• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.3
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• pp.225-231
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• 2011

In this paper, a new end-milling force modelling technique was suggested by considering runout, and its result was compared with real measured force. The specific cutting force is the multiplication of cutting force coefficient and uncut chip thickness. This parameter was used for experimental modelling and prediction of theoretical force. These coefficients, which can be obtained by fitting measured average forces in several conditions, were used for the formulation of theoretical force. The mechanism of end-milling force with runout was developed in this research and its result was verified by comparing the fluctuating theoretical force and its measured one. The fluctuation of force was incurred by a geometric shape of workpiece and its runout in holding. The result of suggested force considering runout shows a good consistency with measured one. So this modelling method can be used effectively for a prediction of end-milling force with runout effect.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2006.05a
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• pp.274-277
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• 2006

This paper describes a lighting warning system (LWS) which consists of a corona needle electrode, a low noise differential amplifier, an A/D converter, an one-chip microprocessor, a LCD and alarm devices. The corona needle electrode is used to measure electric field intensity caused by thunderclouds on the ground level. To evaluate the sensitivity of the LWS, calibration experiment was carried out using a round-shape parallel plate electrode system. The theoretical and experimental results show that the LWS can measure electric field intensity over 2 [kV/m].

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.27-31
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• 2015

Thermal management becomes a key technology as the power density of high performance and high density devices increases. Conventional heat sink or TIM methods will be limited to resolve thermal problems of next-generation IC devices. Recently, to increase heat flux through high powered IC devices liquid cooling system has been actively studied. In this study a chip-level liquid cooling system with TSV and microchannel was fabricated on Si wafer using DRIE process and analyzed the cooling characteristics. Three different TSV shapes were fabricated and the effect of TSV shapes was analyzed. The shape of liquid flowing through microchannel was observed by fluorescence microscope. The temperature differential of liquid cooling system was measured by IR microscope from RT to $300^{\circ}C$.

• Transactions on Electrical and Electronic Materials
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• v.17 no.4
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• pp.196-200
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• 2016

We have developed new electrostatic discharge (ESD) protection devices with, bidirectional flip chip transient voltage suppression. The devices differ in their epitaxial (epi) layers, which were grown by reduced pressure chemical vapor deposition (RPCVD). Their ESD properties were characterized using current-voltage (I-V), capacitance-voltage (C-V) measurement, and ESD analysis, including IEC61000-4-2, surge, and transmission line pulse (TLP) methods. Two BD-FCTVS diodes consisting of either a thick (12 μm) or thin (6 μm), n-Si epi layer showed the same reverse voltage of 8 V, very small reverse current level, and symmetric I-V and C-V curves. The damage found near the corner of the metal pads indicates that the size and shape of the radius governs their failure modes. The BD-FCTVS device made with a thin n- epi layer showed better performance than that made with a thick one in terms of enhancement of the features of ESD robustness, reliability, and protection capability. Therefore, this works confirms that the optimization of device parameters in conjunction with the doping concentration and thickness of epi layers be used to achieve high performance ESD properties.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.6
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• pp.472-476
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• 2019

We have proposed a novel planar lightwave circuit (PLC) optical sensor to monitor the contamination in a flow-cell where water is continuously supplied through a water quality measurement system. We designed a PLC chip with a V-shape waveguide and the simulated its function as a sensor for monitoring contamination in a flow-cell using a numerical the FDTD (finite-difference time-domain) analysis. A novel cross type of waveguide was introduced to make the PLC chip of the V-shaped waveguide. The fabricated PLC was cut into the cross waveguide. A change in the optical propagation loss of the PLC sensor was observed after immersing the PLC sensor into city water. It was determined that the propagation loss of the PLC sensor was 3 dB at a wavelength of $1.55{\mu}m$ in the city water for 15 days.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.31-35
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• 2022

Recently, with the 4th industrial revolution, the demand for high-density semiconductors for large-capacity data processing is increasing. Researchers are interested in researching the reliability of surface mount technology (SMT). In this study, the effect of PCB pad design on assembly and adhesion reliability of passive component was analyzed using design of experiment (DOE). The DOE method was established using the pad length, width, and distance between pads of the PCB as variables. The assembly defect rate of the passive element after the reflow process was derived according to the misplacement direction of the chip resistor. The shear force between the passive element and the PCB was measured using shear tests. In addition, the shape of the solder according to the pad design was analyzed through cross-sectional analysis.

• Korean Journal of Plant Resources
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• v.16 no.3
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• pp.264-274
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• 2003

Many potato genetic resources have been collected and improved for their diverse traits over the years using breeding program in KPGR. To select potential varieties for table and processing in Korea, 58 elite potato breeding lines and several 'Valley' varieties were cultivated and harvested at Korea Alpine area in 2001. The cultivated lines and varieties were evaluated using their cultural adaptability in the environment and tuber characteristics, such as the depth of tuber eye, tuber shape, skin color, flesh color, scab resistance, yield, and the resistance of hollow heart and internal brown spot disease. Additionally, in the selection of potential processing varieties, reducing sugar content (sum of glucose and fructose concentration) of tubers is critically considered, because it mainly influence on the chip color of processing potato tuber. For table stock varieties with white skin color, 'Early Valley', 'Summer Valley', 'Winter Valley', and 'Taebok Valley' were selected. In the aspect of diverse potato tuber color, several varieties were selected such as 'Golden Valley' for its yellow fresh and skin color, 'Gogu Valley', 'Juice Valley', and 'Rose Valley' for their red skin color, and 'Purple Valley' for its purple skin. Compared with world wide known processing cultivar 'Atlantic', 24 lines (or varieties) were selected for the potential potato processing industry due to their low reducing sugar contents (below 0.3％), high yield (above 4.0 ton/ha), and unique chip colors. Selected white chipping varieties were 'Taedong Valley', 'Kangshim Valley', and 'Kangwon Valley', which have 0.23％, 0.27％, and 0.29％ of reducing sugar contents, respectively. 'Bora Valley', having deep purple color in both skin and fresh, was selected for purple chip variety and has 0.26％ of reducing sugar content. Light yellow chip varieties (lines) were 'Rose Valley' and Valley 54, having 0.19％ and 0.269％ of reducing sugar content, respectively. For French frying potatoes, 'Stick Valley' of 0.22％ and Valley 72 of 0.151％ in reducing sugars were selected. All of these selected lines and 'Valley' varieties can be used as parents to improve potato genetic resources and to develop better varieties with unique traits and colors.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.956-959
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• 2004

Recently the monitoring system of tool setting in high speed precision machining center is required for manufacturing products that have highly complex and small shape, high precision and high function. It is very important to reduce time to setup tool in order to improve the machining precision and the productivity and to protect the breakage of cutting tool as the shape of product is smaller and more complex. Generally, the combination of errors that geometrical clamping error of fixing tool at the spindle of machining tool and the asynchronized error of driving mechanism causes that the run-out of tool reaches to 3$^{\sim}$20 times of the thickness of cutting chip. And also the run-out is occurred by the misalignment between axis of tool shank and axis of spindle and spindle bearing in high speed rotation. Generally, high speed machining is considered when the rotating speed is more than 8,000 rpm. At that time, the life time of tool is reduced to about 50% and the roughness of machining surface is worse as the run-out is increased to 10 micron. The life time of tool could be increased by making monitoring of tool-setup easy, quick and precise in high speed machining tool. This means the consumption of tool is much more reduced. And also it reduces the manufacturing cost and increases the productivity by reducing the tool-setup time of operator. In this study, in order to establish the concept of tool-setup monitoring the measuring method of the geometrical error of tool system is studied when the spindle is stopped. And also the measuring method of run-out, dynamic error of tool system, is studied when the spindle is rotated in 8,000${\sim}$60,000 rpm. The dynamic phenomena of tool-setup are analyzed by implementing the monitoring system of rotating tool system and the non-contact measuring system of micro displacement in high speed.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.25 no.2
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• pp.10-18
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• 2011

In order to develop highly-integrated RGBY(Red, Green, Blue, Yellow) LED light, a high thermal radiation ceramic package was manufactured, and the encapsulation process was applied with a vacuum printing encapsulation system(VPES). After the completion of vacuum printing, the shape of the encapsulation layer could be controlled by heat treatment during the curing process, and the optical power became highly increased as the encapsulation layer approached a dome shape. The optical characteristics involved in a Correlated Color Temperature(CCT), a Color Rendering Index (CRI), and the efficiency of RGBY LED light were able to be identified by the experimental designing method. Regarding the characteristics of the white light of RGBY LED light, which were measured on the basis of the aforementioned optical characteristics, CRI posted 88, CCT recorded 5,720[$^{\circ}K$], and efficiency exhibited 52[lm/W]. The chip temperature of RGBY LEDs was below 55[$^{\circ}C$] when the consumption power of LED chips was 0.1[W] for the red, 0.3[W] for the green, 0.08[W] for the blue, and 0.24[W] for the yellow. Also, the thermal resistance of the highly-integrated RGBY LED light measured by T3Ster was 2.3[K/W].

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1066-1069
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• 2004

Recently the monitoring system of tool setup in high speed precision machining tool is required for manufacturing products that have highly complex and small shape, high precision and high function. It is very important to reduce time to setup tool in order to improve the machining precision and productivity and to protect the breakage of cutting tool as the shape of product is smaller and more complex. Generally, the combination of errors that geometrical clamping error of fixing tool at the spindle of machining center and the asynchronized error of driving mechanism causes that the run-out of tool reaches to 3∼20 times of the thickness of cutting chip. And also the run-out is occurred by the misalignment between axis of tool shank and axis of spindle and spindle bearing in high speed rotation. Generally, high speed machining is considered when the rotating speed is more than 8,000 rpm. At that time, the life time of tool is reduced to about 50％ and the roughness of machining surface is worse as the run-out is increased to 10 micron. The life time of tool could be increased by making monitoring of tool-setting easy, quick and precise in high speed machining center. This means the consumption of tool is much more reduced. And also it reduces the manufacturing cost and increases the productivity by reducing the tool-setup time of operator. In this study, in order to establish the concept of tool-setting monitoring the measuring method of the geometrical error of tool system is studied when the spindle is stopped. And also the measuring method of run-out, dynamic error of tool system, is studied when the spindle is rotated in 8,000 ∼ 60,000 rpm. The dynamic phenomena of tool-setup is analyzed by implementing the monitoring system of rotating tool system and the noncontact measuring system of micro displacement in high speed.