• Title/Summary/Keyword: Closed-Box Loudspeaker

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Parameters Estimation for Pseudo Loudspeaker attached to Closed-Box and Enhanced Closed-Box Modeling (밀폐박스 상태의 가상 라우드스피커 매개변수 규명법 및 개선된 밀폐박스 모델링)

  • Park, Seok-Tae
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.17 no.10
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    • pp.983-992
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    • 2007
  • It was proposed to identify Thiele Small Parameters for loudspeaker attached to closed-box using known dynamic mass of moving parts. Also, enhanced PSPICE circuit model for closed-box loudspeaker system was proposed to more accurately simulate real closed-box loudspeaker system. Frequency dependent parameters were used to model voice coil inductor. Acoustic pressure response curves and electrical impedance curves were simulated and investigated by PSPICE circuit model according to compensation filter's parameters. Finally, proposed method is expected to be utilized for identification of pseudo Thiele Small parameters of microspeaker.

Thiele Small Parameters Estimation for Pseudo Loudspeaker within 10 mm Grade Circular-type Microspeaker (10 mm급 원형 마이크로스피커의 가상 스피커 TS 매개변수 규명)

  • Park, Seok-Tae
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.17 no.11
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    • pp.1112-1118
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    • 2007
  • It was discussed to identify Thiele Small Parameters for Pseudo loudspeaker within 10mm grade microspeaker attached to closed-box using known dynamic mass of moving parts. Also, enhanced circuit model for vented-box micro speaker system was used to more accurately simulate electrical impedance curves for real vented-box microspeaker system and compared to test results. Consequently, it showed that micro speaker could be modeled by pseudo loudspeaker TS parameters similar to general loudspeaker. Vented-box microspeaker model with pseudo loudspeaker TS parameters was well suited to describe real microspeaker. Also, it was proposed to estimate volume of rear closed-box of microspeaker without design specifications.

Acoustic and Electrical Analysis of Microspeaker for Mobile Phones (모바일 폰용 마이크로스피커의 음향 및 전기 해석)

  • Park, Seok-Tae
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.24 no.7
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    • pp.525-536
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    • 2014
  • In this paper, GUI program for microspeaker system simulation program was developed and verified through closed box, vent box and 6th order bandpass enclosure system. By using the pseudo loudspeaker model concept, TS parameters and rear volume of microspeaker were identified. Their suitabilities were proved by comparing test results with simulations of electrical impedance and sound pressure response curves for the three box types; closed box, vent box and 6th order bandpass box. Also, MSSP was found to be effective regardless of the microspeaker's shape, either circular or rectangular shape. MSSP can be used for the microspeaker system simulation, and can give a general prediction of such as; sound pressure level curve, electrical impedance, diaphragm velocity and displacement curve according to multiple design parameters; diaphragm mass, compliance, force factor, front and rear volume, front and rear port's diameter and length.