• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.9
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• pp.4138-4146
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• 2011

In surface mount technology, with cellular phones and flat panel displays shrinking in size, the electric goods for making these things are getting smaller as well. Therefore, the technology of mounting components such as 0402 and 0603 Chip is on the rise. The chip mount manufacturing companies have studied the mount technology to prevent the missing insertions or improper insertion. This study suggests arranging the mechanical structure by using fiber sensors to eliminate missing insertions or improper insertions and developing the technology for upgrading system algorithms.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.11 no.8
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• pp.331-337
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• 2001

The purpose of this study is to analyze the principal causes of vibration problem and find out the method of vibration reduction in a chip-mount system. The principal causes are investigated through measurements of vibration spectrum and model parameters. Modal parameters are obtained by using an experimental model test. Based on the model parameters from experiments. a model of finite element method is formulated. The model presents effective redesign of increasing the natural frequencies in order to reduce the vibration of a chip-mount system. Further, through computer simulation for the behavior of head to be main vibration source, the best acceleration pattern of head movement can be verified to achieve effective head-positioning and reduce the vibration due to head movement.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.21 no.8
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• pp.768-773
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• 2011

This work presents an experimental investigation on vibration control of the active hybrid mount system for naval ships. To reduce unwanted vibrations, this paper proposes an active mount which consists of rubber element, piezostack actuator and inertial mass. The rubber element supports a mass. The piezostack actuator generates a proper control force and supply it to the mount system. To avoid being broken piezostack actuator, an actuator of the proposed mount is devised as an inertial type, in which a piezostack actuator is positioned between inertial mass and rubber element. Vibration control performances of the active mount system are evaluated via experiment. To attenuate the unwanted vibrations transferred from upper mass, the feedforward control is designed. In order to implement a control experiment, the active mount system supported by four active mounts is constructed. For realization of the controller, one-chip board is manufactured and utilized. Subsequently, vibration control performances of the proposed active mount system are experimentally evaluated in frequency domains.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.4
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• pp.1-10
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• 2015

The light emitting diodes(LED) package of new structure is proposed to promote the reliability and lifespan by maximize heat dissipation occurred on the chip. We designed and fabricated the LED packages mixing the advantages of chip on board(COB) based on conventional metal printed circuit board(PCB) and the merits of Si sub-mount using base as a substrate. The proposed LED package samples were selected for the superior efficiency of the material through the sealant properties, chip characteristics, and phosphor properties evaluations. Reliability test was conducted the thermal shock test and flux rate according to the usage time at room temperature, high-temperature operation, high-temperature operation, high-temperature storage, low-temperature storage, high-temperature and high-humidity storage. Reliability test result, the average flux rate was maintained at 97.04% for each items. Thus, the Si sub-mount based LED package is expected to be applicable to high power down-light type LED light sources.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.3
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• pp.2146-2150
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• 2015

The surface mount technology is used, as mounting relay using Chip Mounter that is inserted into the junction box, etc. car and small components such as 0402 and 0603 Chip. In this study we developed stick tube for supplying the relay that cause problems as components is heavy and suggested the technology using fiber sensors to eliminate missing insertions or improper insertions because of small components. And we show to result of the experiment how to increased the productivity.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.05a
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• pp.674-675
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• 2016

In this paper, we propose a manufacturing process model of Internet of Things devices using a Printed Circuit Board (PCB)-mounted RFID tag chip for reducing electronic wastes. Electrical and electronic products require a PCB surface mount and many examination. Also, conventional barcode systems cannot provide traceability management in PCB manufacturing before finishing Surface Mount Technology (SMT) process. The proposed process model does not require workers' attaching and detaching process unlike barcode systems. Also, RFID tag chip can record all the data in manufacturing steps. Thus, the number of connections to a database management system (DBMS) can be reduced.

• Proceedings of the KIEE Conference
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• 2003.07d
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• pp.2450-2452
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• 2003

We present a method to increase the productivity of multihead-gantry chip mounters for PCB assembly lines. To minimize the assembly time, we generate the mount sequence using the genetic algorithm. The chromosome, fitness function, and operators are newly defined to apply the algorithm. Simulation results are presented to verified the usefulness of the method.

• Journal of KSNVE
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• v.9 no.3
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• pp.477-484
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• 1999

This study aims to present proper thickness of resilient mount and pattern of chips for the improvement of impact sound isolation. To achieve this aim, field tests were performed to evaluate the performance of impact sound isolation of pilot samples using waste tire chips against light and heavy-weight impacter, which samples were installed over concrete slabs of an apartment housing. In this study, the experiments were performed by the impact sound level of floors in KS F 2810 "Method for field measurement of floor impact level". As results, a flooring structure using waste tire chips as a resilient mount, with no relation to chip's types, has enhanced performance by 1~2 degree in light impact sound isolation, while it has improvement in heavy impact sound isolation. And fiber-type chips have better performance than granule-type ones when they overlaid concrete slab with 15~20 mm of thickness. For the improvement of impact sound isolation, it is recommended that insulating materials should be applied at joints between floating floors and walls, or floating floors and a doorframes, and also waterproof papers should be used for the effective thickness of resilient mount.ent mount.

• Korean Journal of Optics and Photonics
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• v.19 no.5
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• pp.381-385
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• 2008

We have analyzed the effect of the substrate removal and packaging schemes on light output characteristics in InGaN/Sapphire LEDs. The removal of the sapphire substrate helps to dissipate the heat generated in the junction, but the advantage comes only with the detrimental effect of degrading the photon extraction efficiency. If the substrate-removed chip is attached to a metallic mount with good thermal conductivity, the maximum driving current is increased drastically, producing significantly increased light output and therefore compensating the photon extraction efficiency degradation. On a dielectric mount with a relatively poor thermal conductivity, however, it produces smaller light output, over most input current range, than the regular type of chips with the sapphire substrate remaining. Thus, for low power applications, the regular chips may be preferred over the substrate-removed chips, regardless of the chip mounts employed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.12a
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• pp.155-162
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• 1999

A bare chip packaging technology by an encapsulated flip chip bonding on a build-up printed circuit board has emerged in 1991. Since then, it enabled a high density and low cost semiconductor packaging such as a direct chip bonding on mother board and high density surface mount components, such as BGA and CSP. This technology can respond to various requirements from applications and is considered to take over a main role of semiconductor packaging in the next decade.