• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.20-23
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing(CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Chemical-Mechanical polishing(CMP) of conductors is a key process in Damascene patterning of advanced interconnect structure. The effect of alternative commercial slurries pads, and post-CMP cleaning alternatives are discuss, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. Electroplated copper deposition is a mature process from a historical point of view, but a very young process from a CMP perspective. While copper electro deposition has been used and studied for decades, its application to Cu damascene wafer processing is only now gaining complete acceptance in the semiconductor industry. The polishing mechanism of Cu-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. however it is important to understand the effect of oxidizer on copper passivation layer in order to obtain higher removal rate and non-uniformity during Cu-CMP process. In this paper, we investigated the effects of oxidizer on Cu-CMP process regarding the additional volume of oxidizer.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.33 no.1
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• pp.1-7
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• 2001

The immediate purposes of this study is to establish the surface chemical principles associated with the flotation process of waste papers and to verify them by practical flotation experiments. To achieve this AKD sized hydrophobic microcrystallince cellulose (MCC) with different levels of hydrophobicity, and hydrophilic MCC dyed with black were prepared as model substances. The effects of surface characteristics on flotation efficiency were evaluated by measuing the brightness of the flotation rejects obtained after the flotation experiments carried out using MCC mixtures prepared with different ratios of hydrophobic and hydrophilic MCCs. Results showed that more than 90% of the flotation rejects consisted of hydrophobic MCC indicating the critical importance of the hydrophobicity of the materials in the flotation process. The proportions of hydrophobic materials in the reject remained constant when highly sized MCC was used as a model of hydrophobic substance.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2006.06b
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• pp.401-411
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• 2006

The cationic chitosan is prepared in this paper. This kind of cationic chitosan is a good retention aid for bleached hardwood pulp, the filler retention increased by 33.0% when the cationic chitosan (DS=1.27) dosage was 0.05%. Because many of the materials used in papermaking process are excellent microbiological nutrients, these nutrients will result in the growth of bacteria; uncontrolled growth of bacteria and fungi in the papermaking process adversely affects machine runnability. According to the standard methods of microbe growth inhibition test, cell counting was conducted after proper cultivated time. This paper explored the factors that affecting the cationic chitosan's antibacterial effect.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.35 no.4
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• pp.57-67
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• 2003

The purpose of the present study is to identify the drying cylinder model in paper plants and to analyze characteristics of process responses for changes in input variables. The model developed in this work is based on actual plant operation data and the steam pressure applied to the cylinder behaves as one the main variables. It is found that heat transfer coefficients from the condensate to the canvas could be represented as empirical relations based on heat conductivities and operation date. The effectiveness of the cylinder model is demonstrated by the measured moisture contents and web temperature. Using transfer functions derived from the cylinder model stability of the drying process is analyzed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.34-37
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• 2004

Recently advancing mobile communication tools and I.T industry, semiconductor device is requested more integrated, faster operation time and more scaled-down. Because of these reasons semiconductor device is requested multilayer interconnection. For the multilayer interconnection chemical mechanical polishing (CMP) becomes one of the most useful process in semiconductor manufacturing process. In this experiment, we focus on understand the characterize and improve the CMP technology by control of slurry flow rate. Consequently, we obtain that optimal flow rate of slurry is 170ml/min, since optimal conditions are less chemical flow and performance high with good selectivity to Ta. If we apply this results to copper CMP process. it is thought that we will be able to obtain better yield.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.11
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• pp.46-52
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• 2004

CMP (Chemical-Mechanical Polishing) is a process in which both chemical and mechanical mechanisms act simultaneously to produce the planarized wafer. CMP process is an extensive usage and continuing high growth rates in the semiconductor industry. The understanding of the process, however, is much slower. The nature of material removal from the wafer is still undefined and ambiguous. Material removal rate according to the slurry flow rate is also undefined and ambiguous. Thus, in this study, the basic mechanism of material removal rate as slurry flow rate is defined in terms of energy supply and energy loss.

• Textile Coloration and Finishing
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• v.30 no.3
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• pp.168-179
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• 2018

The modified surface of specialty carbon black(SCB) is one of the main technical factors for producing a uniform color and stable dispersion. In this work, the carboxylation or sulfonation process of SCB was used to improve the dispersive properties of hydrophilic solvents such as 1,6-hexanediol and propylene glycol monomethyl ether acetate(PGMEA). The results showed that the color strength of SCB DC2500G changed little with a range of 0.128~0.941(${\Delta}E$) compared to other SCB DC2500G material. In contrast, in the case of SCB EG410, there was a uniform color value with a range of 0.144~0.252(${\Delta}E$). Also, in our experiments, a modified SCB was confirmed by printing ink material as a melt coating paper. It may be possible that the SCB EG410 material can be advantageous as a gravure ink product. Finally, the modified SCB obtained from this research will have a large impact on the industry as a potential material for toners, paint, rubber, fillers, and other carbon black additives.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.42 no.3
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• pp.7-13
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• 2010

KOptimization and control of wet-end process provide a key solution to improve paper quality and production efficiency at the same time. Wet-end of paper machine is to determine three important influencing factors of papermaking i.e., retention, drainage and formation. Good formation of paper could be made at the cost of deteriorated retention or drainage. In the same manner increase of retention aid could cause the bad formation of paper. It is very important to find a proper retention chemical which may satisfy one of three factors without the sacrifice of other two. Laboratory scale analyzing or screening chemical additives of wet-end was reported in this study based on RDA sheet molding. Different from the conventional test method, simultaneous consideration of three important wet-end properties could be made by RDA and consequently more reliable prediction of actual paper machine wet-end could be expected.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.369-369
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• 2006

Compatibilizers contribute to many processes in polymer industry, such as manufacturing polymer blends and composites. They are usually designed to be block or graft form which is combined in polar and non-polar parts in the first synthesis process level, for example, the general form of maleic anhydride (MA) as a compatiblizer is a grafted counterpart. However, the process of making the compatibilizer is related to the first synthesis level and it has some problems, such as high cost, poor processability, limitation on use and properties, and so on. So, in order to improve its poor processability and overcome the limitation on use, we developed compatibilizers which have various chemical forms by high intensity ultrasound and super critical fluid nitrogen in polymer melt reactive extrusion.

• Membrane and Water Treatment
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• v.5 no.2
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• pp.87-108
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• 2014

Electrodeionization (EDI), which combines electrodialysis (ED) and conventional ion-exchange (IX), is a mature process which has been applied since more than twenty years on commercial use for the production of ultrapure water (UPW). Eliminating chemical regeneration is the main reason for its commercial success. The increase in acceptance of EDI technology has led to an installation of very large plant as the commercial state of the art that produces $1,500m^3/h$ of water for high pressure steam boiler. More recently, EDI system has found a number of new interesting applications in wastewater treatment, biotechnology industry, and other potential field. Along with further growth and wider applications, the development of stack construction and configuration are also become a concern. In this paper, the principle of EDI process is described and its recent developments, commercial scale, and various applications are pointed out.