• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.139-144
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• 2011

CMP process is an essential element in the semiconductor product processes in Chemical Mechanical Polishing. Taken as a whole, CMP is one process, but concretely, it is a detail process which consists of polishing, cleaning, and so on. Especially, the polishing and cleaning are key points in the whole process. Polishing rate is the most important factor and is related with deposition of slurry in the polishing process. Each outlet velocities is the most important factors in cleaning process. And when the velocities are more uniform, the cleaning becomes more effective. In this research, based on these factors, we performed a numerical analysis for effective polishing and cleaning which can be applied to industrial field. Consequently, we figured out that more than one opened nozzle is more effective than one opened nozzle at the polishing pad in case of this research. And we confirmed that the revised models have the uniform velocity distribution more than the previous model of the cleaning nozzle.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.10
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• pp.812-816
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• 2000

It is very important to understand the correlation of between inter dielectric(ILD) CMP process and various facility factors supplied to equipment to equipment system. In this paper, the correlation between the various facility factors supplied to CMP equipment system and ILD-CMP process was studied. To prevent the partial over-polishing(edge hot-spot) generated in the wafer edge area during polishing, we analyze various facilities supplied at supply system. With facility shortage of D.I water(DIW) pressure, we introduced an adding purified $N_2$(P$N_2$)gas in polishing head cleaning station for increasing a cleaning effect. DIW pressure and P$N_2$gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. We estimated two factors (DIW pressure and P$N_2$gas) for the improvement of CMP process. Especially, we obtained a uniform planarity in patterned wafer and prohibited more than 90% wafer edge over-polishing. In this study, we acknowledged that facility factors supplied to equipment system played an important role in ILD-CMP process.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.20 no.1
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• pp.1-6
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• 2024

Crud is a corrosion deposit that forms in equipments and piping of nuclear reactor's primary systems. When crud circulates through the reactor's primary system coolant and adheres to the surface of the nuclear fuel cladding tube, it can lead to the Axial Offset Anomaly (AOA) phenomenon. This occurrence is known to potentially reduce the output of a nuclear power plant or to necessitate an early shutdown. Consequently, worldwide nuclear power plants have employed ultrasonic cleaning methods since 2000 to mitigate crud deposition, ensuring stable operation and economic efficiency. This paper details the system configuration of ultrasonic nuclear fuel cleaning equipment, outlining the function of each component. The objective is to contribute to the local domestic production of ultrasonic nuclear fuel cleaning equipment. Additionally, the paper introduces a method for accurately measuring the weight of removed crud, a crucial factor in assessing cleaning effectiveness and providing input data for the BOA code used in core safety evaluations. Accurate measurement of highly radioactive filters containing crud is essential, and weighing them underwater is a common practice. However, the buoyancy effect during underwater weighing may lead to an overestimation of the collected crud's weight. To address this issue, the paper proposes a formula correcting for buoyancy errors, enhancing measurement accuracy. This improved weight measurement method, accounting for buoyancy effects in water, is expected to facilitate the quantitative assessment of filter weights generated during chemical decontamination and system operations in nuclear power plants.

• Journal of Korea Multimedia Society
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• v.13 no.3
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• pp.400-409
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• 2010

This paper presents a position error recognition system when the wafer is mounted in cleaning equipment among the wafer manufacturing processes. The proposed system is to enhance the performance in cost and reliability by preventing the wafer cleaning system from damaging by alerting it when it is put in correct position. The key algorithms are the calibration method between image acquired from camera and physical wafer, a infrared lighting and the design of the filter, and the extraction of wafer boundary and the position error recognition resulting from generation of circle based on least square method. The system is to install in-line process using high reliable and high accurate position recognition. The experimental results show that the performance is good in detecting errors within tolerance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.04b
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• pp.1-5
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• 2000

As the semiconductor devices are miniaturized, the number of the unit cleaning processes increases. In order to processes by conventional RCA cleaning process, the consumption of volume of liquid chemical and DI water became huge. Therefore, the problem of environmental issues are evolved by the increased consumption of chemicals. To resolve this matter, an advanced cleaning process by Electrolyzed Water was studied in this work. The electrolyzed water was made by an electrolysis equipment which was composed of three chambers of anode, cathode, and middle chambers. In the case of electrolyzed water with electrolytes in the middle chamber, oxidatively acidic water of anode and reductively alkaline water of cathode were obtained. The oxidation/reduction potentials and pH of anode water and cathode water were measured to be +l000mV and 4.8, and -530mV and 6.3, respectively. The Si-wafers contaminated with metallic impurities were cleaning with the electrolyzed water. To analysis the amounts of metallic impurities on Si-water surfaces, ICP-MS(Inductively Coupled Plasma-Mass spectrometer) was introduced. From results of ICP-MS measurements, it was concluded that the ability of electrolyzed water was equivalent to that of the conventional RCA cleaning.

• Journal of the Korean institute of surface engineering
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• v.54 no.6
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• pp.365-370
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• 2021

In this research, we proceeded with research on plasma resistance of the cleaning process of APS(Atmospheric Plasma Spray)-Y₂O₃ coated parts used for semiconductor and display plasma process equipment. CF₄, O₂, and Ar mixed gas were used for the plasma environment, and respective alconox, surfactant, and piranha solution was used for the cleaning process. After APS-Y₂O₃ was exposed to CF₄ plasma, the surface changed from Y₂O₃ to YF₃ and a large amount of carbon was deposited. For this reason, the plasma corrosion resistance was lowered and contamination particles were generated. We performed a cleaning process to remove the defect-inducing surface YF₃ layer and carbon layer. Among three cleaning solutions, the piranha cleaning process had the highest detergency and the alconox cleaning process had the lowest detergency. Such results could be confirmed through the etching amount, morphology, composition, and accumulated contamination particle analysis results. Piranha cleaning process showed the highest detergency, but due to the very large thickness reduction, the base metal was exposed and a large number of contaminated particles were generated. In contrast, the surfactant cleaning process exhibit excellent properties in terms of surface detergency, etching amount, and accumulated contamination particle analysis.

• Journal of the Korean Home Economics Association
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• v.35 no.1
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• pp.75-84
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• 1997

This study is a content analysis of housing management as shown in the Sa-so-jul. This book is written by Lee, Duk Moo in 1741 during Chosun dynasty. This contents relates to life management. The contents of housing management were storage cleaning and equipment management. The major findings this study are as follows. 1) Housing management was charged with woman. 2) Contents of housing managements were storage cleaning and equipment management. 3) It goes into detial. 4) Housing management relates to clothing & food management. 5) In the traditional society woman have to upright in her actions which is housing management. But today things are not what they used to be. A woman does not think anymore to do work housekeeping. But an idea of life does not change. So it is following as shown in the Sa-so-jul. 1) We must to clean for housing management. 2) Housing management is for my family and our neighborhood.

• Journal of the Semiconductor & Display Technology
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• v.3 no.2
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• pp.11-15
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• 2004

Scales, accumulated on some parts of semiconductor equipments such as sputters and CVD during the device fabrication processes, often lower the lifetime of the equipments and production yields. Thus, many equipment parts have be cleaned regularly. In this study, an attempt to establish an effective process to remove scales on the sidewall of collimators located inside the chamber of the sputter was made. The EDX analysis revealed that the scales were composed of Ti and TiN with the columnar structure. Through the trial-and-error experiments, it was found that the etching in the $HNO_3$:$H_2SO_4$:$H_2O$=4:2:4 solution for 5.5 hrs at $67^{\circ}C$, after the oxide removal in the HF solution, and the heat-treatment at $700^{\circ}C$ for 1 min., was the most effective process for the scale removal.

• Journal of Korean Society of Archives and Records Management
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• v.13 no.1
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• pp.35-58
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• 2013

The archives preservation chamber is an equipment that is able to store important archives with air-cleaning and isothermal-isohumidity control functions to permanently store archives in a highly safe environment. The chamber can only store small amounts of archives but it is crucial for organizations preserving archives to economically store a variety of archives, be it a medium or a small amount of documents. An arm of this study researches the current preservation status of the local record center to determine the need for such a chamber. In addition, in order to improve the air-cleaning and isothermal-isohumidity functions, the researchers of this study have conducted analyses to design the core parts. The preservation chamber that had been designed includes an archives preservation area, air-cleaning equipment, and environment measurement equipment. A preservation chamber is used to preserve small amounts of important archives safely. Thus, when a local record center is preserving various types of archives in small or medium quantities in a stack room, the preservation chamber can be used to aid their long-term preservation.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.20 no.8
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• pp.6-14
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• 2006

This paper is a study about a proper method of plasma generation to cleaning method and a high frequency power equipment circuit to generation of plasma that used cleaning of chamber for TFT-LCD PECVD. The high density plasma required for cleaning causes a possibility of high density plasma more than $1{\times}10^{11}[EA/cm^3]$. It apply a ferrite core of ferromagnetic body to a existing ICP form. In case of power transfer equipment on 400[kHz] high frequency to generation of plasma it makes certain a stable switching operation in condition of plasma through using a inverter form for general purpose HB. And it demonstrates the performance of power transfer equipment using methods of measurement which use a transformer of series combination the density of plasma and the rate of dissolution of $NF_3$ in condition of $A_r\;and\;NF_3$.