• Proceedings of the Korean Magnestics Society Conference
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• 2004.06a
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• pp.204-205
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• 2004

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.229-229
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• 2003

Enhancement of the exchange bias and optimization of the structure have been the focus that many researchers studied, recently [1]. In this report, magnetic properties of MTJs with structure of Si/Ta (5)/Cu (10)/ Ta (5)/ Ni$\sub$80/Fe$\sub$20/ Cu (5)/ Mn$\sub$75Ir$\sub$25/ (10)/ Co$\sub$70/Fe$\sub$30/ (2.5)/ Al-O (1.5)/ Co$\sub$70/Fe$\sub$30/ (2.5)/ Ni$\sub$80/Fe$\sub$20/ (t)/ Ta (5) (t=0,10, 30, 60 and 100 nm, respectively) were investigated. The relationship between the structure and magnetic parameters of interfacial exchange coupling and interlayer coupling in as-deposited and annealed junctions was studied. The temperature dependence of exchange coupling was considered.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.1
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• pp.30-34
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• 2010

$CoSb_3$-based skutterudite compounds are promising candidates as thermoelectric (TE) materials used in intermediate temperature region. In this study, sintering of $CoSb_3$ powder and joining of $CoSb_3$ to copper-molybdenum electrode have been simultaneously performed by spark plasma sintering technique. The Ti foil was used for preventing the diffusion of copper into $CoSb_3$ and the Cu : Mo = 3 : 7 Vol. ratio composition was selected by the consideration of thermal expansion coefficients. The insertion of Ti interlayer between Cu-Mo and $CoSb_3$ was effective to join $CoSb_3$ to Cu-Mo by forming an intermediate layer of $TiSb_2$ at the Ti-$CoSb_3$ boundary. However, the formation of TiSb and TiCoSb intermediate layers deteriorated the joining properties by the generation of cracks in the interface of intermediate layer/$CoSb_3$ and intermediate/intermediate layers.

• Journal of the Korean Magnetics Society
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• v.9 no.2
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• pp.98-103
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• 1999

We have studied changes of coercivity $(H_c)$, exchange anisotropy field $(H_{ex})$ and MR ration in glass/Ta/NiFeI/CoI(t)/Cu/CoII(3/4 t)/NiFeII/FeMn spin valve structures by changing Ar pressure and thicknesses of Co layers using DC, RF sputtering methods. We obtained minimum coercivity of 2.8 Oe at 4 mTorr of Ar pressure, exchange anisotropy field of 50.0 Oe at 6 mTorr and 5.3 % of MR ratio at 10 mTorr. Also, we obtained 3.0 Oe of coercivity at 40 $\AA$ of CoI layer, 65.9 Oe at 13 $\AA$ and 4.7 % of MR ratio at 27 $\AA$ and 34 $\AA$ by changing the thicknesses of Co layers.

• Proceedings of the Korean Magnestics Society Conference
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• 2011.06a
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• pp.3-3
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• 2011

Since the first discovery of exchange anisotropy on Co/CoO system[1], there have been numerous studies to explore the physical origin of exchange-biased system[2,3]. In this presentation, we report that how the polarized neutron reflectomery can be applied to study the magnetization reversal behavior of the exchange biased system. As an example, the detailed magnetization reversal mechanism of the exchange-biased Py(30 nm)/FeMn (0, 15, 30 nm)/CoFe(30 nm) trilayers was studied and found that the 15 nm antiferromagnetic FeMn layer mediates the magnetization reversal behaviors of both Py and CoFe layers through interlayer exchange bias coupling. We also update the current activities in polarized neutron reflectometer in HANARO.

• Korean Journal of Materials Research
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• v.8 no.10
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• pp.956-960
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• 1998

The interfacial reaction between the CoINb bilayer and the $SiO_2$ substrate in the temperature range of $330^{\circ}C$-$800^{\circ}C$ in a vacuum has been investigated by X-ray photoelectron spectroscopy, glancing angle XRD, Auger Electron Spectroscopy and Atomic force microscopy. The Co and Nb were actively interdiffused at $600^{\circ}C$, and the layer inversion completed at $700^{\circ}C$. NbO was formed by interfacial reaction between the Nb interlayer and the $SiO_2$ substrate, while $Nb_20_5$ was formed on the surface by reaction of Nb with oxygen in the ambients. Free Si atoms obtained by the reaction between Nb and $SiO_2$ formed silicides like CoSi and $Nb_5Si_3$ by reacting with Co and Nb remnants. The sheet resistance of the Co/Nb bilayer increased substantially after annealing at $800^{\circ}C$. which is due to the agglomeration of the Co layer to reduce its surface energy.

• Membrane Journal
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• v.20 no.4
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• pp.290-296
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• 2010

Ethylene vinyl acetate (EVA-28)/Co-Al LDH nanocomposite membranes were prepared by solution intercalation using organically modified LDH. LDH was made organophilic by the intercalation of dodecyl sulfate (DS) anion in the interlayer. The prepared membranes were characterized using XRD, FT-IR and SEM. Gas permeability of EVA/LDH nanocomposite membranes with LDH content of 1, 3, and 5 w% was studied for $O_2$ and $CO_2$ at pressure of 3, 4, and 5 bar. The permeability of $O_2$ and $CO_2$ was minimum for nanocomposite membrane with 1 wt% LDH and increased with increasing LDH content, which is presumably due to aggregation of LDH filler. The selectivity of $CO_2$ for $O_2$ showed the maximum value at 1 wt% of LDH content and decreased thereafter.

• Journal of the Korean Ceramic Society
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• v.51 no.6
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• pp.549-553
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• 2014

$CoSb_3$-based skutterudite compounds are candidate materials for thermoelectric power generation in the mid-temperature range (600 - 900 K) because their thermoelectric properties can be enhanced by doping and filling. The joining property of thermoelectric module electrodes containing thermoelectric materials is of great importance because it can dominate the efficiency of the thermoelectric module. This study examined the properties of $CoSb_3$/Al/Ti/CuMo joined by the spark plasma sintering technique. Titanium thin foil was used to prevent the diffusion of copper into $CoSb_3$ and Aluminum thin foil was used to improve the adhesion between $CoSb_3$ and Ti. The insertion of an Aluminum interlayer between the Ti and $CoSb_3$ was effective for joining $CoSb_3$ to Ti by forming an intermediate layer at the Al-$CoSb_3$ boundary without any micro cracks. Specifically, the adhesion strength of the Ti/Al/$CoSb_3$ joining interface showed a remarkable improvement compared with our previous results, without deterioration of electrical property in the interface.

• Korean Journal of Materials Research
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• v.13 no.1
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• pp.43-47
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• 2003

As and BF$_2$dopants are implanted for the formation of source/drain with dose of 1${\times}$10$^{15}$ ions/$\textrm{cm}^2$∼5${\times}$10$^{15}$ ions/$\textrm{cm}^2$ then formed cobalt disilicide with Co/Ti deposition and doubly rapid thermal annealing. Appropriate ion implantation and cobalt salicide process are employed to meet the sub-0.13 $\mu\textrm{m}$ CMOS devices. We investigated the process results of sheet resistance, dopant redistribution, and surface-interface microstructure with a four-point probe, a secondary ion mass spectroscope(SIMS), a scanning probe microscope (SPM), and a cross sectional transmission electron microscope(TEM), respectively. Sheet resistance increased to 8%∼12% as dose increased in $CoSi_2$$n^{＋}$ and $CoSi_2$$p^{V}$ , while sheet resistance uniformity showed very little variation. SIMS depth profiling revealed that the diffusion of As and B was enhanced as dose increased in $CoSi_2$$n^{＋}$ and $CoSi_2$$p^{＋}$ . The surface roughness of root mean square(RMS) values measured by a SPM decreased as dose increased in $CoSi_2$$n^{＋}$ , while little variation was observed in $CoSi_2$$p^{＋}$ . Cross sectional TEM images showed that the spikes of 30 nm∼50 nm-depth were formed at the interfaces of $CoSi_2$$n^{＋}$ / and $CoSi_2$/$p^{＋}$, which indicate the possible leakage current source. Our result implied that Co/Ti cobalt salicide was compatible with high dose sub-0.13$\mu\textrm{m}$ process.

• Journal of the Korean Magnetics Society
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• v.7 no.5
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• pp.265-273
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• 1997

The MR ratios and the exchange biasing field and interlayer coupling field were investigated in $Ni_{91}Fe_{19}/Co_{90}Fe_{10}/Cu/Co_{90}Fe_{10}/NiO$ spin-valve sandwiches grown on antiferromagnetic NiO films as a function of the NiO thickness, the thickness of Cu and pinning layer $Co_{90}Fe_{10}$. The spin-valve sandwiches were deposited on the Corning glass 7059 by means of the 3-gun dc and 1-gun rf magnetron sputtering at a 5 mtorrpartial Ar pressure and room temperature. The deposition field was 50 Oe. The MR curve was measured by the four-terminal method with applied magnetic soft bilayer [NiFe/CoFe] (90$\AA$) decreased dramatically to less than 10 Oe when the NiFe/CoFe bilayer used an NiFe bilayer thicker that 20$\AA$. So NiFe layer improved the softmagnetic properties in the NiFe/CoFe bilayer. The GMR ratio and the magnetic field sensitivity of the spin-valve film $Ni_{91}Fe_{19}(40{\AA})/Co_{90}Fe_{10}(50{\AA}) /Cu(30{\AA})/Co_{90}Fe_{10}(35{\AA})/NiO(800{\AA})$ was 6.3% and about 0.5 (%/Oe), respectively. The MR ratio had 5.3% below an annealing temperature of 20$0^{\circ}C$ which slowly decreased to 3% above 30$0^{\circ}C$. The large blocking temperature of the spin-valve film was taken (as being) due to the good stability of the NiO films. Thus, the spin-valve films with a free NiFe/CoFe layer clearly had a high large GMR output and showed a effective magnetic field sensitivity for a suitable spin-valve head material.