• 한국레이저가공학회지
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• 제6권2호
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• pp.27-33
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• 2003

A laser shock cleaning technology is a new dry cleaning methodology for the effective removal of small particles from the surface. This technique uses a plasma shock wave produced by a breakdown of air due to an intense laser pulse. In order to optimize the laser shock cleaning process, it needs to evaluate the cleaning performance quantitatively by using a monitoring technique. In this paper, an acoustic monitoring technique was attempted to investigate the laser shock cleaning process with an aim to optimize the cleaning process. A wide-band microphone with high sensitivity was utilized to detect acoustic signals during the cleaning process. It was found that the intensity of the shock wave was strongly dependent on the power density of laser beam and the gas species at the laser beam focus. As a power density was larger, the shock wave became stronger. It was also seen that the shock wave became stronger in the case of Ar gas compared with air and N$_2$ gas.

• 한국레이저가공학회지
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• 제3권1호
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• pp.2-11
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• 2000

Laser cleaning has begun to attract a considerable amount of interest recently as a new cleaning technique among scientists and engineers. The unique characteristics of laser cleaning are currently finding successful applications in industry, in medicine as well as in the world of art conservation. This paper takes an overview of the laser cleaning technique itself including basic principles and characteristics, and provides an account of current trends especially with regard to practical applications. Experience with its successful applications in various fields shows that laser cleaning may be about to emerge as a real alternative to conventional cleaning methods.

• Journal of Electrical Engineering and Technology
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• 제10권1호
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• pp.295-298
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• 2015

Ozone micro-bubble cleaning system was designed, and made to develop a unique technique to clean wafers by using ozone micro-bubbles. The ozone micro-bubble cleaning system consisted of loading, cleaning, rinsing, drying and un-loading zones, respectively. In case of the cleaning the silicon wafers of a solar cell, more than 99 % of cleaning efficiency was obtained by dipping the wafers at 10 ppm of ozone for 10 minutes. Both of long cleaning time and high ozone concentration in the wet-solution with ozone micro-bubbles reduced cleaning efficiency because of the re-sorption of debris. The cleaning technique by ozone micro-bubbles can be also applied to various wafers for an ingot and LED as an eco-friendly method.

• 한국레이저가공학회지
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• 제4권2호
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• pp.39-45
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• 2001

This paper introduces a cleaning process for removing submicron-sized particles from NiP hard disk substrates by the liquid-assisted laser cleaning technique. Measurements of cleaning Performance and time-resolved optical diagnostics are Performed to analyze the physical mechanism of contaminant removal. The results reveal that nanosecond laser pulses are effective for removing the contaminants regardless of the wavelength and that a thermal mechanism involving explosive vaporization of liquid dominates the cleaning process.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.743-746
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• 2000

The removal of contaminants of silicon wafers has been investigated by various methods. Laser cleaning is the new dry cleaning technique to replace wafer wet cleaning in the near future. A dry laser cleaning uses inert gas jet to remove contaminant particles lifted off by the action of a KrF excimer laser. A laser cleaning model is developed to simulate the cleaning process and analyze the influence of contaminant particles and experimental parameters on laser cleaning efficiency. The model demonstrates that various types of submicrometer-sized particles from the front sides of silicon wafer can be efficiently removed by laser cleaning. The laser cleaning is explained by a particle adhesion model. including van der Waals forces and hydrogen bonding, and a particle removal model involving rapid thermal expansion of the substrate due to the thermoelastic effect. In addition, the experiment of wafer laser cleaning using KrF excimer laser was conducted to remove various contaminant particles.

• 공기청정기술
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• 제3권2호통권10호
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• pp.129-131
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• 1990

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2000년도 추계학술발표대회 논문개요집
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• pp.23-26
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• 2000

This paper introduces a cleaning process for removing submicron-sized particles from NiP hard disk substrates by the liquid-assisted laser cleaning technique. Measurements of cleaning performance and time-resolved optical diagnostics are performed to analyze the physical mechanism of contaminant removal. The results reveal that nanosecond laser pulses are effective for removing the contaminants regardless of the wavelength and that a thermal mechanism involving explosive vaporization of liquid dominates the cleaning process.

• 상하수도학회지
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• 제29권4호
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• pp.459-468
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• 2015

Deposits discharged through the cleaning mainly were cement mortar, bitumen paintings and rust pieces, and fragments of perforation, stones and gravels. Deposits were more removed through swabbing pig cleaning rather than air scouring cleaning on the whole. However, air scouring cleaning were not influenced by the constraint conditions such as a change in the diameter or the presence of the valve in water mains compare to swabbing pig cleaning. So, it was thought that air scouring cleaning might be more favorable to water distribution network cleaning in the future. After the cleaning, water quality including residual chlorine and turbidity also was improved because of the removal of a significant amount of the deposits. Therefore, if the cleaning is continuously and regularly implemented in water mains, it is expected that it will help to recover the reliability and to preserve the health of water quality.

• 멤브레인
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• 제27권6호
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• pp.519-527
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• 2017

멤브레인 파울링은 지표수를 처리하는 저압 멤브레인 기술 적용의 확장에 있어 큰 장애가 된다. 따라서 파울링 제어를 위한 주기적인 수리학적 세정기술의 최적화는 매우 중요하다. 주기적인 수리학적 세정과 이와 연관된 파울링 현상에 관한 올바른 이해는 멤브레인 세정 전략을 최적화하기 위해 매우 유용할 수 있다. 실험적으로 측정한 투과도와 전통적인 Hermia 파울링 모델 예측 치의 비교를 통해, 본 연구에서는 합성 탁도유발 시료를 처리하는 가압식 멤브레인 공정에서 30분 여과와 정세정/역세정이 포함된 1분 세정조건을 바탕으로 6번의 운전사이클을 통해 발생하는 파울링 현상을 분석하고 이를 통해 지배적인 파울링 기작을 정량적으로 이해하고자 하였다. 단독 세정에서, 첫 번째 운전사이클에서 발생하는 파울링은 완전공극막힘 현상에 의해 주로 지배되었고 마지막 운전 사이클에서는 케이크 형성이 지배적인 파울링 기작으로 관찰되었다. 정세정과 역세정이 혼합된 경우, 파울링 속도는 감소하였으나 전반적으로 케이크 형성이 주 파울링 기작으로 관찰되었다.

• 한국산업보건학회지
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• 제33권4호
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• pp.419-426
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• 2023

Objectives: This study aims to develop an Occupational Safety and Health (OSH) guide for the safe cleaning of contaminated machinery, equipment, and parts used in the electronics manufacturing process. Methods: A literature review, field investigations, and discussions were conducted. An initial draft of an OSH guide was developed and reviewed by experts with significant experience in maintenance work in the electronics manufacturing process in order to refine the guide. Results: Workers involved in cleaning processes with chemicals, solvents, and abrasive blasting can face exposure to a wide range of chemicals, abrasives, and noise. Identifying potential risks associated with each cleaning technique was an essential first step toward enhancing safety measures. The OSH guide comprises approximately eleven to twelve sections spanning 20-25 pages. It includes engineering and administrative protocols systematically organized to address the necessary actions before, during, and after cleaning tasks, depending on the technique. It is recommended that airline respirator masks be used in conjunction with an air purification system to ensure adherence to air quality standard "D" for atmosphere level. The use of an oil-free air compressor is advised, preferably a stationary model that does not rely on fuel sources like diesel. Conclusions: This OSH guide is designed to protect workers involved in maintenance activity in the electronics industry and aligns with global standards, such as those from the International Organization for Standardization (ISO) and Semiconductor Equipment and Material International, ensuring a higher level of safety and compliance.