• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1998.04a
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• pp.187-193
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• 1998

In the tandom pencil slat saw lines, feeding of cedar blocks is often stopped because excessive motor current is required in a saw machine. These events are called "kickoffs' in factory lines. Kickoffs decrease productivity due to machine down-time and damage to saw blades often accompanies them. Researches on saw behavior at kickoff are required to understand and reduce the frequency and severity of kickoff events. This research aims at understanding the fundamental mechanisms of kickoffs during cutting, predicting the impending kickoff and evolving design improvements for high cutting performance with fewer and less severe kickoffs.offs.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.729-732
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• 2000

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing such as blade, wafer, cutting water and cutting condition. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer as GaAs. In order to overcome this problem, a new dicing process is necessary. This paper describes a new machine using scriber, breaker, and precision servo mechanism in order to dice an semiconductor wafer.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.5
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• pp.70-75
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• 2000

After the patterning and probe process of wafer have been achieved, the dicing process is necessary to separate chips from a wafer. The dicing process cuts a wafer to lengthwise and crosswise direction to make many chips by using narrow circular rotating diamond blade. But inferior goods are made under the influence of complex dicing environment such as blade, wafer, cutting water and cutting conditions. This paper describes a monitoring algorithm using feature extraction in order to find out an instant of vibration signal change when bad dicing appears. The algorithm is composed of two steps: feature extraction and decision. In the feature extraction, two features processed from vibration signal which is acquired by accelerometer attached on blade head are proposed. In the decision. a threshold method is adopted to classify the dicing process into normal and abnormal dicing. Experiment have been performed for GaAs semiconductor wafer. Based upon observation of the experimental results, the proposed scheme shown a good accuracy of classification performance by which the inferior goods decreased from 35.2% to 12.8%.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.8
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• pp.1309-1316
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• 2003

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But products with inferior quality are produced under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not apply this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer such as SiO2, GaAs, GaAsP, and AlGaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes a new wafer dicing method using fixed diamond scriber and precision servo mechanism and determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using scriber.

• Proceedings of the KIPE Conference
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• 1998.07a
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• pp.352-356
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• 1998

This paper is a study about Ac servo motor position and speed control characteristics which depend on feedforward control, the acceleration / deceleration time constant after the interpolation, and PI control, automatic deceleration at corner in order to shape cutting control of feed drive system of the machine tool. The shape error caused by delay of the servo system in the direction of radius at the time of circular cutting is reduced by feedforward control. The shape error generated by the position command delay is minimized by using the acceleration / deceleration time constant after the interpolation. The results were verified to optical machining center experimentation of the machine tool.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.243-244
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• 2006

In this paper, the development of an error measurement system of 5-axis mill & turn machine tool presented by double ball bar test, which has been widely used to measure the overall accuracy of machining center. and the reliability of an error measurement system of 5-axis mill & turn machine tool was secured by the direct cutting test.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.2
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• pp.218-225
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• 2003

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. However, inferior goods may be made under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not apply this dicing method to a GaN wafer, because the GaN wafer is harder than other wafers such as SiO$_2$, GaAs, GaAsP, and AlGaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using a scriber.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.164-167
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• 2002

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer such as SiO$_2$, GaAs, CaAsP, and AlCaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using scriber.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.9
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• pp.58-63
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• 2019

In this research, we examine the change of dimensional accuracy in the cutting process while changing cutting conditions such as feed rate and spindle rotational speed with chromium molybdenum steel (SCM415) material and TiCN- and TiAlN-coated end mill tools. According to dimensional accuracy measurement, TiCN-coated tool displays the most accurate dimensional tolerance at ${\varnothing}20mm$ at feed rates of 200 mm/min and 250 mm/min at a spindle rotation speed of 4,000 rpm. The largest dimension of the coating tool was able to make the TiAlN-coated tool suitable when comparing the smallest dimension.

• Steel and Composite Structures
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• v.18 no.3
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• pp.739-756
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• 2015

This paper presents investigations on the hysteretic behavior of concrete-filled circular tubular (CFCT) T-joints subjected to axial cyclic loading at brace end. In the experimental study, four specimens are fabricated and tested. The chord members of the tested specimens are filled with concrete along their full length and the braces are hollow section. Failure modes and load-displacement hysteretic curves of all the specimens obtained from experimental tests are given and discussed. Some indicators, in terms of stiffness deterioration, strength deterioration, ductility and energy dissipation, are analyzed to assess the seismic performance of CFCT joints. Test results indicate that the failures are primarily caused by crack cutting through the chord wall, convex deformation on the chord surface near brace/chord intersection and crushing of the core concrete. Hysteretic curves of all the specimens are plump, and no obvious pinching phenomenon is found. The energy dissipation result shows that the inelastic deformation is the main energy dissipation mechanism. It is also found from experimental results that the CFCT joints show clear and steady stiffness deterioration with the increase of displacement after yielding. However, all the specimens do not perform significant strength deterioration before failure. The effect of joint geometric parameters ${\beta}$ and ${\gamma}$ of the four specimens on hysteretic performance is also discussed.