• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 D
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• pp.2755-2757
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• 2002

In this paper, we propose a now architecture for hardware implementation of digital neural network. By adopting flexible ladder-style bus and internal connection network into traditional SIMD-type digital neural network architecture, the proposed architecture enables fast processing that is based on parallelism, while does not abandon the flexibility and extensibility of the traditional approach. In the proposed architecture, users can change the network topology by setting configuration registers. Such reconfigurability on hardware allows enough usability like software simulation. We implement the proposed design on real FPGA, and configure the chip to multi-layer perceptron with back propagation for alphabet recognition problem. Performance comparison with its software counterpart shows its value in the aspect of performance and flexibility.

• 전기학회논문지
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• 제65권3호
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• pp.452-456
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• 2016

In this paper, a dual-channel readout amplifier array is realized in a standard $0.18{\mu}m$ CMOS technology for the applications of panoramic scan LADAR systems. Each channel consists of a PIN photodiode with 0.9 A/W responsivity and a 1.0 Gb/s readout amplifier(ROA). The proposed ROA shares the basic configuration of the previously reported feedforward TIA, except that it exploits a replica input to exclude a low pass filter(LPF), thus reducing chip area and improving integration level, and to efficiently reject common-mode noises. Measured results demonstrate that each channel achieves $70dB{\Omega}$ transimpedance gain, 829 MHz bandwidth, -22 dBm sensitivity for $10^{-9}BER$, -34 dB crosstalk between adjacent channels, and 45 mW power dissipation from a single 1.8 V supply.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 B
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• pp.594-596
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• 1998

In this paper, a path control switch has been developed for self-healing operation in SDH-based transmission system. The proposed switch is suitable for self-healing operations in both an Unidirectional Path Switched Ring and a 2-fiber Bidirectional Line Switched Ring. The path control switch is implemented with $0.8{\mu}m$ CMOS LSI chip. The self-healing operation of the switch is effectively done by the configuration information stored in the registers of the switch. The switch has an AU-3(51.84Mb/s) TSI(Time Slot Interchange) and has 1.25Gb/s throughput. But the higher throughput can be realized by combining two identical switches or more with the parallel architecture.

• Journal of the Optical Society of Korea
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• 제11권2호
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• pp.67-70
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• 2007

A Wide Color Gamut Backlight system was studied using a three-band white Light-Emitting Diode. A three-band white light-emitting diode (LED) was fabricated using an InGaN-based blue LED chip that emits 445-nm blue peak, and a green phosphor and red phosphor that emit 535-nm green and 621-nm red peak emissions, respectively, when excited by 450-nm blue light. Using for this three-band white LED, wide color gamut backlight unit (BLU) was attained. The luminance of BLU and CIE 1931 chromaticity coordinates was $1,700Cd/m^2$ and (0.337, 0.346). Color filter matching simulations for this configuration show that the three-band white LED backlight can be enhanced by up to 16% over conventional white LED backlight color gamut.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권4호
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• pp.231-236
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• 2004

A normally open thermopneumaticc-actuated microvalve has been fabricated and their properties are investigated. The advantages of the proposed microvalve are of the low cost fabrication process and the transparent optical property using polydimethylsiloxane (PDMS) and indium tin oxide (ITO) glass. The fabricated microvalves with in-channel configuration are easily integrated with other microfluidic devices on the same substrate. The fabrication process of thermopneumatic-actuated microvalvesusing PDMS is very simple and its performance is very suitable for a disposable lab-on-a-chip. The PDMS membrane deflection increases and the flow rates of the microchannel with microvalvels decrease as the applied power to the ITO heater increases. The powers at flow-off are dependent on the membrane thickness and the applied inlet pressure but are independent of the channel width of microvalves. The flow rate is well controlled by the switching function of ITO heater and the closing/opening times are around 20 sec and 25 sec, respectively.

• 한국항해항만학회지
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• 제31권9호
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• pp.759-762
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• 2007

A novel miniaturized CMOS C-Band bandpass filter based on diagonally end-shorted coupled lines and interdigital capacitors is proposed. The utilized coupled lines structure reduced the configuration in size, as small as a few degrees. Moreover, the characteristic of interdigital capacitor, relatively high Q and good capacitance tolerance, accounts for the satisfied performance of this new filter. A two-stage bandpass filter was designed and fabricated with chip surface area only $1.02{\times}1.4\;mm^2$.

• 전기학회논문지
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• 제57권8호
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• pp.1464-1469
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• 2008

A CMOS Gm-C filter with variable cutoff frequency applicable for using in the direct conversion receiver is designed. The designed filter comprises the CMOS differential transconductors, and the gm of the transconductor is controlled by the bias voltage. This configuration can compensate variant of the cutoff frequency which could be generated by external noises, and also be used in multiband receiver. As a results of HSPICE simulation, the control range of the cutoff frequency is $1.5MHz{\sim}3.5MHz$ and the gain control range is $-2.8dB{\sim}2.6dB$. The layout of the designed 5th-order Elliptic low-pass filter is performed to fabricate a chip using $2.5V-0.25{\mu}m$ CMOS processing parameter.

• Nuclear Engineering and Technology
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• 제54권6호
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• pp.2031-2036
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• 2022

Energetic particle strikes the device and induces data corruption in the configuration memory (CRAM), causing errors and even malfunctions in a system on chip (SoC). Software-based fault injection is a convenient way to assess device performance. In this paper, dynamic partial reconfiguration (DPR) is adopted to make fault injection on a Xilinx 16 nm FinFET Ultrascale+ MPSoC. And the reconfiguration module implements the Sobel and Gaussian image filtering, respectively. Fault injections are executed on the static and reconfiguration modules' bitstreams, respectively. Another contribution is that the failure modes and effects analysis (FMEA) method is applied to evaluate the system reliability, according to the obtained injection results. This paper proposes a software-based solution to estimate programmable device vulnerability.

• 한국정보통신학회논문지
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• 제26권2호
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• pp.329-332
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• 2022

Since IoT devices include various sensors and drivers, application programmers need to understand the structure and characteristics of sensors and actuators. If the manufacturer provides the driver of the sensor or actuator, IoT development can be efficiently carried out, which is called the Plug & Play technique. What matters is that the technique proposed by this research team in the past are not suitable for Arduino or Raspberry-Pi, which are recently used. In this paper, we propose a USB sensor device that can be mounted on a Raspberry-Pi. When the device is plugged into the Raspberry-Pi, the built-in driver is transmitted and played. The configuration of the USB sensor device was presented, and considerations for chip selection for processing sensors and drivers were presented.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.149-154
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• 2018

가로등 및 방폭등용 고출력 LED 조명 시스템의 광원으로서, 다수의 LED 칩이 실장된 50와트급 LED 어레이 모듈을 chip-on-board형 고방열 세라믹-메탈 하이브리드 기판을 사용하여 제작하였다. 고방열 세라믹-메탈 하이브리드 기판은 고열전도 알루미늄 금속 열확산 기판에 저온소결용 글라스-세라믹 절연 페이스트와 은 전극 페이스트를 후막 스크린 공정에 의해 도포한 다음, 건조 후 $515^{\circ}C$에서 동시소성하여 LED 칩을 실장할 세라믹 절연층과 은전극 회로층을 형성하여 제조하였다. 이 하이브리드 기판의 방열특성 평가를 위한 비교 샘플로서 기존의 에폭시 기반 FR-4 복합수지로 만든 써멀비아형 PCB 기판에도 동일한 디자인의 LED 어레이 모듈을 제작한 다음, 다중채널 온도측정장치와 열저항 측정기로 방열특성을 비교 분석하였다. 그 결과, $4{\times}9$ type LED 어레이 모듈에서 세라믹-메탈 하이브리드 기판의 열저항은 써멀비아형 FR-4 기판에 비하여 약 1/3로 나타났으며, 이것은 곧 방열성능이 적어도 3배 이상 높은 것으로 볼 수 있다.