• 한국공작기계학회논문집
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• 제11권2호
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• pp.1-8
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• 2002

Cutting force is obtained as a sum of chip removing force and ploughing force. Chip removing force is estimated by multiplying specific cutting pressure by cutting area. Since ploughing force is caused from dullness of a tool, its magnitude is constant if depth of cut is bigger than a certain value. Using the linearity of chip removing force to cutting area and the constancy of ploughing force regardless of depth of cut which is over a certain limit each force is separated from measured cutting force and used to establish cutting force model. New rotation matrix to convert the measured cutting force in reference axes into the forces in cutter axes is obtained by considering that tool angles are projected angles from cutter axes to reference axes.. Spindle tilt is also considered far the model. The predicted cutting force estimated from the model is in good agreement with the measured force.

• 한국전자파학회논문지
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• 제25권12호
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• pp.1228-1235
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• 2014

UHF RFID 태그를 설계하기 위해서는 태그 칩의 입력 임피던스 값이 필요하다. 입력 임피던스 산출에는 직접측정 방법이 보편적으로 사용되고 있다. 본 연구에서는 이 방법을 사용할 경우, 칩을 측정장치에 연결하기 위해 도입되는 픽스쳐에서 발생되는 문제점을 분석하고, 그 결과를 확인하였다. 이 문제를 근본적으로 피해갈 수 있는 대안으로 모델링 방법을 제안하고, 실험을 통해 타당성과 정확도를 확인하였다.

• 한국기계가공학회지
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• 제20권1호
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• pp.103-109
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• 2021

Fine chips generated by machining have an impact on machine failure and quality of machined products, it is necessary to remove the chips, so the microchip collection and removal device by rotating conveyor belt with neodymium permanent magnets was developed. In this research, to solve the problem for reducing the existing microchips in the tank, a micro-chip removal device by rotating conveyor belt with neodymium permanent magnets developed. In the development of micro-chip removal device, 3D CATIA modeling was used, and the flow analysis and the electromagnetic force analysis were performed with COMSOL Multiphysics program. To evaluate the performance of the prototypes produced, design of experiments (DOE) is used to obtain the effect of neodymium conveyor movement speed on chip removal for the ANOVA analysis of recovered powders. An experiment was conducted to investigate the effect of the conveyor feed rate on the chip removal performance in detail. As a result of the experiment, it was confirmed that the slower the feeding speed of the fine chip removing device, the more efficient the chip removal.

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2006년도 추계학술발표대회 논문집
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• pp.103-107
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• 2006

Decapsulation of EMC(Epoxy Molding Compound) in package device is a method used to inspect inside of device by removing plastic molding. So far, chemical etching and mechanical grinding methods have been used widely. Recently, several works using laser have been carried out. This method has advantages with fast process time and precision than conventional methods because of noncontact process. Also, laser process is a clean process because of removing EMC directly without using toxic chemicals. The wavelength of laser used in this study is 355nm. Key parameters of removing EMC are laser power, scan speed, and number of scans of laser. It if confirmed that laser decapsulation is a useful process to inspect inside a device with a small thermal damage to chip surface.

• Applied Microscopy
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• 제50권
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• pp.22.1-22.6
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• 2020

In-situ transmission electron microscopy (TEM) holders that employ a chip-type specimen stage have been widely utilized in recent years. The specimen on the microelectromechanical system (MEMS)-based chip is commonly prepared by focused ion beam (FIB) milling and ex-situ lift-out (EXLO). However, the FIB-milled thin-foil specimens are inevitably contaminated with Ga⁺ ions. When these specimens are heated for real time observation, the Ga⁺ ions influence the reaction or aggregate in the protection layer. An effective method of removing the Ga residue by Ar⁺ ion milling within FIB system was explored in this study. However, the Ga residue remained in the thin-foil specimen that was extracted by EXLO from the trench after the conduct of Ar⁺ ion milling. To address this drawback, the thin-foil specimen was attached to an FIB lift-out grid, subjected to Ar⁺ ion milling, and subsequently transferred to an MEMS-based chip by EXLO. The removal of the Ga residue was confirmed by energy dispersive spectroscopy.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.138-140
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• 2001

Fluxless flip chip bonding using plasma & ultrasonic wave was investigated in order to evaluate the effect of plasma & ultrasonic treatment on the bondability of the Sn-3.5wt%Ag solder bumped die to TSM-coated glass substrate. The $Ar+10%H_2plasma$ was effective in removing tin oxide on solder surface. The die shear strength of the plasma-treated Si-chip is higher than that of non-treated specimen but lower than that of specimen bonded with flux. The die shear strength with the bonding load at 25W ultrasonic power increased to 0.8N/bump for all bonding temperature but decreased above 1.0N/bump.

• KIEE International Transactions on Electrophysics and Applications
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• 제4C권3호
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• pp.91-95
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• 2004

The pulsed power system is widely available for use in pulse generator applications. Generally, the pulse generator is required for very short pulse width and high peak value. We have designed and fabricated our own pulsed type power system and through its use, we investigated microbe removal characteristics. This paper introduces a simple pulsed power system for removing various microbes caused by dirty water. This system includes a 2 times power supply circuit, IR2110 operated by using a fixed voltage regulator 7812 and 7805, and the switching MOSFET (Metal Oxide Semiconductor Field Effect Transistor). We can also control this process by using a PIC one chip microprocessor. As a result, we can obtain good removing characteristics of various microbes by adjusting the charging voltage, the pulse repetition rate and the electrical field inducing time.

• 한국정밀공학회지
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• 제18권6호
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• pp.114-120
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• 2001

It is necessary to develop a new metal cutting technology which does not use cutting fluid, since cutting fluid can have undesirable effect on workers's health and working environment. For this to be possible, it is necessary to replace the conventional method of using cutting fluid, whose basic functions are removing chip and heat, and providing lubrication between tool and chip. In this work, cooled air is utilized in order to replace cutting fluid. Experiments were carried out while cutting workpiece with HSS flat endmill under a variety of supply conditions for cooled air. Also the performance characteristics of the air cooling system. which was built for the experiments, were carefully analyzed. For the reliable operation of air cooling system. moisture contained in the cooled air had to be removed before being supplied to the workpiece and tools. It was found that depending on the amount of its flow rate the temperature of cooled air changes at the time of injection from the nozzle. The flow rate of cooled air also plays an important role in removing the accumulated chip on the workpiece. After comparing the flank wear for the three cases of using cooled air, cutting fluid, and pure dry technique, it was demonstrated that the level of flank wear was similar for the cases of cooled air and cutting fluid. The pure dry technique, however, showed higher level of flank wear than cooled air.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.1416-1417
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• 2007

The high frequency pulsed power system is widely available for use in high frequency generator applications. We designed and fabricated our own high frequency pulsed power system to obtain very sort pulse width and high peak value and investigated microbe removal characteristics using it. This paper introduces a simple high voltage high frequency pulsed power system for removing various bacteria caused by dirty water. This system include power supply circuit, switching MOSFET, and flyback converter. We can also control the switching using a PIC one chip microprocessor. As a result, we can obtain good removing characteristics of various bacteria by adjusting the charging voltage, the pulse repetition rate and the electrical field inducing time.

• 한국세라믹학회지
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• 제36권6호
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• pp.583-589
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• 1999

In the fabrication of ceramic chip couples for high frequency application such as the mobile communication equipment the formation of electrode lines and Ag diffusion were investigated with heat treatment conditions for removing organic binders. The deformation and densification of the electrode line greatly depended on the binder burnout process due to the overlapped temperature zone near 400$^{\circ}C$ of the binder dissociation and the solid phase sintering of the silver electrode. Ag ions were diffused into the glass ceramic substrate. The Ag diffusion was led by the glassy phase containing Pb ions rather than by the crystalline phase containing Ca ions. The fact suggests that the Ag diffusion could be controlled by managing the composition of the glass ceramic substrate.