• 제목/요약/키워드: Cleaning Effect

검색결과 625건 처리시간 0.029초

효소에 의한 초지용 펠트의 세척효과 (Cleaning Effect of Papermaking Felt with Enzymes)

  • 윤병태;김성보;엄태진;최명재
    • 펄프종이기술
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    • 제37권3호
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    • pp.17-22
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    • 2005
  • The cleaning efficiency of papermaking felt which is contaminated with fiber fines and various micro-materials was investigated and compared between the application of enzyme and commercial detergent. It was found that the cleaning efficiency by the treatment of acidic-based detergent was more efficient than that of alkaline-based one in the conventional commercial detergent. it was also observed that the treatment design of first acidic-based detergent treatment to second alkaline-based detergent procedure was better in the cleaning efficiency, compared to alkaline based-to-acidic based one. The cleaning property of felt with enzyme was resulted in good cleaning efficiency, without any addition of surfactant. Especially, the enzyme treatment under alkaline condition (pH 10) showed a better cleaning result than that under acidic condition(pH 5). The addition of nonionic surfactant to the enzyme increased the cleaning efficiency of felt and decreased the cationic demand of wastewater. These results showed more favour than the application of conventional commercial detergent.

세정액에 따른 실리콘 웨이퍼의 Cu 및 Fe 불순물 제거 (Removal of Cu and Fe Impurities on Silicon Wafers from Cleaning Solutions)

  • 김인정;배소익
    • 한국재료학회지
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    • 제16권2호
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    • pp.80-84
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    • 2006
  • The removal efficiency of Cu and Fe contaminants on the silicon wafer surface was examined to investigate the effect of cleaning solutions on the behavior of metallic impurities. Silicon wafers were intentionally contaminated with Cu and Fe solutions by spin coating and cleaned in different types of cleaning solutions based on $NH_4OH/H_2O_2/H_2O\;(SC1),\;H_2O_2/HCl/H_2O$ (SC2), and/or HCl/$H_2O$ (m-SC2) mixtures. The concentration of metallic contaminants on the silicon wafer surface before and after cleaning was analyzed by vapor phase decomposition/inductively coupled plasma-mass spectrometry (VPD/ICP-MS). Cu ions were effectively removed both in alkali (SC1) and in acid (SC2) based solutions. When $H_2O_2$ was not added to SC2 solution like m-SC2, the removal efficiency of Cu impurities was decreased drastically. The efficiency of Cu ions in SC1 was not changed by increasing cleaning temperature. Fe ions were soluble only in acid solution like SC2 or m-SC2 solution. The removal efficiencies of Fe ions in acid solutions were enhanced by increasing cleaning temperature. It is found that the behavior of metallic contaminants as Cu and Fe from silicon surfaces in cleaning solutions could be explained in terms of Pourbaix diagram.

Analysis of Variables Effects in 300mm PECVD Chamber Cleaning Process Using NF3

  • Sang-Min Lee;Hee-Chan Lee;Soon-Oh Kwon;Hyo-Jong Song
    • 반도체디스플레이기술학회지
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    • 제23권2호
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    • pp.114-122
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    • 2024
  • NF3, Chamber cleaning gas, has a high Global Warming Potential (GWP) of 17,000, causing significant greenhouse effects. Reducing gas usage during the cleaning process is crucial while increasing the cleaning Rate and reducing cleaning standard deviation (Stdev). In a previous study with a 6-inch PECVD chamber, a multiple linear regression analysis showed that Power and Pressure had no significant effect on the cleaning Rate because of their P-values of 0.42 and 0.68. The weight for Flow is 11.55, and the weights for Power and Pressure are 1.4 and 0.7. Due to the limitations of the research equipment, which differed from those used in actual industrial settings, it was challenging to assess the effects in actual industrial environment. Therefore, to show an actual industrial environment, we conducted the cleaning process on a 12-inch PECVD chamber, which is production-level equipment, and quantitatively analyzed the effects of each variable. Power, Pressure, and NF3 Flow all had P-values close to 0, indicating strong statistical significance. The weight for Flow is 15.68, and the weights for Power and Pressure are 4.45 and 5.24, respectively, showing effects 3 and 7 times greater than those with the 6-inch equipment on the cleaning rate. Additionally, we analyzed the cleaning Stdev and derived that there is a trade-off between increasing the cleaning Rate and reducing the cleaning Stdev.

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$CO_2$ Snow Cleaning 적용 철제유물 표면 이물질 제거 연구 (Application Study of $CO_2$ Snow Cleaning for Cleaning of Foreign Matter and Corrosion Products on Iron Artifacts)

  • 이은지;조남철;이종명;유재은
    • 보존과학회지
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    • 제27권3호
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    • pp.333-344
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    • 2011
  • 철제유물의 보존처리 과정 중 표면 이물질 제거는 유물의 원형을 찾아주는 중요한 단계이다. 현재 표면 이물질 제거 시 가장 많이 사용하는 sand blaster (air brasive)의 경우, 분사되는 유리가루는 인체에 유해하고 환경오염을 유발하는 주요한 물질이다. 그러므로 이런 문제점을 보완하기 위해 타 산업분야에서 친환경세정장비로 많이 쓰이고 있는 $CO_2$ snow cleaning을 철제유물 표면 이물질 제거에 적용하여 비교·연구 하였다. 실험은 부식시험편과 철제유물에 sand blaster와 $CO_2$ snow cleaning을 적용하여 비교 분석하였다. 부식시험편의 경우, sand blaster와 $CO_2$ snow cleaning 방법 모두 이물질 제거 정도, 표면 거칠기, 색도 측정 결과가 유사하게 나타났으며, 특히 SEM을 통해 $CO_2$ snow cleaning을 적용한 부식시험편은 sand blaster에 비해 표면을 마모시키지 않는 것을 확인하였다. 또한 철제유물에 적용한 경우, $CO_2$ snow cleaning의 power nozzle은 sand blaster에 비해 표면을 마모시키지 않고 고른 표면을 유지하는 등 세정효과가 우수하게 나타났다. 그리고 X-ray촬영을 통해 이물질 제거 전과 후 금속 내부의 구조적 변화는 없음을 관찰하였다. 결론적으로 sand blaster와 $CO_2$ snow cleaning의 power nozzle은 이물질 제거 효과가 유사함을 확인할 수 있었다. 그러나 $CO_2$ snow cleaning의 power nozzle을 철제유물에 적용하여도 sand blaster와 유사한 효과는 얻을 수 있으나, 분사압력이 높을 경우 철제 유물이 손상될 우려가 있으므로 유물 내부 상태에 따라 적용여부를 판단해야 함을 본 실험을 통하여 알 수 있었다.

수계세정제의 계면활성제 종류에 따른 물성, 세정성 및 유수분리 영향 연구 (Effect of surfactant types in aqueous cleaning agents on their physical properties, cleaning ability and oil-water separation)

  • 박선우;차안정;김현탁;김한성;배제흠
    • 청정기술
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    • 제9권1호
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    • pp.9-21
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    • 2003
  • CFC-113, 1,1,1-TCE는 오존파괴물질로 선진국에서는 이미 사용이 전면 규제되고 있고 MC, TCE는 유해성 또는 발암성물질로 판명되어 일부사업장에서 제한적으로 사용되고 있다. 그러므로 세정성이 좋고 환경/안전성이 우수한 대체세정제를 개발하여 사용하거나 기존 개발된 세정제 중에서 우수한 세정제를 선정하여 사용하는 것이 필요한 실정이다. 대체세정제로는 수계세정제가 환경성과 경제적면에서 유망한 것으로 평가받고 있어 많은 사업장에서 사용될 전망이다. 본 연구에서는 환경친화적인 수계세정제를 개발하기 위하여 수계세정제의 주요성분인 여러 형태의 계면활성제를 선정하여 이들의 물성, 거품성, 오염물 종류에 따른 세정성, 유수분리성을 평가하여 비교하였다.

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연소로 효율증진을 위한 on-line 세정 방법에 관한 연구 (A Study of On-line Cleaning Method for Increasing Efficiency in a Combustor)

  • 장현태;한승동;박태성;차왕석
    • 한국산학기술학회논문지
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    • 제11권3호
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    • pp.1016-1022
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    • 2010
  • 액상 중유 연료를 사용하는 고용량 증기 보일러에서 발생되어 연소기기 내부에 침적되는 슈트, 슬래그, 크랭커, 회분, 산화물의 on-line 세정을 위한 세정제 제조에 대한 연구를 수행하였다. 액상 중유 연료를 사용하는 보일러 및 가열로에 생성되는 슈트, 슬래그, 크랭커, 회분, 산화물을 제거하는 기존 기술은 보일러 및 가열로의 가동 중단 후 작업자들에 의한 기계적인 처리를 통하여 침적물을 제거하는 기술을 사용하고 있다. 기존 기술을 대치할 수 있고 보일러의 중단이 없는 상태에서 침적물을 세정할 수 있는 세정제의 최적 조성을 도출하였다. 질산암모늄과 질산마그네슘의 혼합물이 주 세정제로 도출되었으며, 각종 전이금속 화합물에 의한 영향을 영향을 연구하여, 세정에 의한 부식을 방지할 수 있으며, 연소효율의 증대를 얻을 수 있는 전이금속화합불 첨가제를 도출하였다.

초순수의 오염과 반도체 제조에 미치는 영향에 대한 연구 (A Study on the Contamination of D.I. Water and its Effect on Semiconductor Device Manufacturing)

  • 김흥식;유형원;윤철;김태각;최민성
    • 전자공학회논문지A
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    • 제30A권11호
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    • pp.99-104
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    • 1993
  • We analyzed the D.I. water used in wet cleaning process of semiconductor device manufacturing both at the D.I. water plant and at the wafer cleaning bath to detect the impurity source of D.I. water contamination. This shows that the quantity of impurity is related to the resistivity of D.I. water, and we found that the cleanliness of the wafer surface processed in D.I. water bath was affected by the degree of the ionic impurity contamination. So we evaluated the cleaning effect as different method for Fe ion, having the best adsoptivity on wafer surface. Moreover the temperature effect of the D.I. water is investigated in case of anion in order to remove the chemical residue after wet process. In addition to the control of D.I. water resistivity, chemical analysis of impurity control in D.I. water should be included and a suitable cleaning an drinsing method needs to be investigated for a high yielding semiconductor device.

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펨토초레이저 충격파에 의한 형광 나노입자 제거 (Removal of Nano-scaled Fluorescence Particles on Wafer by the Femtosecond Laser Shockwave)

  • 박정규;조성학;김재구;장원석;황경현;유병헌;김광열
    • 한국정밀공학회지
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    • 제26권5호
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    • pp.150-156
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    • 2009
  • The removal of tiny particles adhered to surfaces is one of the crucial prerequisite for a further increase in IC fabrication, large area displays and for the process in nanotechnology. Various cleaning techniques (wet chemical cleaning, scrubbing, pressurized jets and ultrasonic processes) currently used to clean critical surfaces are limited to removal of micrometer-sized particles. Therefore the removal of sub-micron sized particles from silicon wafers is of great interest. For this purpose various cleaning methods are currently under investigation. In this paper, we report on experiments on the cleaning effect of 100nm sized fluorescence particles on silicon wafer using the plasma shockwave occurred by femtosecond laser. The plasma shockwave is main effect of femtosecond laser cleaning to remove particles. The removal efficiency was dependent on the gap distance between laser focus and surface but in some case surface was damaged by excessive laser intensity. These experiments demonstrate the feasibility of femtosecond laser cleaning using 100nm size fluorescence particles on wafer.

Effect of ultrasonic cleaning on the bond strength of fiber posts in oval canals filled with a premixed bioceramic root canal sealer

  • Bengoa, Fernando Pena;Arze, Maria Consuelo Magasich;Noguera, Cristobal Macchiavello;Moreira, Luiz Felipe Nunes;Kato, Augusto Shoji;Da Silveira Bueno, Carlos Eduardo
    • Restorative Dentistry and Endodontics
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    • 제45권2호
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    • pp.19.1-19.8
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    • 2020
  • Objective: This study aimed to evaluate the effect of ultrasonic cleaning of the intracanal post space on the bond strength of fiber posts in oval canals filled with a premixed bioceramic (Bio-C Sealer [BIOC]) root canal sealer. Materials and Methods: Fifty premolars were endodontically prepared and divided into 5 groups (n = 10), based on the type of root canal filling material used and the post space cleaning protocol. A1: gutta-percha + AH Plus (AHP) and post space preparation with ultrasonic cleaning, A2: gutta-percha + BIOC and post space preparation with ultrasonic cleaning, B1: gutta-percha + AHP and post space preparation, B2: gutta-percha + BIOC and post space preparation, C: control group. Fiber posts were cemented with a self-adhesive luting material, and 1 mm thick slices were sectioned from the middle and cervical third to evaluate the remaining filling material microscopically. The samples were subjected to a push-out test to analyze the bond strength of the fiber post, and the results were analyzed with the Shapiro-Wilk, Bonferroni, Kruskal-Wallis, and Mann-Whitney tests (p < 0.05). Failure modes were evaluated using optical microscopy. Results: The results showed that the fiber posts cemented in canals sealed with BIOC had lower bond strength than those sealed with AHP. The ultrasonic cleaning of the post space improved the bond strength of fiber posts in canals sealed with AHP, but not with BIOC. Conclusions: BIOC decreased the bond strength of fiber posts in oval canals, regardless of ultrasonic cleaning.

구름 마모시험 장비(Rolling wear tester)를 이용한 마모 후의 접촉각과 자가세정 효과와의 관계 규명을 통한 재료 내구성 평가 (Evaluation of Material Durability by Identifying the Relationship between Contact Angle after Wear and Self-cleaning Effect Using Rolling Wear Tester)

  • 박경렬;최용석;강성민;김운성;정경은;박영진;이경준
    • Tribology and Lubricants
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    • 제39권6호
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    • pp.256-261
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    • 2023
  • This study is conducted to evaluate the durability of superhydrophobic surfaces, with a focus on two aspects: contact angle measurement and self-cleaning-performance analysis. Superhydrophobic copper and aluminum surfaces are fabricated using the immersion method and subjected to a rolling wear test, in which a 2 kg weight is placed on a rolling tester, under loaded conditions. To evaluate their durability, the contact angles of the specimens are measured for each cycle. In addition, the surface deformation of the specimens before and after the test is analyzed through SEM imaging and EDS mapping. The degradation of the self-cleaning performance is evaluated before and after the wear test. The results show that superhydrophobic aluminum is approximately 4.5 times more durable than superhydrophobic copper; the copper and aluminum specimens could endure 21,000 and 4,300 cycles of wear, respectively. The results of the self-cleaning test demonstrate that superhydrophobic aluminum is superior to superhydrophobic copper. After the wear test, the self-cleaning rates of the copper and aluminum specimens decrease to 72.7% and 83.4%, respectively. The relatively minor decrease in the self-cleaning rate of the aluminum specimen, despite the large number of wear cycles, confirms that the superhydrophobic aluminum specimen is more durable than its copper counterpart. This study is expected to aid in evaluating the durability of superhydrophobic surfaces in the future owing to the advantage of performing wear tests on superhydrophobic surfaces without damaging the surface coating.