• International Journal of Air-Conditioning and Refrigeration
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• 제9권1호
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• pp.1-10
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• 2001

The present study investigated the effects of experimental parameters on the thermal characteristics of an in-line 6x1 array of discrete heat sources for a test multichip module using water, PF-5060 and paraffin slurry. The parameters were heat flux of 10-40W/$cm^2$. Reynolds number of 3,000~20,000 and mass fraction up to 10% for paraffin slurry The size of paraffin slurry was within 10~40$\mu$m before and after experiments. The local heat transfer coefficients for the paraffin slurry were larger than those for water. Thermally fully developed conditions were observed after the third or fourth row (five or seven times of the chip length) and the paraffin slurry showed effective cooling performance at the high heat flux The paraffin slurry with the mass fraction of 5% showed the most efficient cooling performance when the heat transfer and the pressure drop in the test section are considered simultaneously. The experimental data at the fourth and sixth rows are best agreed with the values predicted by the Malina and Sparrow`s correlation among other correlations, and the empirical correlations for water and 5% paraffin slurry were obtained at the first and sixth rows when the channel Reynolds number is over 3,000.

• 한국추진공학회지
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• 제4권2호
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• pp.46-53
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• 2000

알루미늄 제품은 열간단조하면 재료가 연화되어 있어 절삭가공시 연속적인 칩이 발생하여 공구와 피삭재를 감고 회전함으로서 가공면 손상, 공구파손 및 작업자의 안전을 초래함에 따라 가공이 어려워 단지 절삭성 개선목적만을 위해 중간공정으로 T-4열처리하여 절삭가공하고 다시 어닐링처리하여 냉간성형을 하고 최종열처 리를 한다. 따라서 본 연구는 열간단조후 제품을 급냉시키면 용체화처리의 효과를 얻어 재료가 경화됨으로서 절삭성이 개선될 수 있다는 이론에 근거하여 T4열처리를 대체할 수 있는 후처리방법에 대해 연구하였다. 최적의 후처리방법을 구하기 위해 열간단조후 수냉과 공냉처리를 비교분석하였고, 열간단조후 냉각처리까지 지연된 시간과 수냉과정에서의 유지시간에 따른 분식을 통해 최적의 작업조건을 설정하였다.

• 설비공학논문집
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• 제11권2호
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• pp.224-235
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• 1999

The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water, PF-5060, and paraffin slurry. The experimental parameters were coolants including Paraffin slurry with mass fraction of 2.5~7.5%, heat flux of 10~40W/$\textrm{cm}^2$ for the simulated VLSI chips and Reynolds numbers of 3,000~20,000. The size of paraffin slurry was constant as 10~40${\mu}{\textrm}{m}$ before and after the experiment. The chip surface temperatures for paraffin slurry were lower than those for water and PF-5060. The local heat transfer coefficients for the paraffin slurry were larger than those for water and the local heat transfer coefficients reached a row-number-independent and thermally-fully-developed value approximately after the third row. The local Nusselt numbers for paraffin slurry with a mass fraction of 7.5% were larger by 20~38% than those for water. The paraffin slurry with a mass fraction of 5% shelved the best thermal and hydrodynamic characteristics when local heat transfer and pressure drop were considered simultaneously.

• 한국식품과학회지
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• 제25권4호
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• pp.391-394
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• 1993

탁주발효의 자동화를 위하여 발효 중 발생하는 기체를 측정할 수 있는 bubble counter와 제어장치를 개발하였다. 동 장치를 활용하여 pilot 규모의 탁주발효에 적용하였다. 탁주발효중 발생하는 기체를 계측하는 bubble counter는 photo-interruptor와 acryl관으로 구성하였으며, 계측되는 기체용적은 기포당 0.018ml였다. 그리고 탁주발효의 제어장치는 single chip microcomputer(MC68705R3)로 제작하였으며, 발효액의 온도를 측정, 제어하기 위하여 온도계측회로를 제작하였고, 냉각수 순환을 결정하는 solenoid valve의 작동으로 온도제어를 하였다. 동 장치를 운영하기 위하여 software를 작성하여 ROM에 구조화하였다. 동 장치로 $CO_2$ 발생량과 속도를 자동적으로 추정한 결과 알코올 농도곡선과 형태가 서로 유사함을 보여주었으며, $30^{\circ}C$ 발효조건에서 24시간때에 최대 발생량을 보였다. 알코올농도와 $CO_2$ 발생량은 뛰어난 상관관계를 보였으며, 이로부터 제어알고리듬을 작성할 수 있었다.

• 한국가시화정보학회:학술대회논문집
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• 한국가시화정보학회 2002년도 마이크로/바이오 가시화기술부문 학술강연회
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• pp.79-84
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• 2002

Most microfluidic devices such as heat sinks for cooling micro-chips, DNA chip, Lab-On-Chip, and micro pumps etc. have microchannels of various size. Therefore, the design of practical microfluidics demands detail information on flow structure inside the microchannels. However, detail velocity field measurements are rare and difficult to carry out. In addition, as the microfluidics expands, accurate understanding of microscale transport phenomena becomes very important. In this research, micro-PIV system was employed to measure the velocity fields of flow inside a micro-channel. We carried out PIV measurements for several microchannels with varying channels width, inlet and outlet shape, filters, CCD camera and ICCD camera, etc. For effective composition of micro-PIV system, first of all, it is essential to understand optics related with micro-imaging of particles and the particle dynamics encountered in micro-scale channel flows. In addition, it is necessary to find the optimal condition for given experimental environment and? micro-scale flow to be investigated. The problems encountered in measuring velocity field of micro-channel flows are discussed in this paper.

• Journal of the Optical Society of Korea
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• 제13권2호
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• pp.223-226
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• 2009

A Magneto-Optical Trap (MOT) for $^{87}Rb$ atoms near the surface of a dielectric coated mirror at the top of a small $20{\times}25{\times}40\;mm^3$ cell has been observed. Two beams of $3.3\;mW/cm^2$ were used for optical cooling and an anti-Helmholtz magnetic field with a spatial gradient of 9.1 G/cm was used for magnetic trapping. The thickness of the mirror coated on a cover glass was less than $100{\mu}m$. The mirror covered the top of a cell and the atom-chip was located outside the vacuum in order to exploit the long life time of the mirror and easy operation of the chip. The trapping position was found 5 mm beneath the mirror surface. The number of trapped atoms was roughly $3{\times}10^7$ atoms and the temperature was approximately a few tens mK. In this paper, we describe the construction of the mirror-MOT in detail.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2408-2413
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• 2007

Since the heat generation in a chip increases as the components are miniaturized and the computing speed becomes faster, suitable heat dissipation has become one of the primary limiting factors to ensure the reliable operation of the electronic devices. A pin-fin array could be used as an alterative cooling system of the electronic equipment. In this study, convective heat transfer through the pin-fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristics is investigated and compared with the previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• 한국기계가공학회지
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• 제2권3호
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• pp.26-33
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• 2003

The term 'High Speed Machining' has been used for many years to describe end milling with small diameter tools at high rotational speeds, typically 10,000-100,000rpm. The process was applied in the aerospace industry for the machining of light alloys, notably aluminum. In recent year, however, the mold and die industry has begun to use the technology for the production of components, including those manufactured from hardened tool steels. With increasing cutting speed used in modern machining operation, the thermal aspects of cutting become more and mole Important. It not only directly influences in rate of tool weal, but also affects machining precision recognized as thermal expansion and the roughness of the surface finish. Hence, one needs to accurately evaluate the rate of cutting heat generation and temperature distributions on the machining surface. To overcome the heat generation, we used to cutting fluid. Cutting fluid plays a roles in metal cutting process. Mechanically coupled effectiveness of cutting fluids affect to friction coefficient at tool-workpiece interface and cutting temperature and chip control, surface finish, tool wear and form accuracy. Through this study, we examined the behavior of heat generation in high-speed machining and the cooling performance of various cooling methods.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
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• pp.422-428
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• 2001

The term High Speed Machining has been used for many years to describe end milling with small diameter tools at high rotational speeds, typically 10,000 - 100,000 rpm. The process was applied in the aerospace industry for the machining of light alloys, notably aluminium. In recent year, however, the mold and die industry has begun to use the technology for the production of components, including those manufactured from hardened tool steels. With increasing cutting speed used in modern machining operation, the thermal aspects of cutting become more and more important. It not only directly influences in rate of tool wear, but also will affect machining precision recognized as thermal expansion and the roughness of the surface finish. Hence, one needs to accurately evaluate the rate of cutting heat generation and temperature distributions on the machining surface. To overcome the heat generation, we used to cutting fluid. Cutting fluid play a roles in metal cutting process. Mechanically coupled effectiveness of cutting fluids affect to friction coefficient at tool-work-piece interface and cutting temperature and chip control, surface finish, tool wear and form accuracy. Through this study, we examined the behavior of heat generation in high-speed machining and the cooling performance of various cooling methods.

• Journal of Mechanical Science and Technology
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• 제15권1호
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• pp.98-107
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• 2001

Continuing efforts to achieve increased circuit performance in electronic package have resulted in higher power density at chip and module level. As a result, the thermal management of electronic package has been important in maintaining or improving the reliability of the component. An experimental investigation of thermosyphonic boiling in vertical tube and channel made by two parallel rectangular plates was carried out in this study for possible application of the direct immersion cooling. Fluorinert FC-72 as a working fluid was used in this experiment. Asymmetric heated channel of open periphery with gap size of 1, 2, 4 and 26mm and uniformly heated vertical tubes with diameter of 9, 15 and 20mm were boiled at saturated condition. The boiling curves from tested surfaces exhibited the boiling hysteresis. It was also found that the gap size is not a significant parameter for the thermosyphonic boiling heat transfer with this Fluorinert. Rather pool boiling characteristics appeared for larger gap size and tube diameter. The heat transfer coefficients measured were also compared with the calculation results by Chens correlation.