• Title/Summary/Keyword: Center cut

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An Optimal Thresholding Method for the Voxel Coloring in the 3D Shape Reconstruction

  • Ye, Soo-Young;Kim, Hyo-Sung;Yi, Young-Youl;Nam, Ki-Gon
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.1695-1700
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    • 2005
  • In this paper, we propose an optimal thresholding method for the voxel coloring in the reconstruction of a 3D shape. Our purposed method is a new approach to resolve the trade-off error of the threshold value on determining the photo-consistency in the conventional method. Optimal thresholding value is decided to compare the surface voxel of photo-consistency with inside voxel on the optic ray of the center camera. As iterating the process of the voxels, the threshold value is approached to the optimal value for the individual surface voxel. And also, graph cut method is reduced to the surface noise on eliminating neighboring voxel. To verify the proposed algorithm, we simulated in the virtual and real environment. It is advantaged to speed up and accuracy of a 3D face reconstruction by applying the methods of optimal threshold and graph cut as compare with conventional algorithms.

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Scribing and cutting a sapphire wafer by laser-induced plasma-assisted ablation

  • Lee, Jong-Moo
    • Proceedings of the Optical Society of Korea Conference
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    • 2000.02a
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    • pp.224-225
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    • 2000
  • Transparent and hard materials such as sapphire are used for many industrial applications as optical windows, hard materials on mechanical contact against abrasion, and substrate materials for opto-electronic semiconductor devices such as blue LED and blue LD etc. The materials should be cut along the proper shapes possible to be used for each application. In case of blue LED, the blue LED wafer should be cut to thousands of blue LED pieces at the final stage of the manufacturing process. The process of cutting the wafer is usually divided into two steps. The wafer is scribed along the proper shapes in the first step. It is inserted between transparent flexible sheets for easy handling. And then, it is broken and split in the next step. Harder materials such as diamonds are usually used to scribe the wafer, while it has a problem of low depth of scribing and abrasion of the harder material itself. The low depth of scribing can induce failure in breaking the wafer along the scribed line. It was also known that the expensive diamond tip should be replaced frequently for the abrasion. (omitted)

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A Study on the Surface Roughness & Bending Strength for Zirconia Ceramic Grinding (지르코니아 세라믹 연삭시 표면조도와 굽힘강도에 관한 연구)

  • Ha, Sang-Baek;Choi, Hwan;Lee, Jong-Chan
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.5
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    • pp.131-136
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    • 2000
  • This paper is concerned with the surface roughness and the bending strength of ground workpiece in ZrO2 ceramic grinding. Surface roughness was measured with surface tracer and bending strength value was obtained by three-point bending test on machining center using tool dynamometer. Grinding experiments were carried out to examine the effects of grinding conditions including diamond mesh size, table speed, and depth of cut on ground surface roughness. The correlation between surface roughness and bending strength was also inspected. The experimental results indicate that the rougher surface is produced as the mesh size of diamond wheel is reduced and table speed is increased, but surface roughness is not affected by depth of cut. The values of bending strength decrease as the values of Ra, Rmax and Ku increase.

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Development of the Size Effect Model for More Accurate Cutting Force Prediction (향상된 절삭력 예측을 위한 Size Effect 모델의 개발)

  • 윤원수;조동우
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.05a
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    • pp.995-1000
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    • 2000
  • In this paper. a mechanistic model is first constructed to predict three-dimensional cutting forces, and the uncut chip th thickness is calculated by following the movements of the position of the center of a cutter, which varies with the nominal feed, cutter deflection and runout. For general implementation to a real machining, this paper presents the method that determines constant cutting force coefficients, irrespective of the cutting conditions or cutter rotation angles. In addition, this study presents the approach which estimates runout-related parameters. the runout offset and its location angle, using only one measurement of cutting forces. For more accurate cutting force predictions, the size effect has to be considered in the cutting force model. In this paper, two approximate methods are suggested since the strict approach is practically impossible due to a measurement problem. The size effect is individually considered for narrow and wide cuts.

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A Study on the Surface Roughness & Bending Strength for Zirconia Ceramic Grinding (질코니아 세라믹 연삭시 표면조도와 굽힘강도에 관한 연구)

  • 하상백
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2000.04a
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    • pp.465-470
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    • 2000
  • This paper is concerned with the surface roughness and the bending strength of ground workpiece in ZrO2 ceramic grinding. Surface roughness was measured with surface tracer and bending strength value was obtained by three-point bending test on machining center using tool dynamometer. Grinding experiments were carried out to examine the effects of grinding conditions including diamond mesh size, table speed, and depth of cut on ground surface roughness. The correlation between surface roughness and bending strength was also inspected. The experimental results indicate that the rougher surface was produced as the mesh size of diamond wheel is reduced and table speed is increased, but surface roughness is not affected by depth of cut. The values of bending strength decrease as the values of Ra, Rmax and Ku increase.

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A Study on the 3-D Form Characteristics of Center Ground Parts (원통연삭 가공물의 3차원 형상특성에 관한 연구)

  • Cho, Jaeil;Kim, Kang
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.11a
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    • pp.95-99
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    • 1996
  • The form accuracy of parts has become an important parameter. Therefore dimensional tolerance and geometric tolerance are used in design to satisfy required quility and functions of parts. But the informations for machining conditions, which can satisfy the assigned geometric tolerance in design, are insufficient. The objectives of this research are to study the effects of the grinding parameters such as traverse speed, work speed, depth of cut, and dwell time on the after-ground workpiece shape, and to find out the major parameters among these parameters. Finally, a methodology is proposed for getting the optimal grinding condition for precision workpiece The results are as follows; The effects of work speed and depth of cut on workpiece shape are ignorable compared to the effect of traverse speed. These is the optimal dwell time depending on the traverse speed. The optimal dwell time is decreasing when the traverse speed is increased.

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Machinability Evaluation of ${Si_3}{N_4}$-hBN Machinable Ceramics Using Experimental Design Method (실험계획법에 의한 ${Si_3}{N_4}$-hBN 머시너블 세라믹스의 절삭성 평가)

  • 장성민;임대일;조명우;조원승
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.291-295
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    • 2002
  • Ceramics are very difficult-to-cut materials because of its high strength and hardness. Their machining process can be characterized by cracking and brittle fracture. Generally, ceramics are machined using traditional method such as grinding and polishing. However, such processes are generally costly and have low material removal rate. In this paper, to develop machinable ceramics those have good machinability without losing their material properties, machinability evaluations are performed by applying the experimental design method. In this paper, to evaluate the machinability of the developed ceramics, various workpieces are machined on the CNC machining center, and surface roughness are measured under predefined process parameters obtained using Taguchi method. And the experimental results are investigated to derive optimum cutting parameters for the given materials.

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Effects of the Grinding Conditions on the Shape of Center Ground Parts

  • Kim, Kang
    • International Journal of Precision Engineering and Manufacturing
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    • v.4 no.3
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    • pp.55-61
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    • 2003
  • The form accuracy of parts has become an important parameter. Therefore, not only dimensional tolerance but also geometric tolerances are used in the design stage to satisfy the required quality and functions of parts. But the information on the machining conditions, which can satisfy the assigned geometric tolerance in do sign, is insufficient. The objectives of this research are to study the effects of the grinding parameters such as traverse speed, work speed, depth of cut, and dwell time on the after-ground workpiece shape, and to find out the major parameters among them The results are as follows; The effects of work speed and depth of cut on the workpiece shape are negligible compared with the effect of traverse speed. These is an optimal dwell time depending on the traverse speed. The optimal dwell time is decreasing as the traverse speed is increasing.

Thin film acoustooptic beam deflector in proton-exchanged LiNbO$_{3}$ (양자교환된 LiNbO$_{3}$에서 박막도파형 음향광학 광변위기)

  • 김성국;백운석;김광택;정성갑;송재원
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.32A no.7
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    • pp.94-103
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    • 1995
  • Thin film acoustooptic beam deflector in proton-exchanged Y-cut LiNbO$_{3}$ was fabricated and measured. The planar waveguide was fabricated by using the proton-exchanged and annealing method in Y0cut LiNbO$_{3}$. Interdigital transducer for SAW(surface acoustic wave) was made by the laser lithography. Using above method, the thin film acoustooptic beam deflector was constructed. Its SAW wavelength was 20.mu.m at 174MHz center frequency. The interaction length between guided optical wave and SAW was 2.16mm. The measured 3dB bandwidth was 17MHz using He-Ne laser. And 70% diffraction efficiency was obtained at 970mW RF driving power.

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Numerical Performance Evaluation of an Ultra-small Lapple Cyclone Separator (초소형 Lapple 사이클론 집진기의 수치적 성능평가)

  • Park, Sumin;Kwon, Jae-Sung
    • Journal of the Korean Society of Visualization
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    • v.18 no.3
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    • pp.90-95
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    • 2020
  • The purpose of this study is to numerically evaluate the collection performance of an ultra-small Lapple cyclone separator for 1~10 ㎛ particles introduced at flow rate of 10 L/min. The numerical evaluation reveals that a static pressure drop occurs more dominantly inside of the cyclone separator than at the inlet and the vortex finder. Also a fluid flow in the cyclone separator is confirmed to have a helical structure heading upward in the center of cyclone separator and downward in the vicinity of wall. The investigation on dust collection efficiency of the Lapple cyclone separator shows that particles of 4~8 ㎛ diameters are collected at very lower efficiency than other sizes. Then, the cut-point diameter of the cyclone separator is 1.48 ㎛.