• Title/Summary/Keyword: Chip integration

검색결과 201건 처리시간 0.031초

Retina-Motivated CMOS Vision Chip Based on Column Parallel Architecture and Switch-Selective Resistive Network

  • Kong, Jae-Sung;Hyun, Hyo-Young;Seo, Sang-Ho;Shin, Jang-Kyoo
    • ETRI Journal
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    • 제30권6호
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    • pp.783-789
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    • 2008
  • A bio-inspired vision chip for edge detection was fabricated using 0.35 ${\mu}m$ double-poly four-metal complementary metal-oxide-semiconductor technology. It mimics the edge detection mechanism of a biological retina. This type of vision chip offer several advantages including compact size, high speed, and dense system integration. Low resolution and relatively high power consumption are common limitations of these chips because of their complex circuit structure. We have tried to overcome these problems by rearranging and simplifying their circuits. A vision chip of $160{\times}120$ pixels has been fabricated in $5{\times}5\;mm^2$ silicon die. It shows less than 10 mW of power consumption.

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2단계 고정화법을 이용한 DNA칩 마이크로어레이의 개발 (Development of DNA Chip Microarray by Using Secondary-step immobilization methods)

  • 윤희찬;김도균;신훈규;권영수
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2002년도 추계학술대회 논문집 전기물성,응용부문
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    • pp.263-265
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    • 2002
  • We have used the secondary-step immobilization methods based on the chip pattern of hydrophobic self-assembly layers to assemble microfabricated particles onto the chip pattern. Immobilization of DNA, fabrication of the particles and the chip pattern, arrangement of the particles on the chip pattern, and recognition of each using DNA fluorescence measurement were carried out. Establishing the walls, the arrangement stability of the particles was improved. Each DNA is able to distinguish by using the lithography process on the particles. Advantages of this method are process simplicity, wide applicability and stability. It is thought that this method can be applicable as a new fabrication technology to develop a minute integration type biosensor microarray.

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비수식화 바이오칩 및 유전자 검출 (Genome Detection Using an DNA Chip Array and Non-labeling DNA)

  • 최용성;이경섭
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.402-403
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    • 2006
  • This research aims to develop the multiple channel electrochemical DNA chip using microfabrication technology. At first, we fabricated a high integration type DNA chip array by lithography technology. Several probe DNAs consisting of thiol group at their 5-end were immobilized on the gold electrodes. Then target DNAs were hybridized and reacted. Cyclic voltammetry showed a difference between target DNA and control DNA in the anodic peak current values. Therefore, it is able to detect a plural genes electrochemically after immobilization of a plural probe DNA and hybridization of non-labeling target DNA on the electrodes simultaneously. It suggested that this DNA chip could recognize the sequence specific genes.

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A SDR/DDR 4Gb DRAM with $0.11\mu\textrm{m}$ DRAM Technology

  • Kim, Ki-Nam
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제1권1호
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    • pp.20-30
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    • 2001
  • A 1.8V $650{\;}\textrm{mm}^2$ 4Gb DRAM having $0.10{\;}\mu\textrm{m}^2$ cell size has been successfully developed using 0.11 $\mu\textrm{m}$DRAM technology. Considering manufactur-ability, we have focused on developing patterning technology using KrF lithography that makes $0.11{\;}\mu\textrm{m}$ DRAM technology possible. Furthermore, we developed novel DRAM technologies, which will have strong influence on the future DRAM integration. These are novel oxide gap-filling, W-bit line with stud contact for borderless metal contact, line-type storage node self-aligned contact (SAC), mechanically stable metal-insulator-silicon (MIS) capacitor and CVD Al process for metal inter-connections. In addition, 80 nm array transistor and sub-80 nm memory cell contact are also developed for high functional yield as well as chip performance. Many issues which large sized chip often faces are solved by novel design approaches such as skew minimizing technique, gain control pre-sensing scheme and bit line calibration scheme.

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이중-적분을 이용한 용량형 센서용 스위치드-캐패시터 인터페이스 (A Switched-Capacitor Interface Based on Dual-Slope Integration)

  • 정원섭;차형우;류승용
    • 대한전자공학회논문지
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    • 제26권11호
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    • pp.1666-1671
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    • 1989
  • A novel switched-capacitor circuit for interfacing capacitive microtransducers with a digital system is developed based on the dual-slope integration. It consists of a differential integrator and a comparator. Driven by the teo phase clock, the circuit first senses the capacitance difference between the transducer and the reference capacitor in the form of charge, and accumulates it into the feedback capabitor of the integrator for a fixed period of time. The resulant accumulated charge is next extracted by the known reference charge until the integrator output voltage refurns to zero. The length of time required for the integrator output to return to zero, as measured by the number of clock cycle gated into a counter is proportional to the capacitance difference, averaged over the integration period. The whole operation is insensitive to the reference voltage and the capacitor values involved in the circuit, Thus the proposed circuit permits an accurate differental capacitance measurement. An error analysis has showh that the resolution as high as 8 bits can be expected by realizing the circuit in a monolithic MOS IC form. Besides the accuracy, it features the small device count integrable onto a small chip area. The circuit is thus particularly suitadble for the on-chip interface.

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Integrated 3-D Microstructures for RF Applications (Invited)

  • Euisik Yoon;Yoon, Jun-Bo;Park, Eun-Chul;Han, Chul-Hi;Kim, Choong-Ki
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 1999년도 추계종합학술대회 논문집
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    • pp.203-207
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    • 1999
  • In this paper we report new integration technology developed for three-dimensional metallic microstructures in an arbitrary shape. We have developed the two fabrication methods: Multi-Exposure and Single-Development (MESD) and Sacrificial Metallic Mold(SMM) techniques. Three-dimensional photoresist mold can be formed by the MESD method while unlimited number of structural levels can be realized by the SMM technique. Using these two techniques we have fabricated solenoid inductors and levitated spiral inductors for RF applications. We have achieved peak Q- factors over 40 in the 2-10㎓ range, the highest number among the inductors reported to date. Finally, we propose "On-Chip Passives" as a post IC process for monolithic integration of inductors, tunable capacitors, microwave switches, transmission lines, and mixers and filters toward future single-chip transceiver integration.

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A Low Power Multi-Function Digital Audio SoC

  • Lim, Chae-Duck;Lee, Kyo-Sik
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
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    • pp.399-402
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    • 2004
  • This paper presents a system-on-chip prototype implementing a full integration for a portable digital audio system. The chip is composed of a audio processor block to implements audio decoding and voice compression or decompression software, a system control block including 8-bit MCU core and Memory Management Unit (MMU) a low power 16-bit ${\Sigma}{\Delta}$ CODEC, two DC-to-BC converter, and a flash memory controller. In order to support other audio algorithms except Mask ROM type's fixed codes, a novel 16-bit fixed-point DSP core with the program-download architecture is proposed. Funker, an efficient power management technique such as task-based clock management is implemented to reduce power consumption for portable application. The proposed chip has been fabricated with a 4 metal 0.25um CMOS technology and the chip area is about 7.1 mm ${\times}$ 7.1mm with 100mW power dissipation at 2.5V power supply.

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A Study on Gene Detection using Non-labeling DNA

  • Choi Yong-Sung;Lee Kyung-Sup;Kwon Young-Soo
    • 한국전기전자재료학회논문지
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    • 제19권10호
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    • pp.960-965
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    • 2006
  • This research aims to develop the multiple channel electrochemical DNA chip using microfabrication technology. At first, we fabricated a high integration type DNA chip array by lithography technology. Several probe DNAs consisting of thiol group at their 5-end were immobilized on the gold electrodes. Then target DNAs were hybridized and reacted. Cyclic voltammetry showed a difference between target DNA and control DNA in the anodic peak current values. Therefore, it is able to detect a plural genes electrochemically after immobilization of a plural probe DNA and hybridization of non-labeling target DNA on the electrodes simultaneously. It suggested that this DNA chip could recognize the sequence specific genes.

DNA칩을 이용한 SNP의 검출 (SNP Detection Using DNA Chip)

  • 최용성;문종대;이경섭
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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    • pp.1319-1321
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    • 2006
  • This research aims to develop the multiple channel electrochemical DNA chip that has the above characteristic and be able to solve the problems. At first, we fabricated a high integration type DNA chip array by lithography technology. It is able to detect a plural genes electrochemically after immobilization of a plural probe DNA and hybridization of non-labeling target DNA on the electrodes simultaneously. It suggested that this DNA chip could recognize the sequence specific genes. It suggested that multichannel electrochemical DNA microarray is useful to develop a portable device for clinical gene diagnostic system.

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정전분사를 이용한 PDMS 마이크로렌즈의 제작 (Fabrication of PDMS Microlens Using Electrohydrodynamic Atomization)

  • 강태호;양상식
    • 전기학회논문지
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    • 제57권10호
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    • pp.1841-1846
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    • 2008
  • In this paper, we present the fabrication of microlens by electrohydrodynamic atomization(EHDA) of PDMS prepolymer. The diameter and contact angle of PDMS microlens can be altered by changing the applied voltage and substrate temperature at the experimental setup. It is considered that PDMS microlens can be integrated into the Lab-on-a-chip directly without any photolithographic process by EHDA. The property of PDMS microlens is confirmed by transmitting and measuring the Gaussian beam through microlens.