• 제목/요약/키워드: Channel bonding

검색결과 92건 처리시간 0.024초

마이크로채널 내의 온도 분포 측정을 위한 미소 측정 구조물의 제작 (Fabrication of a novel micromachined measurement device for temperature distribution measurement in the microchannel)

  • 박호준;임근배;손상영;송인섭;박정호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 하계학술대회 논문집 C
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    • pp.1921-1923
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    • 2001
  • In this work, an array of resistance temperature detector(RTD) was fabricated inside the microchannel in order to investigate in-situ flow characteristics. A rectangular straight microchannel, integrated with RTD's for temperature sensing and a heat source for generating the temperature gradient along the channel. were fabricated with the dimension of $200{\mu}m(W){\times}{\mu}m(D){\times}$48mm(L), while RTD measured precise temperatures at the inside-channel wall. 4" $525{\pm}25{\mu}m$ thick P-type <100> Si wafer was used as a substrate. For the fabrication of RTDs. 5300$\AA$ thick Pt/Ti layer was sputtered on a Pyrex glass wafer. Finally, glass wafer was bonded with Si wafer by anodic bonding, therefore RTD was located inside the microchannel. The temperature distribution inside the fabricated microchannel was obtained from 4 point probe measurements and Dl water is used as a working fluid. Temperature distribution inside the microchannel was measured as a function of mass flow rate and heat flux. As a result, precise temperatures inside the microchannel could be obtained. In conclusion, this novel temperature distribution measurement system will be very useful to the accurate analysis of the flow characteristics in the microchannel.

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LAL 시험용 Lab-chip 개발을 위한 타당성 연구 (Feasibility Study for a Lab-chip Development for LAL Test)

  • 황상연;최효진;서창우;안유민;김양선;이은규
    • KSBB Journal
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    • 제18권5호
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    • pp.429-433
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    • 2003
  • LAL 측정용 chip을 제작하기 위해서 우선 시료의 부피 감소에 대한 비탁법과 비색법을 비교하였다. 비색법은 낮은 부피에서 높은 감도를 보여 주었으며 시료의 부피와 무관하게 같은 endotoxin의 농도에서는 같은 흡광도를 보인다는 결론을 얻었다. Endotoxin의 농도에 따른 표준곡선을 end point법과 kinetic point법을 비교한 결과 대한약전의 기준에 적합한 kinetic point법이 적합하였다. 이러한 기초 실험결과를 통해 PDMS LOC를 제작하여 LAL 시험을 수행하였다. LOC를 이용하여 더 짧은 시간과 더 작은 시료로 시험이 가능하도록 하였다. 특히 PDMS LOC는 복잡한 channel을 쉽게 만들 수 있을 뿐 아니라 mold를 이용하여 상용화를 위한 대량 생산이 가능하다. 따라서 PDMS를 이용한 LOC의 제작과 실험을 통해 기존의 수작업의 LAL 시험을 LOC를 이용한 다중시료 측정과 자동화의 가능성을 제시하였다.

WPON 응용을 위한 고속 CMOS어레이 광트랜스미터 (A High Speed CMOS Arrayed Optical Transmitter for WPON Applications)

  • 양충열;이상수
    • 한국통신학회논문지
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    • 제38B권6호
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    • pp.427-434
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    • 2013
  • 본 논문은 멀티 채널의 어레이 집적 모듈을 갖는 광트랜시버를 위한 2.5 Gbps 어레이 VCSEL driver의 설계 및 구현에 관한 것이다. 본 논문에서는 광트랜시버에 적용된 1550 nm high speed VCSEL을 드라이브하기 위하여 $0.18{\mu}m$ CMOS 공정 기술을 이용하여 자동 광전력제어 기능을 갖는 2.5 Gbps VCSEL (수직 공진기 표면 방출 레이저) 드라이버 어레이를 구현하였다. 광트랜스미터의 폭넓은 대역폭 향상을 위해 2.5 Gbps VCSEL Driver에 네가티브 용량성 보상을 갖는 능동 궤환 증폭기 회로를 채용한 결과 기존 토폴로지에 비해 대역폭, 전압 이득 및 동작 안정성의 뚜렷한 향상을 보였다. 4채널 칩은 최대 변조 및 바이어스 전류하에서 1.8V/3.3V 공급에서 140 mW의 DC 전력만 소모하고, 다이 면적은 기존 본딩 패드를 포함하여 $850{\mu}m{\times}1,690{\mu}m$를 갖는다.

유체의 정확한 온도 측정을 위하여 내부 센서를 집적한 마이크로채널 제작 (Fabrication of the Microchannel Integrated with the Inner Sensors for Accurate Measuring Fluid Temperature)

  • 박호준;임근배;손상영;송인섭;박정호
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제51권9호
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    • pp.449-454
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    • 2002
  • A rectangular straight microchannel, integrated with the resistance temperature detectors(RTDs) for temperature sensing and a micro-heater for generating the Temperature gradient along the channel, was fabricated. Its dimension is 57${\mu}{\textrm}{m}$(H)$\times$200${\mu}{\textrm}{m}$(W)$\times$48,050${\mu}{\textrm}{m}$(L), and RTDs were placed at the inner-channel wall. Si wafer was used as a substrate. For the fabrication of RTDs, 5300$\AA$ thick Pt/Ti layer was sputtered on a Pyrex glass wafer. Finally, the glass wafer was bonded with Si wafer by anodic bonding, so that the RTDs are located inside the microchannel. Temperature coefficient of resistance(TCR) values of the fabricated Pt-RTDs were 2800~2950ppm$^{\circ}C$ and the variation of TCR value In the range of O~10$0^{\circ}C$ was less than 0.3%. Therefore, it was proved that the fabricated Pt-RTDs without annealing were excellent as temperature sensors. The temperature distribution in the microchannel was investigated as a function of mass flow rate and heating power. The temperature increase rate diminished with decreasing the applied power and increasing the mass flow rate. It was confirmed from the comparison with the simulation results that the temperature measured inside the microchannel is more accurate than measuring the temperature measured at the outer wall. The proposed temperature sensing method and microchannel are expected to be useful in microfluidics researches.

마이크로 정량펌프의 유동해석과 작동성능 평가 (The Flow Analysis and Evaluation of the Peristaltic Micropump)

  • 박대섭;최종필;김병희;장인배;김헌영
    • 한국정밀공학회지
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    • 제21권2호
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    • pp.195-202
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    • 2004
  • This paper presents the fabrication and evaluation of mechanical behavior for a peristaltic micropump by flow simulation. The valve-less micropump using the diffuser/nozzle is consists of the lower plate, the middle plate, the upper plate and the tube that connects inlet and outlet of the pump. The lower plate includes the channel and the chamber, and the plain middle plate are made of glass and actuated by the piezoelectric translator. Channels and a chamber on the lower plate are fabricated on high processability silicon wafer by the DRIE(Deep Reactive Ion Etching) process. The upper plate does the roll of a pump cover and has inlet/outlet/electric holes. Three plates are laminated by the aligner and bonded by the anodic bonding process. Flow simulation is performed using error-reduced finite volume method (FVM). As results of the flow simulation and experiments, the single chamber pump has severe flow problems, such as a backflow and large fluctuation of a flow rate. It is proved that the double-chamber micropump proposed in this paper can reduce the drawback of the single-chamber one.

방송망 채널결합형 8K-UHDTV 1024-QAM RF 전송시스템 개발에 관한 연구 (A Study on 1024-QAM RF Transmission System using Channel Bonding Technologies for 8K-UHD Services)

  • 김성훈;최진수;김진웅
    • 한국방송∙미디어공학회:학술대회논문집
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    • 한국방송공학회 2011년도 하계학술대회
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    • pp.320-321
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    • 2011
  • 본 논문은 디지털 케이블전송망인 HFC(Hybrid Fiber and Coaxial)망 기반하에서 6MHz 다수의 방송채널결합 기술을 이용하여, 대용량 3D 및 8K-UHD 콘텐츠 전송을 위한 방송망 채널결합형 200Mbps 급 1024-QAM 송수신시스템 개발에 대하여 기술한다. H.264 비디오 부호화기를 사용하여 8K-UHDTV 및 3D/UHD 융합형 서비스를 시청자에게 제공하기 위해서는 약 120~160Mbps 의 대용량 데이터 전송률이 확보되어야 한다. 이와같이 대용량 3D/8K-UHDTV 콘텐츠를 전송하기 위해서는 상대적으로 채널환경이 우수한 HFC 디지털 케이블망을 이용한 대용량 실감미디어 콘텐츠 전송기법에 대한 연구가 주목 받고 있다. 본 논문에서는 FPGA 를 이용하여 HFC 망 기반에서 기존 OpenCalbe/DOCSIS 3.0 256-QAM 대비 약 30% 전송효율이 개선된 3D/8K-UHDTV 대용량 실감미디어 콘텐츠 전송을 위한 방송망 채널결합형 1024-QAM 송수신기 구현 및 개발에 관한 내용을 기술한다.

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DOCSIS 3.0 기반 케이블망에서의 경쟁구간 설정 알고리즘에 관한 연구 (A Study on the Contention Area Establish of Algorithm from Cable Network based on DOCSIS 3.0)

  • 김영성;송재준;노선식
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2007년도 춘계종합학술대회
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    • pp.69-72
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    • 2007
  • 최근 광대역 가입자망으로서 HFC 망을 고도화 할 수 있는 DOCSIS 3.0이 표준화되고 있다. DOCSIS 3.0에서는 상향 스트림 프레임에서 경쟁구간의 크기에 따라 프레임의 크기와 예약 구간의 크기에 영향을 받는다. 또한 경쟁구간을 통해 Request를 전송하려는 CM들의 Request 성공률에도 밀접한 관계가 있다. 이 때 다수의 CM들이 경쟁구간을 통해 대역 할당을 요청하기 때문에 발생하는 충돌을 최소화할 수 있는 경쟁구간 설정 알고리즘이 필요하다. 따라서 본 논문에서는 DOCSIS 3.0에서 사용하는 채널-결합 방식을 고려하여 경쟁구간 설정 알고리즘을 제안하였다. 성능 평가를 통해 기존 알고리즘 보다 경쟁구간의 이용률과 절약율에 있어서 더 좋은 성능을 나타냄을 확인하였다.

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순수 타이타늄 고강도화를 위한 인발공정설계 및 기계적 특성 제어 기술 (Drawing Process Design and Mechanical Properties Control for High Strengthening of CP Titanium)

  • 최성우;박찬희;이상원;염종택;홍재근
    • 한국정밀공학회지
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    • 제34권2호
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    • pp.77-81
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    • 2017
  • CP (Commercially Pure) titanium has been widely used in various industries such as in energy plants and bio-materials because of an excellent corrosion resistance and its non-toxicity to the human body. But there are limitations for usage as structural materials due to low strength. The tensile properties of CP titanium could be improved by microstructure refinement such as in a SPD (Severe Plastic Deformation) process. However, high strengthening of CP titanium wire is impossible by SPD processes like ECAP (Equal Channel Angular Pressing), HPT (High-Pressure Torsion), and the ARB (Accumulative Roll Bonding) process. The study purposes are to increase the strength of CP titanium wire by optimization of the cold drawing process and the harmonization with mechanical properties by heat treatments for the next forming process. The optimization process was investigated with regard to the design of drawing dies and the reduction ratio of cross sections. The elongations of high strength CP titanium were controlled by heat treatment.

소나무수피 알칼리추출물의 한외여과 및 접착제 제조특성 (Ultrafiltration and Adhesive Characteristics of Alkali-soluble Extracts from Radiata Pine Barks)

  • 조남석
    • Journal of the Korean Wood Science and Technology
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    • 제26권1호
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    • pp.29-37
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    • 1998
  • Alkali-soluble extracts were prepared from medium-sized barks of Radiata pine(Pinus radiata). There are difficulties in the production of extracts with uniform quality and in the preparation of adhesives with suitable viscosity. Ultrafiltration using an Amicon cell was subjected to fractionate extracts according to molecular sizes in order to overcome the above problem. The filtration efficiency was studied by using thin channel filtration systems. Adhesive manufacturing was also examined. Removal of particles greater than 0.45m from the extracts increased both filtration speed (flux) and yields of solids in the filtrates. Ultrafiltration with PM 10 membrane was very effective to fractionate and concentrate the extracts. Stiasny precipitates from the filtrates obtained by PM 10 membrane were very lower than that(83%) of the retentates. This ultrafiltration method was efficient for obtaining high yield purified phenolic compounds(mainly polyflavanoids) and thus important for preparing wood adhesives from barks. The extracts were shown excessive high viscosities at the concentrations required for adhesive formulation, but this high viscosity and short gelation time was reduced by lowering pH of the extracts and addition of urea. The highest bonding strength of plywoods(340g/$m^2$ of adhesive spreads) was achieved with adhesive formulated by 100parts of mixed alkali extracts and urea(70/30,w/w), 10parts of p-formaldehyde and 3.5parts of wheat flour at pH 6, and by hot pressing at the conditions of 12kg/$cm^2$ at $120^{\circ}C$ for 10 minutes.

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실리콘-화합물 융합 반도체 소자 기술동향 (Technical Trend of Fusion Semiconductor Devices Composed of Silicon and Compound Materials)

  • 이상흥;장성재;임종원;백용순
    • 전자통신동향분석
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    • 제32권6호
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    • pp.8-16
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    • 2017
  • In this paper, we review studies attempting to triumph over the limitation of Si-based semiconductor technologies through a heterogeneous integration of high mobility compound semiconductors on a Si substrate, and the co-integration of electronic and/or optical devices. Many studies have been conducted on the heterogeneous integration of various materials to overcome the Si semiconductor performance and obtain multi-purpose functional devices. On the other hand, many research groups have invented device fusion technologies of electrical and optical devices on a Si substrate. They have co-integrated Si-based CMOS and InGaAs-based optical devices, and Ge-based electrical and optical devices. In addition, chip and wafer bonding techniques through TSV and TOV have been introduced for the co-integration of electrical and optical devices. Such intensive studies will continue to overcome the device-scaling limitation and short-channel effects of a MOS transistor that Si devices have faced using a heterogeneous integration of Si and a high mobility compound semiconductor on the same chip and/or wafer.