• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.2
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• pp.233-239
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• 1998

SiC thin films were deposited by chemical vapor deposition method using tetramethylsilane (TMS) and hexamethyldisilane (HMDS). The chamber pressure during the deposition was kept at about 1 torr. Precursor was transported to the reaction chamber by $H_2$gas and SiC deposition was carried out at the reaction temperature of $1200^{\circ}C$. Si-wafer masked with tantalum and MgO single crystal covered with platinum and molybdenum were used as substrates. The selectivity of SiC deposition was observed by comparing the microstructure between metal (Ta, Pt, and Mo) surfaces and substrate surfaces (Si and MgO). The deposited films were identified as the $\beta-SiC$ phase by X-ray diffraction pattern. Also, the deposition -behavior of SiC on each surface was investigated by the scanning electron microscope analysis.

• Journal of the Korean Ceramic Society
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• v.24 no.6
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• pp.543-552
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• 1987

The effects of deposition variables on SnO2 CVD were investigated for SnCl4＋O2 reaction at 300∼700$^{\circ}C$, Psncl4=1${\times}$10-5∼1${\times}$10-3 atm, and Po2=5${\times}$10-4∼1 atm. A thermodynamic equilibrium study on Sn-Cl-O system has been performed with the computer calculation. The calculation indicates that major species participating the reaction in SnCl4 and not intermediate species, SnCl2. Good uniformity of the film thickness was obtained at the flow rate of 11cm/sec, which resulted from the stable gas flow in our cold wall reactor. The experimental results showed that apparent activation energy of the deposition was about 13.5Kcal/mole below the temperature of 500$^{\circ}C$ and the deposition mechanism was controlled by surface reation. The behavior of deposition rate on the reactant partial pressures could be explained with the Langmuri-Hinshelwood mechanism. X-ray study demonstrated that SnO2 film deposited at temperatures above 400$^{\circ}C$ were polycrystalline with tetragonal rutile structure and grew with (211) and (301) preferred orientations.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.11
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• pp.596-602
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• 2000

Diamond thin films were synthesized on WC-Co substrate at various experimental parameters using 13.56MHz RF PACVD)radio frequency plasma-assisted chemical vapor deposition). In order to increased the nucleation density, the WC-Co substrate was polished with 3${\mu}m$ diamond paste. And the WC-Co substrate was preatreated in $HNO_3\;:\;H_2O$ = 1:1 and $O_2$ plasma. In $H_2-CH_4$ gas mixture, the crystallinity of thin film increased with decreasing $CH_4$ concentration at 800W discharge power and 20torr reaction pressure. In $H_2-CH_4-O_2$ gas mixture, the crystallinity of thin film increased with increasing $O_2$ concentration at 800W discharge power, 200torr reaction pressure and 4% $CH_4$ concentration.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.356-357
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• 2006

Tin oxide thin films have been prepared on display glass from mixtures of dibutyl tin diacetate as a tin source, oxygen as an oxidant by Plasma Enhanced Chemical Vapor Deposition (PECVD) method. The relationships between the properties of tin oxide thin films and various reaction parameters such as the deposition temperature, deposition time and the oxygen gas flow rate were studied. As the deposition temperature increased, the texture plane of $SnO_2$ changed from (200) plane to denser (211) and (110) planes. Lower deposition temperature and thinner thickness of deposited film led to decreasing grain size, surface roughness and electrical resistivity of the formed thin films at $325{\sim}425^{\circ}C$. The properties of fabricated $SnO_2$ films are highly changed with variations of substrate temperature and deposition time.

• Korean Journal of Materials Research
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• v.13 no.3
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• pp.150-154
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• 2003

Amorphous carbon nitride films were deposited on Si(001) substrates by a plasma enhanced chemical vapor deposition technique (PECVD) using $CH_4$and $N_2$as reaction gases. The growth and film properties were investigated while the gas ratio and the working pressure were changed systematically. At 1 Torr working pressure, an increase in the $N_2$partial pressure results in a significant increase of the deposition rate as well as an apparent presence of C ≡N bonding, while little affecting the microstructure and amorphus nature of the films. In the case of changing the working pressure at a fixed $N_2$partial pressure of 98%, a film grown at a medium pressure of $1${\times}$10^{-2}$ Torr shows the most prominent C=N bonding nature and photoluminescent property.

• Journal of Powder Materials
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• v.4 no.4
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• pp.304-309
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• 1997

The synthesis of W-l5wt%Cu nanocomposite powder by hydrogen reduction of ball milled W-Cu oxide mixture was investigated in terms of powder characteristics such as particle size, mixing homogeneity and micropore structure. It is found that the micropores in the ball milled oxide (2-50 nm in size) act as an effective removal path of water vapor, followed by the formation of dry atmosphere at reaction zone. Such thermodynamic condition enhances the nucleation of W phase but suppresses the growth process, being in favor of the formation of W nanoparticles (about 21 nm in size). In addition, the superior mixing homogeneity of starting oxide mixture turned out to Play a significant role for forming extraordinary chemical homogeneity of W-l5wt%Cu nanocomposite powder.

• 한국연소학회:학술대회논문집
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• 2007.05a
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• pp.63-68
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• 2007

An experimental study was carried out to investigate gasification process of wood sawdust in the 1-dimensional downdraft fixed bed gasifier. The preheated air which was used oxidizer and steam were used as a gasifying agent. The downdraft fixed bed gasifier obtains more amount of hydrogen and methane by increasing residence time of supplied air. The operating parameters, the supplied air temperature and steam were used. The oxidizer temperature was varied from 500K to 620K and vapor was added. The gasification process was monitored by measuring temperature at three position near the biomass using R-type thermocouples and the syngas composition was analyzed by gas chromatograph. We get the sample gas at the end of gasifier and it was eonugh time to finishing the chemical reaction. Finally, the amount of hydrogen and methane were increased widely as increasing the oxidizer temperature and adding steam.

• Korean Journal of Materials Research
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• v.13 no.5
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• pp.303-308
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• 2003

Amorphous carbon nitride films deposited on Si(001) substrates by a plasma enhanced chemical vapor deposition (PECVD) technique using CH$_4$and $N_2$as reaction gases were thermally annealed at various temperatures under$ N_2$atmosphere, then their physical properties were investigated particularly as a function of annealing temperature. Above $600^{\circ}C$ a small amount of crystalline $\beta$-$C_3$$N_4$ phase evolves, while the film surface becomes very rough due to agglomeration of fine grains on the surface. As the annealing temperature increases, both the hardness and the $sp^3$ bonding nature are enhanced. In contrast to our expectation, higher annealing temperature results in a relatively higher friction mainly due to big increase in roughness at that temperature.

• Korean Journal of Crystallography
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• v.14 no.2
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• pp.56-61
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• 2003

Nanocrystalline hydrogenated silicon (nc-Si : H) thin films were deposited at room temperature by plasma enhanced chemical vapor deposition (PECVD): a mixture of SiH₄ and H₂ gas was introduced into the evacuated reaction chamber. When the H₂ gas flow rate was low, the density of Si-H₃ bonds was high in the films. On the other hand, when the H₂ gas flow rate was high, e.g., 100 sccm, a large number of Si-H bonds contributed to the passivation of the surface of the large volume of Si nanocrystallites. The relative fraction of the Si-H₃ and Si-H₂ bonds in the amorphous matrix varied sensitively with the H₂ gas flow rate. The variation was associated with the change in the intensity as well as the wavelength of the main PL peaks, indicating the change in the total volume as well as the size of the Si nanocrystallites in the films.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.670-673
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• 2003

Fabrication of three dimensional microstructures by laser-assisted chemical vapor deposition of material is investigated. To fabricate microstructures, a thin layer of deposit in desired patterns is first written using laser direct writing technique and on top of this layer a second layer is deposited to provide the third dimension normal to the surface. By depositing many layers. a three dimensional microstructure is fabricated. Optimum deposition conditions for direct writing of initial and subsequent layers with good surface quality and profile uniformity are determined. Using an arson ion laser and ethylene as the light source and reaction gas, respectively, fabrication of three-dimensional carbon microstructures is demonstrated.