• Design & Manufacturing
• /
• v.7 no.1
• /
• pp.55-59
• /
• 2013

A Light Emitting Diode(LED) is a semiconductor device which converts electricity into light. LEDs are widely used in a field of illumination, LCD(Liquid Crystal Display) backlight, mobile signals because they have several merits, such as low power consumption, long lifetime, high brightness, fast response, environment friendly. In general, LEDs production does die bonding and wire bonding on board, and do silicon and phosphor dispensing to protect LED chip and improve brightness. Then lens molding process is performed using mixed liquid silicon rubber(LSR) by resin and hardener. A mixture of resin and hardener affect the optical characteristics of the LED lens. In this paper, computational design of static mixer was performed for mixing of liquid silicon. To evaluate characteristic of mixing efficiency, finite element model of static mixer was generated, and fluidic analysis was performed according to length of mixing element. Finally, optimal condition of length of mixing element was applied to static mixer from result of fluidic analysis.

• ETRI Journal
• /
• v.27 no.3
• /
• pp.337-340
• /
• 2005

A spot-size converted Fabry-Perot laser diode (LD) was flip-chip bonded to a silica-terraced planar lightwave circuit(PLC) platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light-current characteristics, it was discovered that the silica terrace itself is not a strong thermal barrier, but the encapsulation of the integrated LD with an index-matching polymer resin more or less deteriorates the heat dissipation.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.25 no.11
• /
• pp.1335-1341
• /
• 1988

A pH-ISEFET microprobe for in vivo measurements has been fabricated by combining ISFET (SL-IIS) chip and capillary thin film reference electrode. A two-step TCE oxidation for the gate oxide layer and multilayer encapsulation using silicone rubber and epoxy were specially used for the improvement of the stability and temperature dependence of the ISFET's. The measured sensitivit, response time and temperature dependence of the pH-ISFET microprobes are 50 mV/pH, less than one second, and - 0.01 pH/$^{\circ}$ , respectively. By operating continuously more than 40 days, a long term stability of 0.016 pH/day is obtained. The result of pH monitoring of femoral arterial blood in a rabbit is fairly good agreement with the value of blood gas analysis.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.7 no.3
• /
• pp.133-139
• /
• 2007

Future MEMS systems will be composed of larger varieties of devices with very different functionality such as electronics, mechanics, optics and bio-chemistry. Integration technology of heterogeneous devices must be developed. This article first deals with the current development trend of new fabrication technologies; those include self-assembling of parts over a large area, wafer-scale encapsulation by wafer-bonding, nano imprinting, and roll-to-roll printing. In the latter half of the article, the concept towards the heterogeneous integration of devices and functionality into micro/nano systems is described. The key idea is to combine the conventional top-down technologies and the novel bottom-up technologies for building nano systems. A simple example is the carbon nano tube interconnection that is grown in the via-hole of a VLSI chip. In the laboratory level, the position-specific self-assembly of nano parts on a DNA template was demonstrated through hybridization of probe DNA segments attached to the parts. Also, bio molecular motors were incorporated in a micro fluidic system and utilized as a nano actuator for transporting objects in the channel.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.16 no.10
• /
• pp.6925-6931
• /
• 2015

LED(Light Emitting Diode) is used in various filed like a display because of low power consuming, long life span, high brightness, rapid response time and environmental-friendly characteristic. General fabrication method is combination blue light LED chip with yellow fluorescent substance. Because this way is suitable for industry field in terms of convenience, economic, efficiency. In white light LED packaging process, encapsulation process that is dispensing fluorescent substance with silicon to blue light LED chip is most important. So, in this paper we develop EHD pump system using voice coil motor and electrostatic pump for dispensing fluorescent substance. For these things we conduct basic test about liquid surface profiles by voltage and process time. Through this data we decide optimal process condition and verify the optimal condition using design of experiment method. And to confirm uniformity of the condition, we conduct repeat dispensing test.

• Korean Journal of Optics and Photonics
• /
• v.24 no.6
• /
• pp.342-346
• /
• 2013

We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.36 no.5B
• /
• pp.429-436
• /
• 2011

The G-PON is an efficient solution to implement the FTTH and have GEM frame to accomodate various protocols like Ethernet frames, IP packets, and TDM signals. Above all, the Ethernet is one of the most widely used 2nd layer protocol in the campus, the subscriber access, and the carrier service. So G-PON system has to provide an Ethernet interface with top priority. In this paper, we implement a gigabit Ethernet adapter based on Ethernet over GEM in the ITU-T G.984.3 to accommodate Ethernet protocol in the G-PON TC chip. The adapter maps each Ethernet frame to a single or multiple GEM frames and has several functions including generation of the GEM header, encapsulation of frames and the SAR. In particular, the adapter have converter (LUT) MAC address to port-ID which is a key to identify logical connections though it is not defined in specification but important. We implement the adapter with a FPGA and verify the functions of segmentation and reassembling, MAC address learning, and throughput with the logic analyzer and the Ethernet analyzer.

• Applied Chemistry for Engineering
• /
• v.8 no.3
• /
• pp.533-542
• /
• 1997

Due to the trends of faster and denser circuit design, dielectric properties of packaging materials for semiconductor will give a greater influence on performance and reliability. Also as chip becomes more densified, thermal dissipation becomes a critical reliability issue. Consequently, four important properties for manufacturing semiconductor packaging materials are low values of dielectric constant, high values of thermal conductivity, relatively low values of thermal expansion coefficient and low cost. Thus, in this study, to achieve increased performance of EMC, crystalline silica was selected as the filler for epoxy matrix. As a result, when the volume percent of crystal silica was 60~70%, good properties as packaging materials for semiconductor were achieved. In addition, overall molding condition of EMC in this experiment was established.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.1
• /
• pp.65-69
• /
• 2008

This work shows that the grinding-induced scratches formed on the back surface of silicon chips can highly influence the flexural strength of the chips. Meanwhile, in a case that excellent adhesion between the back surface and the plastic package body maintains, the flexural strength of plastic-encapsulated packages is not so sensitive to the geometry of the scratch marks. This article explains why such different flexural fracture behavior between bare chips and plastic-encapsulated chips appears.