• Title/Summary/Keyword: Clock resolution

Search Result 118, Processing Time 0.037 seconds

Design of an 1.8V 6-bit 1GS/s 60mW CMOS A/D Converter Using Folding-Interpolation Technique (Folding-Interpolation 기법을 이용한 1.8V 6-bit 1GS/s 60mW 0.27$mm^2$ CMOS A/D 변환기의 설계)

  • Jung, Min-Ho;Moon, Jun-Ho;Hwang, Sang-Hoon;Song, Min-Kyu
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.44 no.11
    • /
    • pp.74-81
    • /
    • 2007
  • In this paper, CMOS analog-to-digital converter (ADC) with a 6-bit 1GSPS at 1.8V is described. The architecture of the proposed ADC is based on a folding type ADC using resistive interpolation technique for low power consumption. To reduce the power consumption, a folder reduction technique to decrease the number of folding blocks (NFB) by half of the conventional ones is proposed. further, a novel layout technique is introduced for compact area. With the clock speed of 1GSPS, the ADC achieves an effective resolution bandwidth (ERBW) of 500MHz, while consuming only 60mW of power. The measured INL and DNL were within $\pm$0.5 LSB, $\pm$0.7 LSB, respectively. The measured SNR was 34.1dB, when the Fin=100MHz at Fs=300MHz. The active chip occupies an area of 0.27$mm^2$ in 0.18um CMOS technology.

LASPI: Hardware friendly LArge-scale stereo matching using Support Point Interpolation (LASPI: 지원점 보간법을 이용한 H/W 구현에 용이한 스테레오 매칭 방법)

  • Park, Sanghyun;Ghimire, Deepak;Kim, Jung-guk;Han, Youngki
    • Journal of KIISE
    • /
    • v.44 no.9
    • /
    • pp.932-945
    • /
    • 2017
  • In this paper, a new hardware and software architecture for a stereo vision processing system including rectification, disparity estimation, and visualization was developed. The developed method, named LArge scale stereo matching method using Support Point Interpolation (LASPI), shows excellence in real-time processing for obtaining dense disparity maps from high quality image regions that contain high density support points. In the real-time processing of high definition (HD) images, LASPI does not degrade the quality level of disparity maps compared to existing stereo-matching methods such as Efficient LArge-scale Stereo matching (ELAS). LASPI has been designed to meet a high frame-rate, accurate distance resolution performance, and a low resource usage even in a limited resource environment. These characteristics enable LASPI to be deployed to safety-critical applications such as an obstacle recognition system and distance detection system for autonomous vehicles. A Field Programmable Gate Array (FPGA) for the LASPI algorithm has been implemented in order to support parallel processing and 4-stage pipelining. From various experiments, it was verified that the developed FPGA system (Xilinx Virtex-7 FPGA, 148.5MHz Clock) is capable of processing 30 HD ($1280{\times}720pixels$) frames per second in real-time while it generates disparity maps that are applicable to real vehicles.

A UHF-band Passive Temperature Sensor Tag Chip Fabricated in $0.18-{\mu}m$ CMOS Process ($0.18-{\mu}m$ CMOS 공정으로 제작된 UHF 대역 수동형 온도 센서 태그 칩)

  • Pham, Duy-Dong;Hwang, Sang-Kyun;Chung, Jin-Yong;Lee, Jong-Wook
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.45 no.10
    • /
    • pp.45-52
    • /
    • 2008
  • We investigated the design of an RF-powered, wireless temperature sensor tag chip using $0.18-{\mu}m$ CMOS technology. The transponder generates its own power supply from small incident RF signal using Schottky diodes in voltage multiplier. Ambient temperature is measured using a new low-power temperature-to-voltage converter, and an 8-bit single-slope ADC converts the measured voltage to digital data. ASK demodulator and digital control are combined to identify unique transponder (ID) sent by base station for multi-transponder applications. The measurement of the temperature sensor tag chip showed a resolution of $0.64^{\circ}C/LSB$ in the range from $20^{\circ}C$ to $100^{\circ}C$, which is suitable for environmental temperature monitoring. The chip size is $1.1{\times}0.34mm^2$, and operates at clock frequency of 100 kHz while consuming $64{\mu}W$ power. The temperature sensor required a -11 dBm RF input power, supported a conversion rate of 12.5 k-samples/sec, and a maximum error of $0.5^{\circ}C$.

Bit-serial Discrete Wavelet Transform Filter Design (비트 시리얼 이산 웨이블렛 변환 필터 설계)

  • Park Tae geun;Kim Ju young;Noh Jun rye
    • The Journal of Korean Institute of Communications and Information Sciences
    • /
    • v.30 no.4A
    • /
    • pp.336-344
    • /
    • 2005
  • Discrete Wavelet Transform(DWT) is the oncoming generation of compression technique that has been selected for MPEG4 and JEPG2000, because it has no blocking effects and efficiently determines frequency property of temporary time. In this paper, we propose an efficient bit-serial architecture for the low-power and low-complexity DWT filter, employing two-channel QMF(Qudracture Mirror Filter) PR(Perfect Reconstruction) lattice filter. The filter consists of four lattices(filter length=8) and we determine the quantization bit for the coefficients by the fixed-length PSNR(peak-signal-to-noise ratio) analysis and propose the architecture of the bit-serial multiplier with the fixed coefficient. The CSD encoding for the coefficients is adopted to minimize the number of non-zero bits, thus reduces the hardware complexity. The proposed folded 1D DWT architecture processes the other resolution levels during idle periods by decimations and its efficient scheduling is proposed. The proposed architecture requires only flip-flops and full-adders. The proposed architecture has been designed and verified by VerilogHDL and synthesized by Synopsys Design Compiler with a Hynix 0.35$\mu$m STD cell library. The maximum operating frequency is 200MHz and the throughput is 175Mbps with 16 clock latencies.

A Single-Bit 2nd-Order CIFF Delta-Sigma Modulator for Precision Measurement of Battery Current (배터리 전류의 정밀 측정을 위한 단일 비트 2차 CIFF 구조 델타 시그마 모듈레이터)

  • Bae, Gi-Gyeong;Cheon, Ji-Min
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
    • /
    • v.13 no.3
    • /
    • pp.184-196
    • /
    • 2020
  • In this paper, a single-bit 2nd-order delta-sigma modulator with the architecture of cascaded-of-integrator feedforward (CIFF) is proposed for precision measurement of current flowing through a secondary cell battery in a battery management system (BMS). The proposed modulator implements two switched capacitor integrators and a single-bit comparator with peripheral circuits such as a non-overlapping clock generator and a bias circuit. The proposed structure is designed to be applied to low-side current sensing method with low common mode input voltage. Using the low-side current measurement method has the advantage of reducing the burden on the circuit design. In addition, the ±30mV input voltage is resolved by the ADC with 15-bit resolution, eliminating the need for an additional programmable gain amplifier (PGA). The proposed a single-bit 2nd-order delta-sigma modulator has been implemented in a 350-nm CMOS process. It achieves 95.46-dB signal-to-noise-and-distortion ratio (SNDR), 96.01-dB spurious-free dynamic range (SFDR), and 15.56-bit effective-number-of-bits (ENOB) with an oversampling ratio (OSR) of 400 for 5-kHz bandwidth. The area and power consumption of the delta-sigma modulator are 670×490 ㎛2 and 414 ㎼, respectively.

Hardware Design of High Performance HEVC Deblocking Filter for UHD Videos (UHD 영상을 위한 고성능 HEVC 디블록킹 필터 설계)

  • Park, Jaeha;Ryoo, Kwangki
    • Journal of the Korea Institute of Information and Communication Engineering
    • /
    • v.19 no.1
    • /
    • pp.178-184
    • /
    • 2015
  • This paper proposes a hardware architecture for high performance Deblocking filter(DBF) in High Efficiency Video Coding for UHD(Ultra High Definition) videos. This proposed hardware architecture which has less processing time has a 4-stage pipelined architecture with two filters and parallel boundary strength module. Also, the proposed filter can be used in low-voltage design by using clock gating architecture in 4-stage pipeline. The segmented memory architecture solves the hazard issue that arises when single port SRAM is accessed. The proposed order of filtering shortens the delay time that arises when storing data into the single port SRAM at the pre-processing stage. The DBF hardware proposed in this paper was designed with Verilog HDL, and was implemented with 22k logic gates as a result of synthesis using TSMC 0.18um CMOS standard cell library. Furthermore, the dynamic frequency can process UHD 8k($7680{\times}4320$) samples@60fps using a frequency of 150MHz with an 8K resolution and maximum dynamic frequency is 285MHz. Result from analysis shows that the proposed DBF hardware architecture operation cycle for one process coding unit has improved by 32% over the previous one.

A 10b 25MS/s $0.8mm^2$ 4.8mW 0.13um CMOS ADC for Digital Multimedia Broadcasting applications (DMB 응용을 위한 10b 25MS/s $0.8mm^2$ 4.8mW 0.13um CMOS A/D 변환기)

  • Cho, Young-Jae;Kim, Yong-Woo;Lee, Seung-Hoon
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.43 no.11 s.353
    • /
    • pp.37-47
    • /
    • 2006
  • This work proposes a 10b 25MS/s $0.8mm^2$ 4.8mW 0.13um CMOS A/D Converter (ADC) for high-performance wireless communication systems such as DVB, DAB and DMB simultaneously requiring low voltage, low power, and small area. A two-stage pipeline architecture minimizes the overall chip area and power dissipation of the proposed ADC at the target resolution and sampling rate while switched-bias power reduction techniques reduce the power consumption of analog amplifiers. A low-power sample-and-hold amplifier maintains 10b resolution for input frequencies up to 60MHz based on a single-stage amplifier and nominal CMOS sampling switches using low threshold-voltage transistors. A signal insensitive 3-D fully symmetric layout reduces the capacitor and device mismatch of a multiplying D/A converter while low-noise reference currents and voltages are implemented on chip with optional off-chip voltage references. The employed down-sampling clock signal selects the sampling rate of 25MS/s or 10MS/s with a reduced power depending on applications. The prototype ADC in a 0.13um 1P8M CMOS technology demonstrates the measured DNL and INL within 0.42LSB and 0.91LSB and shows a maximum SNDR and SFDR of 56dB and 65dB at all sampling frequencies up to 2SMS/s, respectively. The ADC with an active die area if $0.8mm^2$ consumes 4.8mW at 25MS/s and 2.4mW at 10MS/s at a 1.2V supply.

A 12b 200KHz 0.52mA $0.47mm^2$ Algorithmic A/D Converter for MEMS Applications (마이크로 전자 기계 시스템 응용을 위한 12비트 200KHz 0.52mA $0.47mm^2$ 알고리즈믹 A/D 변환기)

  • Kim, Young-Ju;Chae, Hee-Sung;Koo, Yong-Seo;Lim, Shin-Il;Lee, Seung-Hoon
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.43 no.11 s.353
    • /
    • pp.48-57
    • /
    • 2006
  • This work describes a 12b 200KHz 0.52mA $0.47mm^2$ algorithmic ADC for sensor applications such as motor controls, 3-phase power controls, and CMOS image sensors simultaneously requiring ultra-low power and small size. The proposed ADC is based on the conventional algorithmic architecture with recycling techniques to optimize sampling rate, resolution, chip area, and power consumption. The input SHA with eight input channels for high integration employs a folded-cascode architecture to achieve a required DC gain and a sufficient phase margin. A signal insensitive 3-D fully symmetrical layout with critical signal lines shielded reduces the capacitor and device mismatch of the MDAC. The improved switched bias power-reduction techniques reduce the power consumption of analog amplifiers. Current and voltage references are integrated on the chip with optional off-chip voltage references for low glitch noise. The employed down-sampling clock signal selects the sampling rate of 200KS/s or 10KS/s with a reduced power depending on applications. The prototype ADC in a 0.18um n-well 1P6M CMOS technology demonstrates the measured DNL and INL within 0.76LSB and 2.47LSB. The ADC shows a maximum SNDR and SFDR of 55dB and 70dB at all sampling frequencies up to 200KS/s, respectively. The active die area is $0.47mm^2$ and the chip consumes 0.94mW at 200KS/s and 0.63mW at 10KS/s at a 1.8V supply.