• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1996년도 춘계학술대회 논문집
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• pp.24-29
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• 1996

The seniconductor, which is precision product, requires many inspection processes. The surface conditions of the semiconductor chip effect on the functions of the semiconductors. The defects of the chip surface is crack or void. Because general inspection method requires many inspection processes, the inspection system which searches immediately and preciselythe defects of the semiconductor chip surface. We propose the inspection method by using the computer vision system. This study presents an image processing algorithm for inspecting the surface defects(crack, void)of the semiconductor test samples. The proposed image processing algorithm aims to reduce inspection time, and to analyze those experienced operator. This paper regards the chip surface as random texture, and deals with the image modeling of randon texture image for searching the surface defects. For texture modeling, we consider the relation of a pixel and neighborhood pixels as noncasul model and extract the statistical characteristics from the radom texture field by using the 2D AR model(Aut oregressive). This paper regards on image as the output of linear system, and considers the fidelity or intelligibility criteria for measuring the quality of an image or the performance of the processing techinque. This study utilizes the variance of prediction error which is computed by substituting the gary level of pixel of another texture field into the two dimensional AR(autoregressive model)model fitted to the texture field, estimate the parameter us-ing the PAA(parameter adaptation algorithm) and design the defect detection filter. Later, we next try to study the defect detection search algorithm.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.27-34
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• 2015

The correlation between crack propagation and localized recrystallization are compared in a series of cross section analyses on thermal cycled edgebond and underfilm material applied wafer level chip scale package (WLCSP) components with a baseline of no-material applied WLCSP components. The results show that the crack propagation distribution and recrystallization region correlation can explain potential degradation mechanisms and support the damage accumulation history in a more efficient way. Edgebond material applied components show a shift of damage accumulation to a more localized region, thus potentially accelerated the degradation during thermal cycling. Underfilm material applied components triggered more solder joints for a more wider distribution of damage accumulation resulting in a slightly improved thermal cycling performance compared to no-material applied components. Using an analysis on localized distribution of recrystallized areas inside the solder joint showed potential value as a new analytical approach.

• 한국정밀공학회지
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• 제29권3호
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• pp.261-265
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• 2012

In this study, glassy carbon was ground for lens core of glass mold press. Ultraprecision grinding process was applied for machining of core surfaces. During the process, brittle crack occurred because of hard-brittleness of glassy carbon. Author investigated optimized grinding conditions from the viewpoint of ductile mode grinding. Geometrical undeformed chip thickness was adopted for critical chip thickness that enables crack free surface. Machined cores are utilized for biaspheric glass lens fabrication and surfaces of lens were compared for verification of ground surface.

• 한국재료학회지
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• 제4권3호
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• pp.329-333
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• 1994

1시간 주기로 -$35^{\circ}C$에서 +$125^{\circ}C$까지의 온도 변화에 지배되는 Leadless Ceranic Chip Carriers(LLCC'S)의 Solder접합부에서 균열이 계면을 따라 일어났다. 이런 균열이 계면을 취약하게 하는 어떤 불순물에 의한 것이 아닌지를 Scanning Auger Microprobe(SAM)을 이용해 조사했다. 그 결과 계면을 따라 일어나는 균열이 계면의 산화에 의해 일어날 수 있다는 것이 발견되었고, 그에 따라 산화에 취약해진 계면을 따라 일어나는 이런 종류의 피로 파괴현상에 대한 모델을 제시했다.

• 대한기계학회논문집
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• 제18권8호
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• pp.2158-2166
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• 1994

In order to understand the package crack emanating from the edge of leadframe after the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the M-integral and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the package crack are investigated taking into account the temperature dependence of the material properties, which simulates a more realistic condition. If the temperature dependence of the material properties is considered the result of analysis conforms with observations that the crack is kinked at between 50 and 65 degree. However, in case of constant material properties at the room temperature it is found that the J-integral is underestimated and the kink crack angle is different form the observation. The effects of the material properties and molding process temperature on J-integral and crack angle are less significant that the chip size for the cases considered here. It is suggested that the geometric factors such as ship size, leadframe size are to be well designed in order to prevent(or control) the occurrence and propagation of the package crack.

• 한국정밀공학회지
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• 제5권1호
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• pp.84-93
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• 1988

The on-line detection of the chip flow is one of the most important technologies in com- pletly automatic operation of machine tool, such as FMS and Unmanned Factories. This problem has been studied by many researchers, however, it is not solved as yet. For the recognition of chip flow in this study, the dynamic cutting force components due to the chip breaking were measured by dynamometer of piezo-electric type, and the frequency components of cutting force were also analyzed. From the measured results, the effect of cutting conditions and tool geometry on the dynamic cutting force component and chip formation were investigated in addition to the relationships between frequency of chip breaking (fB) and side serrated crack (fC) of chip. As a result, the following conclusions were obtaianed. 1) The chip formations have a large effect on the dynamic cutting force components. When chip breaking takes place, the dynamic cutting force component greatly increases, and the peridoic components appear, which correspond to maximum peak- frequency. 2) The crater wear of tool has a good effect on the chip control causing the chiup to be formed as upward-curl shape. In this case, the dymamic cutting force component greatly increases also 3) fB and fC of chip are closely corelated, and fC of chips has a large effect on the change of the situation of chip flow and dynamic cutting force component. 4) Under wide cutting conditions, the limit value (1.0 kgf) of dynamic cutting force component exists between the broken and continuous chips. Accordingly, this value is suitable for recognition of chip flow in on-line control of the cutting process.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2012년도 춘계 학술논문 발표대회
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• pp.209-210
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• 2012

In this study, the following conclusions are drawn. First, the Inorganic terazzo tile flooring and LCC (Life Cycle Cost) analysis showed that the sum of the total cost of 150,304 won Inorganic flooring, terrazzo tile flooring minerals won 186,202 to 35,898 won, compared to 8.22% analysis of the cost savings that have been appearing. Second, if the color chip has a unique and elegant sentence patterns, beautiful and high-strength bonding and that the crack resistance was investigated.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2006년도 추계 학술발표회 논문집
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• pp.677-680
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• 2006

Tensile as well as flexural strengths of concrete can be substantially increased by introducing closely spaced fibers that would obstruct the propagation of microcracks, therefore delaying the onset of tension cracks and increasing the tensile strength of the material. Fibers of various shapes and sizes produced from steel, plastic, glass and natural materials are being used. In this study, we used cellulose chip fiber to decrease the shrinkage crack in mortar and concrete. Specially, we have studied the dispersion characteristic of cellulose chip fiber. As a result, it was assumed that the slurry type of cellulose chip fiber is very effective to disperse the fiber in mortar and concrete.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.103-111
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• 2017

본 연구에서는 전동차의 전력 변환 장치로 많이 사용되고 있는 고전압 대전류용(3,300 V/1200 A급) insulated gate bipolar transistor(IGBT) 모듈에 대하여 열 사이클 조건하에서의 열-기계적 응력해석 및 피로수명해석을 수행하였다. 특히 최근 고전압 IGBT용으로 개발되고 있는 구리(copper) 와이어, 리본(ribbon) 와이어를 사용하였을 경우의 응력 및 피로수명을 기존의 알루미늄 와이어와 비교하여 분석하였다. 알루미늄 와이어 보다는 구리 와이어에 응력이 3배 이상 많이 발생하였다. 리본 와이어의 경우 원형 와이어 보다 응력이 더 크게 발생하며, 구리 리본 와이어의 응력이 제일 높았다. 칩과 direct bond copper(DBC)를 접합하고 있는 칩 솔더부의 피로해석을 수행한 결과, 솔더의 크랙은 주로 솔더의 모서리에서 발생하였다. 원형 와이어를 사용할 경우 솔더의 크랙은 약 35,000 사이클에서 발생하기 시작하였으며, 알루미늄 와이어 보다는 구리 와이어에서의 크랙의 발생 면적이 더 컸다. 반면 리본 와이어를 사용하였을 경우 크랙의 면적은 원형 와이어를 사용하였을 경우보다 적음을 알 수 있다. DBC와 베이스 플레이트 사이에 존재하는 솔더의 경우 크랙의 성장 속도는 와이어의 재질이나 형태에 관계없이 비슷하였다. 그러나 칩 솔더에 비하여 크랙의 발생이 일찍 시작하며, 40,000 사이클이 되면 전체 솔더의 반 이상이 파괴됨을 알 수 있었다. 따라서 칩 솔더 보다는 DBC와 베이스 플레이트 사이에 존재하는 솔더의 신뢰성이 더 큰 문제가 될 것으로 판단된다.