• Title/Summary/Keyword: Chip load

Search Result 225, Processing Time 0.024 seconds

Cutting force analysis in ball-end milling processes of STD11 (STD11의 볼엔드밀링 공정에서의 절삭력 해석)

  • 김남규
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
    • /
    • 2000.04a
    • /
    • pp.52-57
    • /
    • 2000
  • STD11 is one of difficult-to-cut materials and its cutting characteristic data is not built enough. A bad cutting condition of it leads to low productivity of die and mould, so it is necessary to evaluate the machining characteristics of STD11. In this paper, the relations of the geometry of ball-end mill and mechanics of machining with it are studied. The helix angle of ball-end mill varies according to a location of elemental cutting edge in the cutting process are difficult to calculate accurately. To calculate instantaneous cutting forces, it is supposed that the tangential, radial and axial cutting force coefficients are functions of elemental cutting edge location. Elemental cutting forces in the x,y and z direction are calculated by coordinate transformation. The total cutting forces are calculated by integrating the elemental cutting forces of engaged cutting edge elements. This model is verified by slot and side cutting experiments of STD11 workpiece which was heat-treated to HRC45.

  • PDF

Surface Texture and Roughness of inclined surface milled by Long neck ball endmill (리브가공용 롱엔드밀의 경사면 가공시 표면형상 및 조도)

  • Yang J.S.;Jung T.S.;Kim Y.G.
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2006.05a
    • /
    • pp.565-566
    • /
    • 2006
  • High speed machining experiment on the inclined surfaces of hardened mold steel(STAVAX at hardness HRC 53) is carried out using the long-neck type ball endmill. Surface texture and roughness are compared fur various cutting conditions. Tool overhang length greatly affects the roughness of machined surface. It is found that, fur this type of long-neck endmill, the chip load should be carefully selected by reducing either the axial depth of cut or feedrate to avoid tool vibration. Feedrate adjustment is more appropriate method in terms of tool wear.

  • PDF

In-Process Cutter Runout Compensation Using Repetitive Learning Control

  • Joon Hwang;Chung, Eui-Sik
    • International Journal of Precision Engineering and Manufacturing
    • /
    • v.4 no.4
    • /
    • pp.13-18
    • /
    • 2003
  • This paper presents the in-process compensation to control cutter ronout and to improve the machined surface quality. Cutter ronout compensation system consists of the micro-positioning servo system with piezoelectric actuator which is embeded in the sliding table to manipulate radial depth of cut in real-time. Cutting force feedback control was proposed in the angle domain based upon repetitive learning control strategy to eliminate chip load variation in end milling process. Micro-positioning control due to adaptive actuation force response improves the machined surface quality by cutter ronout compensation.

Aging Characteristic of Shear Strength in Micro Solder Bump (마이크로 솔더 범프의 전단강도와 시효 특성)

  • 김경섭;유정희;선용빈
    • Journal of Welding and Joining
    • /
    • v.20 no.5
    • /
    • pp.72-77
    • /
    • 2002
  • Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of microelectronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder b01p and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

Improved Circuits for Single-photon Avalanche Photodiode Detectors

  • Kim, Kyunghoon;Lee, Junan;Song, Bongsub;Burm, Jinwook
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.14 no.6
    • /
    • pp.789-796
    • /
    • 2014
  • A CMOS photo detection bias quenching circuit is developed to be used with single photon avalanche photodiodes (SPADs) operating in Geiger mode for the detection of weak optical signals. The proposed bias quenching circuits for the performance improvement reduce the circuit size as well as improve the performance of the quenching operation. They are fabricated in a $0.18-{\mu}m$ standard CMOS technology to verify the effectiveness of this technique with the chip area of only $300{\mu}m^2$, which is about 60 % of the previous reported circuit. Two types of proposed circuits with resistive and capacitive load demonstrated improved performance of reduced quenching time. With a commercial APD by HAMAMATSU, the dead time can be adjusted as small as 50 ns.

Research on the Performance Test of System in Package Chips for the Digital Broadcasting Receiver (디지털 방송 수신용 System in Package 칩의 성능 검사에 관한 연구)

  • Kim, Jee-Gyun;Lee, Heon-Yong
    • The Transactions of The Korean Institute of Electrical Engineers
    • /
    • v.57 no.12
    • /
    • pp.2228-2233
    • /
    • 2008
  • This research paper aims to establish a test process of the AFE SiP chip. It measured the sensitivity, current consumption and power consumption both on the evaluation socket board and Catalyst load board. As a result, the sensitivity became deteriorated with an average of 0.2[dBm] at the channel 62 only, the current consumption increased to an average of 0.57[mA] and the power consumption increased to an average of 1.76[mW], But all characteristics incomes the tolerance of the measurement, it also keeps almost the same level. Therefore this design of the test process improved a valid design.

Study on grid-connected photovoltaic 3 kW Inverter (3kW급 계통 연계형 태양광 인버터에 관한 연구)

  • Song, S.G.;Lee, S.H.;Park, S.J.
    • Proceedings of the KIPE Conference
    • /
    • 2005.07a
    • /
    • pp.707-710
    • /
    • 2005
  • This paper presents a 3kW grid-connection photovoltaic power generation system and its topology. Photovoltaic system must provide the sinusoidal output voltage wave for unity power factor High frequency switching converters are becoming more popular because of several benefits which are essential in power conversion system. This paper introduces a high speed digital controller using TMS320F2812 DSP chip which can be used for high frequency switching converters. The experimental results of the proposed PWM Inverter demonstrates its high performance with unity input power factor having very low distorsion in input current waveforms and good dynamic characteristics at full load.

  • PDF

A Study on Refrigeration warehouse operation for Energy saving technique (에너지 절감 기법을 적용한 냉동 냉장 창고 운영에 관한 연구)

  • Kim, Dae-Gyun;Kwon, Jung-Dong;Hahm, Nyun-Gun;Lee, Sang-Chip;Kim, Ik-Hwan;Lee, Seung-Hwan;Lee, Hoon-Goo;Han, Kyung-Hee
    • Proceedings of the KIPE Conference
    • /
    • 2005.07a
    • /
    • pp.182-184
    • /
    • 2005
  • The human beings have Increased concern about Energy saving and alternative energy. The power demand has increased the growth of industry and the improvement of life We have to explore alternate energy sources and utilize effectively domestic resources. The lighting equipments developed Energy saving by using an electric ballast. The load installation should be promoted to rational power management, according to the network, intelligent, and high-function. Therefore, this paper has studied the method of energy saving and consulting.

  • PDF

A Study on the manage of efficiency of electric facilities for a type of Medium-small building (중.소형 건축물설비의 효율적 전력관리방안 연구)

  • Lee, Sang-Chip;Park, In-Duck;Lee, Won-Goo;Kim, Dae-Gwun;Oh, Bong-Hwan;Lee, Hoon-Goo;Han, Kyung-Hee
    • Proceedings of the KIEE Conference
    • /
    • 1998.07c
    • /
    • pp.838-840
    • /
    • 1998
  • The power demand has increased the groth of industry and improvement of life. Otherwise the power supply is more difficult. because of regional egoism, reinforcement for environment, and investment of money. The load installation should be promoted to rational power management, according to the network, inteligent, and high-function. Therefore, this paper is made a study for the method of energy saving and for energy saving of medium-small type small type-below 500kW medium type-between $500{\sim}1.000kW$.

  • PDF

Implementation of a Fieldbus System Based on EIA-709.1 Control Network Protocol (EIA-709.1 Control Network Protocol을 이용한 필드버스 시스템 구현)

  • Park, Byoung-Wook;Kim, Jung-Sub;Lee, Chang-Hee;Kim, Jong-Bae;Lim, Kye-Young
    • Journal of Institute of Control, Robotics and Systems
    • /
    • v.6 no.7
    • /
    • pp.594-601
    • /
    • 2000
  • EIA-709.1 Control Network Protocol is the basic protocol of LonWorks systems that is emerg-ing as a fieldbus device. In this paper the protocol is implemented by using VHDL with FPGA and C program on an Intel 8051 processor. The protocol from the physical layer to the network layer of EIA-709.1 is im-plemented in a hardware level,. So it decreases the load of the CPU for implementing the protocol. We verify the commercial feasibility of the hardware through the communication test with Neuron Chip. based on EIA-709.1 protocol which is used in industrial fields. The developed protocol based on FPGA becomes one of IP can be applicable to various industrial field because it is implemented by VHDL.

  • PDF