• Proceedings of the KSME Conference
• /
• 2001.06d
• /
• pp.252-259
• /
• 2001

It is derived for the temperature profile in a cylindrical and planar shape capillary pumped loop evaporators subject to a uniform heat flux prior to the initiation of boiling using the finite difference method. The results of the analysis allow for the determination of applied power levels for which nucleation is likely to occur only within the vapor grooves of the evaporator while maintaining subcooling in the liquid core, thereby increasing the likelihood of a successful startup. Also, limits are found for which additional increases in the applied heat flux do not increase the temperature difference between the vapor grooves and the wick-liquid core interface. Several advantages of larger diameter evaporators observed experimentally in startup are explained and quantified by the model. This analysis is appropriate for standard capillary pumped loop evaporators during a fully-flooded startup as well as starter pump designs and loop heat pipes.

• Solar Energy
• /
• v.19 no.2
• /
• pp.21-28
• /
• 1999

This study was carried out to investigate the effect of energy transport using capillary pumped loop with PVA sponge wick. The results obtained from this study are as follows. The configuration of capillary pumped loop was adequate and PVA sponge was of great use for the manufacture of capillary pump. The energy transport reached maximum when the working fluid amount was 750cc the wall temperature distribution indicated high values through out the entire length of the pipe. As the opening of a nozzle was increased, energy transport was increased but the effect was decreased.

• Proceedings of the KSME Conference
• /
• 2005.11a
• /
• pp.4.2-4.2
• /
• 2005

• Proceedings of the SAREK Conference
• /
• 2005.11a
• /
• pp.329-334
• /
• 2005

As more high power wide band gap devices are being utilized. the thermal management issues associated with these devices need to be resolved. High power small devices dissipate excessive heat that must be cooled, but traditional cooling methods are insufficient to provide such a cooling means. This paper will evaluate a micro-capillary pumped loop thermal management system that is incorporated into the shim of the device, taking advantage of phase-change to increase the thermal conductivity of the system. The results of the modeling of the thermal management system will be discussed.

• Proceedings of the KSME Conference
• /
• 2005.11a
• /
• pp.16.2-16.2
• /
• 2005

• Journal of Mechanical Science and Technology
• /
• v.14 no.1
• /
• pp.121-129
• /
• 2000

The thermal performance of a flat evaporator for capillary pumped loop (CPL) applications was investigated. Two to four layers of coarse wire screen wicks were placed onto the heated surface to provide irregular passages for vapor flow. The evaporator and condenser were separated by a distance of 1.2 m and connected by individual liquid and vapor lines. The wall material was copper and the working fluid was ethanol. The experimental facility utilized a combination of capillary and gravitational forces for liquid return, and distribution over the evaporator surface. The tubing used for vapor and liquid lines was 9.35 mm or less in diameter and heat was removed from the condenser by convection of air. A heat flux of up to $4.9{\times}10^4$ $W/m^2$ was applied to a flat evaporator having dimensions of 100 mm by 200 mm, 20 mm thick. The thermal resistance of the system as well as the temperature characteristics of the system was investigated as the evaporator heat flux and the condenser cooling capacity varied. The performance of the evaporator and effect of condenser cooling capacity were analyzed and discussed.

• Proceedings of the KIEE Conference
• /
• 2001.07c
• /
• pp.1881-1883
• /
• 2001

We manufactured a micro CPL by LlGA process, a new conceptual ultra-fine and precise forming method, using X-ray lithography process. We fabricated a BN X-ray mask having properties of good X-ray transmittance and large mechanical strength. Micro CPL was manufactured by dividing into an upper plate and a low plate. Each of plates was bonded by Ag paste screen printing. The upper plate was fabricated on glass wafer to observe flow and phase transformation of cooling solution. The lower plate was manufactured by Cu electroplating for good heat transmission. Precision of inner Parts, micro pin and micro channel, of manufactured micro CPL is under ${\pm}2{\mu}m$.

• Proceedings of the KSME Conference
• /
• 2008.11b
• /
• pp.2033-2038
• /
• 2008

The CPLs(capillary pumped loops) are two phase heat transfer devices which enable active control of operating temperature of heat absorbing elements(or evaporators). Although the CPLs gain increasing interests as promising heat transfer devices for future missions such as spacecraft and commercial applications, their intrinsic complexity in operating principles makes the widespread use of these devices difficult. The key element and main cause of this complexity in operating principles is the two phase hydrodynamic accumulator or reservoir which controls the saturation state of the remaining loop and, particularly for the CPLs, it is separated from the evaporator. Thus, in this study, the operating characteristics of the CPL is investigated experimentally and theoretically. Mainly focusing on the role of reservoir the thermodynamic operating principle is examined first and the experimentally obtained steady state and transient state operating characteristics are discussed in detail.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
• /
• 2002.05a
• /
• pp.97-105
• /
• 2002

최근 5년 사이의 급속한 정보통신의 발전과 전자소자의 고집적화, 소형화는 전자장비 내부의 열부하 증가를 초래하고 있다. 이에 효과적으로 열을 제거하는 기술개발 요구로 다양한 이상 열전달 시스템(two-phase systems)이 연구되고 있다. CPL(Capillary Pumped Loop) 기술은 1960년대 미국, 구소련에서 우주항공분야의 전자장비 온도제어 시스템으로 주로 통신위성 또는 우주선의 전자장비 냉각기술의 한 방법으로 사용되어 왔으며 NASA Lewis Research Center의 Stenger에 의해 처음 제안되었다.(중략)

• Proceedings of the KSME Conference
• /
• 2004.11a
• /
• pp.1241-1246
• /
• 2004

The heat flux on a chip is rapidly increasing with decreasing the size of one. It is necessary to properly cool the high heat flux chip. One of the promising cooling methods is to apply CPL heat pipes with porous materials, for example PVA, polyethylene, and powder sintered metal plate and with microchannels in the evaporator. A small scale CPL heat pipe with PVA as wick was designed and manufactured. Since the height difference between the evaporator and the condenser is a crucial parameter in the CPL heat pipes, the performance of the heat pipes depending on the parameter was investigated. The parameter is higher the performance is better. However, the improvement rate of the performance does not increase the increase rate of the height. In addition to, the parameter effect depending on heat input was investigated.