• Journal of Electrical Engineering and Technology
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• 제10권3호
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• pp.1383-1388
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• 2015

Proportional integral derivative (PID) control is one of the conventional control strategies. Industrial PID control has many options, tools, and parameters for dealing with the wide spectrum of difficulties and opportunities in manufacturing plants. It has a simple control structure that is easy to understand and relatively easy to tune. Injection mold is warming up to the idea of cycling the tool surface temperature during the molding cycle rather than keeping it constant. This “heating and cooling” process has rapidly gained popularity abroad. However, it has discovered that raising the mold wall temperature above the resin’s glass-transition or crystalline melting temperature during the filling stage is followed by rapid cooling and improved product performance in applications from automotive to packaging to optics. In previous studies, optimization methods were mainly selected on the basis of the subjective experience. Appropriate techniques are necessary to optimize the cooling channels for the injection mold. In this study, a digital signal processor (DSP)-based PID control system is applied to injection molding machines. The main aim of this study is to optimize the control of the proposed structure, including a digital PID control method with a DSP chip in the injection molding machine.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.323-327
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• 2009

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state.

• ETRI Journal
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• 제20권3호
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• pp.284-300
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• 1998

A new thermosyphon cooling module (TSCM) has designed, fabricated and tested to cool the multi-chip module consists of a cold plate and an integrated condenser. With an allowable temperature rise of $56^{\circ}C$ on the surface of the heater, the cooling module TSCM can handle a heat flux of about 2.7 $W/cm^2$ using R11 as working fluid. The transient characteristics of the cooling module have been proved to be excellent: that is, when a heat load is applied inside of the system, steady state can be achieved within 10 to 15 minutes. It has been found that the length of the vapor channel between the cold plate and the condenser in addition to the ambient and the condenser temperatures affect the system performance.

• 천문학논총
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• 제16권1호
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• pp.43-47
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• 2001

We developed a CCD camera that can observe wide fields on the sky. We tested the field of views using various lenses. For cooling the CCD chip, we used a thermoelectric cooling device and tested the cooling efficiency. This camera will continuously observe a part of the sky. The data from the camera will be used to decide the current weather condition by the real-time star counting program (SCount) which will be developed later.

• 동력기계공학회지
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• 제18권3호
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• pp.87-92
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• 2014

This study is aimed at investigating the thermal behavior of immersion-cooled high power LED lighting engines. 3D CFD models have been generated for the numerical analysis. Five cases in terms of the configuration of LED chips have been explored for various passive cooling conditions of the lighting engine, i.e., the natural air convection with a lens, the natural air convection without a lens, the deionized water-immersion cooling condition with a lens. The numerical study reveals that the deionized water-immersion cooled lighting engine has nearly twice better thermal performance than the natural air convection cooled lighting engine containing a lens. The investigation has also demonstrated that the four chips configuration has the better thermal performance than the single chip configuration.

• 설비공학논문집
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• 제15권8호
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• pp.667-673
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• 2003

Recent trends in the electronic equipment indicate that the power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. The influence of the structure of the pin-fin assembly on heat transfer is investigated by porous medium model. The results are compared with the experimental data or correlations of several researchers for the heat transfer coefficients for the channel flow with pin-fin arrays. Finally, the effects of design parameters such as the pin-fin diameter and the spacing are examined.

• 대한기계학회논문집B
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• 제27권1호
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• pp.1-8
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• 2003

The heat transfer and flow measurements on a cylindrical pedestal mounted on a flat surface with a turbulent impinging jet were made. The experiments were made for the jet Reynolds number of Re = 23,000, the dimensionless nozzle-to-surface distance of L/d = 2~10, the dimensionless pedestal height of H/D = 0~1.5. Measurements of the surface temperature and the Nusselt number distributions on the plate surface were made using liquid crystal and shroud-transient technique. Flow measurements involve smoke flow visualization and the wall pressure coefficient. The results show that the wall pressure coefficient sharply decreases along the upper surface of the pedestal. However, the pressure increases when the fluid escapes from the pedestal and then collides on the plate surface. The secondary maxima in the Nusselt numbers occur in the region of 1.0 $\leq$ r/d $\leq$ 1.9. Their values for the case of H/D = 0.5 are maximum 80% higher than those for other cases. The formation of the secondary maxima may be attributed to the reattachment of flow on the plate surface which was separated at the edge of the pedestal.

• 한국정보과학회논문지:시스템및이론
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• 제35권7호
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• pp.354-360
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• 2008

최신의 마이크로프로세서 설계에서는 전력 관련 문제들이 중요한 고려사항이 되었다. 온-칩(On-chip) 온도 상승은 이와 관련하여 중요한 요소로 부각되었다. 이를 적절하게 처리하지 않을 경우 냉각 비용과 칩 신뢰성에 부정적인 결과를 초래한다. 이 논문에서 우리는 시간적/공간적인 핫 스폿(Hot spot) 완화를 위한 설계들과 열 시간 상수, 작업부하 변동, 마이크로프로세서의 전력 분배 사이의 보편적인 상충관계(Trade off)들을 조사한다. 우리의 방안은 작업부하의 실행위치/순서를 변경하고 동시실행 스레드의 수를 조절하여 시스템의 공간 및 시간적인 열 틈새(Heat slack)에 영향을 줌으로써, 운영체계(OS)와 이미 시스템에 존재하는 하드웨어의 지원만으로 적절한 시간제한내에 작업부하를 조절함으로써 온-칩 온도를 낮출 수 있다.

• 한국기계가공학회지
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• 제21권5호
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• pp.98-104
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• 2022

When processing parts, the cutting oil can improve the cooling performance of the workpiece and tool to increase the precision of the workpiece or extend the life of the tool and facilitate chip extraction. Since such cutting oil has a harmful effect on the environment and the human body due to additives such as sulfur, research on a minimum lubrication supply method using an eco-friendly oil is recently underway. The minimum lubrication supply method minimizes the amount of cutting oil used during processing and processes it, which can reduce the amount of cutting oil used, but has a problem in that cooling performance efficiency is poor. Therefore, this study conducted a study on mist cooling of lubricants to reduce the amount of cutting oil used and maximize the cooling effect of processing heat generated during tapping processing. Spray pressure, processing speed, direction, and lubricant spray amount, which are considered to have an effect on cooling performance, were set as process conditions, and the effect on temperature was analyzed by performing an experiment using the box benquin method among experiments were analyzed. Through the experimental analysis results, the optimal conditions for mist and processing that maximize the cooling effect were derived, and the validity of the results derived through additional experiments was verified. In the case of processing by applying the mist lubrication method verified through this study, it is considered that high-precision processing is possible by improving the cooling effect.

• 한국정밀공학회지
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• 제18권6호
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• pp.114-120
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• 2001

It is necessary to develop a new metal cutting technology which does not use cutting fluid, since cutting fluid can have undesirable effect on workers's health and working environment. For this to be possible, it is necessary to replace the conventional method of using cutting fluid, whose basic functions are removing chip and heat, and providing lubrication between tool and chip. In this work, cooled air is utilized in order to replace cutting fluid. Experiments were carried out while cutting workpiece with HSS flat endmill under a variety of supply conditions for cooled air. Also the performance characteristics of the air cooling system. which was built for the experiments, were carefully analyzed. For the reliable operation of air cooling system. moisture contained in the cooled air had to be removed before being supplied to the workpiece and tools. It was found that depending on the amount of its flow rate the temperature of cooled air changes at the time of injection from the nozzle. The flow rate of cooled air also plays an important role in removing the accumulated chip on the workpiece. After comparing the flank wear for the three cases of using cooled air, cutting fluid, and pure dry technique, it was demonstrated that the level of flank wear was similar for the cases of cooled air and cutting fluid. The pure dry technique, however, showed higher level of flank wear than cooled air.