드형 8인치 정전기척의 제조)

  • 조남인;박순규;설용태
    • Journal of the Semiconductor & Display Technology
    • /
    • v.1 no.1
    • /
    • pp.9-13
    • /
    • 2002
  • A polyimide-type electrostatic chuck (ESC) was fabricated for the application of holding 8-inch silicon wafers in the oxide etching equipment. For the fabrication of the unipolar ESC, core technologies such as coating of polyimide films and anodizing treatment of aluminum surface were developed. The polyimide films were prepared on top of thin coated copper substrates for the good electrical contacts, and the helium gas cooling technique was used for the temperature uniformity of the silicon wafers. The ESC was essentially working with an unipolar operation, which was easier to fabricate and operate compared to a bipolar operation. The chucking force of the ESC has been measured to be about 580 gf when the applied voltage was 1.5 kV, which was considered to be enough force to hold wafers during the dry etching processing. The employment of the ESC in etcher system could make 8% enhancement of the wafer processing yield.

  • PDF

Fabrication of Wafer Level Fine Pitch Solder Bump for Flip Chip Application (플립칩용 웨이퍼레벨 Fine Pitch 솔더범프 형성)

  • 주철원;김성진;백규하;이희태;한병성;박성수;강영일
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.14 no.11
    • /
    • pp.874-878
    • /
    • 2001
  • Solder bump was electroplated on wafer for flip chip application. The process is as follows. Ti/Cu were sputtered and thick PR was formed by several coating PR layer. Fine pitch vias were opened using via mask and then Cu stud and solder bump were electroplated. Finally solder bump was formed by reflow process. In this paper, we opened 40㎛ vias on 57㎛ thick PR layer and electroplated solder bump with 70㎛ height and 40㎛ diameter. After reflow process, we could form solder bump with 53㎛ height and 43㎛ diameter. In plating process, we improved the plating uniformity within 3% by using ring contact instead of conventional multi-point contact.

  • PDF

A study on A1$_2$O$_3$ coating by Electrophoretic Method (전기영동법을 이용한 A1$_2$O$_3$코팅에 관한 연구)

  • 주상현;소대화;전용우
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 1997.11a
    • /
    • pp.80-84
    • /
    • 1997
  • In this experiment, A1$_2$O$_3$ thick films were prepared by electrophoretic method using A1$_2$O$_3$ fine Powder of which composition were FA-5-500 and FA-5-900. The growth behavior of A1$_2$O$_3$ thick films were characterized as preparation conditions, such as applied voltage, deposition time and adding conditions. As a result, A1$_2$O$_3$ thick films were successfully fabricated by electrophoretic method on molybdnum plate in which etanol and distilled used were used as a solvent. Deposition conditions for good uniformity of the A1$_2$O$_3$ thick films were applied voltage of 60volts, deposition time of 2 seconds, heat treatment at 1$700^{\circ}C$ for 5 minutes.

  • PDF

A Study on Low Temperature Phosphating for Cold Forming (냉간 가공용 인산염 피막처리의 저온화에 관한 연구)

  • 이만식;정충택;이광호;김준호;이근대;홍성수
    • Journal of the Korean institute of surface engineering
    • /
    • v.36 no.1
    • /
    • pp.59-68
    • /
    • 2003
  • Zinc phosphating for cold forming of steel was studied with emphasis on decreasing phosphating temperature. To lower phosphating temperature, some techniques, such as adding Cu ion into bath, using activator in the form of pre-dip, and aeration in bath, instead of using conventional accelerator, namely oxidizing agent, have been tried. It was revealed that phosphating, leading to coatings of improved uniformity and fine crystal size, can be carried out using above techniques at lower temperature (55$^{\circ}C$) compared to conventional phosphating temperature ($80∼90^{\circ}C$). Under present condition, it was seen that optimum concentrations of Cu ion in phosphating bath and activator in pre-dip are 0.015 % (w/w) and 2.0 g/1, respectively. The coating weight was within the range of $\15∼20 g/m^2$. When lubricant was applied into phosphating coatings, the amount of lubricating component (total soap) was found to be$ 6∼10 g/\m^2$ and the lubricated panel revealed excellent lubricating properties.

Surface Morphological Properties of Micro-arc Oxidation Coating on Al6061 Alloys using Unipolar Pulse (Unipolar pulse를 이용하여 형성된 Al6061 합금 표면의 MAO 코팅의 표면 구조에 대한 연구)

  • Kim, Nam-youl;Park, Seung-Ho;Park, Ki-Youg;Choi, Jin-Sub
    • Journal of the Korean institute of surface engineering
    • /
    • v.50 no.5
    • /
    • pp.421-426
    • /
    • 2017
  • Herein, we investigated surface morphological characteristics of anodic films on Al6061 alloy prepared by unipolar pulsed Micro-arc oxidation (MAO) in a mixed solution of $Na_2SiO_3$ + KOH. The number and size of pores as well as craters on anodic alumina surface were studied as a function of different voltages, duty cycles and applied anodic current densities. The morphological characteristics of all samples were investigated by scanning electron microscopy, conforming that the most uniform surface morphology of MAO films on Al1050 alloy was obtained at high applied current density with low duty cycle.