• Title/Summary/Keyword: Cause of failure

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A Study on the Balise Failure Analysis & Effects for ETCS Application (ETCS 적용 구간에서의 발리스 고장 분석 및 영향에 관한 연구)

  • Lee, Myoung-Chol;Kim, Chang-Hoon;Ji, Jung-Gun;Lee, Jong-Woo
    • Proceedings of the KSR Conference
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    • 2011.10a
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    • pp.717-723
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    • 2011
  • When the Balise(the device to transmit information between the on-board equipment and the wayside equipment) failure occurs, it may not be able to transmit data(Telegram) required for the train running. And in some cases, it may be able to cause an accident. Therefore, both the Balise failure affecting train safety running and the hazard in accordance with Balise failure require some activities to establish them. General failure mode & hazard analysis associated with the Balise are described in UNISIG SUBSET-036 spec & UNISIG SUBSET-088 spec. And, with reference to these specifications, safety activities are being performed. In recent domestic railway, the train control system applying ETCS(European Train Control System) Level 1, 2 is being serviced and is being planned, and as part of this system, the Balise is being applied. The design-method of the Balise device for each manufacturer are different, therefore the Balise failure mode & failure rate are different, either. But the functionalities & transmission-data format(Telegram) of the Balise in ETCS Level 1, 2 application for each manufacturer are identical. Accordingly, the hazard caused by function-fail can be identical, either. In order to establish these hazard, in this paper, we analyzed the detailed functions of the Balise. And we analyzed the Balise failure types & failure effects in accordance with the detailed functions.

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Reliability Estimation of Solder Joint by Using Failure Probability Model (파손확률 모델을 이용한 솔더 조인트의 건전성 평가)

  • Myoung, No-Hoon;Lee, Ouk-Sub;Kim, Dong-Hyeok
    • Proceedings of the KSME Conference
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    • 2004.04a
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    • pp.365-370
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    • 2004
  • Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and solder joint' failure. The first order Taylor series expansion of the limit state function incorporating with Tresca failure criterion is used in order to estimate the failure probability of solder joints under heated condition. Using shear stresses and shear strains appeared on the solder joint, we estimate the failure probability of solder joints with the Tresca failure criterion. The effects of random variables such as CTE, distance of the solder joint from the neutral point(DNP), temperature variation and height of solder on the failure probability of the solder joint are systematically studied by using the failure probability model with first order reliability method(FORM).

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A Study on Contributing Factors to Aircraft Maintenance Failure (항공정비결함에 기여하는 인적요인에 관한 연구)

  • Kim, Chun-Yong;Park, Heui-Kwan
    • Journal of the Korean Society for Aviation and Aeronautics
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    • v.25 no.3
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    • pp.81-88
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    • 2017
  • Aircraft maintenance failure doesn't only threaten flight safety but also causes significant economic losses such as flight delays, flight cancellations, air turn backs and diversion and so on. Therefore, the efforts should be made to detect the contributing factors that cause such maintenance failure and eliminate them. In this study, by analyzing factors contributing to system failure using the Maintenance Error Decision Aid (MEDA) model based on stochastic relations between the contribution factors, system failure and events, we will draw a improvement plan to aircraft maintenance defects.

Risk Evaluation Based on the Time Dependent Expected Loss Model in FMEA (FMEA에서 시간을 고려한 기대손실모형에 기초한 위험 평가)

  • Kwon, Hyuck-Moo;Hong, Sung-Hoon;Lee, Min-Koo;Sutrisno, Agung
    • Journal of the Korean Society of Safety
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    • v.26 no.6
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    • pp.104-110
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    • 2011
  • In FMEA, the risk priority number(RPN) is used for risk evaluation on each failure mode. It is obtained by multiplying three components, i.e., severity, occurrence, and detectability of the corresponding failure mode. Each of the three components are usually determined on the basis of the past experience and technical knowledge. But this approach is not strictly objective in evaluating risk of a given failure mode and thus provide somewhat less scientific measure of risk. Assuming a homogeneous Poisson process for occurrence of the failures and causes, we propose a more scientific approach to evaluation of risk in FMEA. To quantify severity of each failure mode, the mission period is taken into consideration for the system. If the system faces no failure during its mission period, there are no losses. If any failure occurs during its mission period, the losses corresponding to the failure mode incurs. A longer remaining mission period is assumed to incur a larger loss. Detectability of each failure mode is then incorporated into the model assuming an exponential probability law for detection time of each failure cause. Based on the proposed model, an illustrative example and numerical analyses are provided.

Stability Evaluation of Progressive Failure Slope in Biotite Granite Area of Andong (안동 흑운모화강암 지역의 진행성 파괴사면 안정성 평가)

  • Baek, Seung-Cheol
    • Journal of the Korean Society of Safety
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    • v.15 no.2
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    • pp.103-110
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    • 2000
  • This paper deal with the stability evaluation and suggestion of progressive failure slope in biotite granite area of Andong. Based on geological site investigation and field test, stability analysis of slope was performed in conjunction with limit equilibrium methods and stereographic projection. Additionally, initial design and construction procedure was critically evaluated. Series of the slope stability analysis reveals the detection of local wedge and plane failure under the current slope condition. It is additionally appeared that a certain synthetic behavior of circle and plane failure exists on the right spot where the overall failure's going in progress. In order to construct more stable slope based on the suitability for the real state of the slope circumstances, this study issues a solution to eliminate the primary factors which cause the instability, by means of the grade of weathering and RMR classification of rock mass.

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Analysis for Prevention of Spragging in the Turbine Bearings (Spragging 에 의한 터빈 베어링의 손상 및 방지 대책)

  • 하현천;양승헌
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 1999.11a
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    • pp.174-178
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    • 1999
  • This paper describes an investigation on bearing failure due to spragging that has been continuously occurred in turbine hearings. The spragging is defined as the damage found on the leading edge of unloaded pads in the tilting pad journal bearing, In general, the damage mechanism by spragging is classified into fatifgue failure, The principle cause of spragging could be thought as the self-excited vibration by the absence of a stable static equilibrium position of upper pads with no preload. Because of serious consequences of system breakdowns due to bearing failures, determination ar the causes of failure and effective method for countermeasures are very important. This paper describes both the causes of spragging and countermeasures for prevention of such failure, which are taken place in the electric power plants.

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Reliability Estimation of Ball Grid Array 63Sn-37Pb Solder Joint (Ball Grid Array 63Sn-37Pb Solder joint 의 건전성 평가)

  • 명노훈;이억섭;김동혁
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.10a
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    • pp.630-633
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    • 2004
  • Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and BGA solder joint s failure. The first order Taylor series expansion of the limit state function incorporating with thermal fatigue models is used in order to estimate the failure probability of solder joints under heated condition. A model based on plastic-strain rate such as the Coffin-Manson Fatigue Model is utilized in this study. The effects of random variables such as frequency, maximum temperature, and temperature variations on the failure probability of the BGA solder joint are systematically investigated by using a failure probability model with the first order reliability method(FORM).

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Design and Implementation of High-availability System (임무컴퓨터를 위한 고가용 시스템의 설계 및 구현)

  • Jeong, Jae-Yeop;Lee, Cheol-Hoon
    • Proceedings of the Korea Contents Association Conference
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    • 2008.05a
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    • pp.529-533
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    • 2008
  • Mission Computer performs important role both managing a whole system and dealing with a specific mission in avionics system. In general, the fault of SPOF(Single Point Of Failure) in unity system can lead to failure of whole system. It can cause a failure of a mission and also can threaten to the life of the pilot. So, in this paper, we design the HA(High-availability) system so that dealing with the failure. And we use HA software like Heartbeat, Fake, DRBD and Bonding to managing HA system.

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